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Category:H01L23/532
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Pages in category "H01L23/532"
The following 200 pages are in this category, out of 202 total.
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- 17412622. DOUBLE-SIDED STACKED DTC STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17446405. RESISTOR WITHIN A VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17454378. DAMASCENE INTERCONNECT SPACER TO FACILITATE GAP FILL simplified abstract (International Business Machines Corporation)
- 17456016. ANTI-FUSE WITH LATERALLY EXTENDED LINER simplified abstract (International Business Machines Corporation)
- 17457444. TOP VIA WITH PROTECTIVE LINER simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17459799. CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461231. STRUCTURE AND METHOD FOR MULTIPLE BEOL K-VALUE DIELECTRIC simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17524107. INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETCH PROCESSING simplified abstract (International Business Machines Corporation)
- 17530971. SELECTIVE METAL RESIDUE AND LINER CLEANSE FOR POST-SUBTRACTIVE ETCH simplified abstract (International Business Machines Corporation)
- 17546682. BARRIER LINER FREE INTERFACE FOR METAL VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17548773. DUAL-METAL ULTRA THICK METAL (UTM) STRUCTURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17551457. MEMORY CELL IN WAFER BACKSIDE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17589575. METHOD OF OVERLAY MEASUREMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17591144. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17592629. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17643395. ADVANCED METAL INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17643408. ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17643434. TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17644448. Method to Produce Buried Nb Lines Surrounded by Ti simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17651990. Forming Dielectric Film With High Resistance to Tilting simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17662301. SEMICONDUCTOR DEVICE INCLUDING MULTI-CAPPING LAYER AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17679234. INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17699496. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17725722. Forming Silicon-Containing Material Over Metal Gate To Reduce Loading Between Long Channel And Short Channel Transistors simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17743849. Semiconductor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17806570. HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17812141. MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE REGIONS OF STEP TREADS, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17816505. TECHNIQUES FOR CONCURRENTLY-FORMED CAVITIES IN THREE-DIMENSIONAL MEMORY ARRAYS simplified abstract (Micron Technology, Inc.)
- 17819538. ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17822726. MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17834940. SEMICONDUCTOR DEVICE WITH COMPOSITE CONTACT STRUCTURE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17835924. GRAPHENE-METAL HYBRID INTERCONNECT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836781. SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17837664. GRAPHENE-CLAD METAL INTERCONNECT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17839447. SEMICONDUCTOR DEVICE INCLUDING DIELECTRICS MADE OF POROUS ORGANIC FRAMEWORKS, AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17862987. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17866917. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17875625. SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17877350. INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17877387. INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17884817. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17893770. SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17893966. SEMICONDUCTOR MEMORIES INCLUDING EDGE MATS HAVING FOLDED DIGIT LINES simplified abstract (Micron Technology, Inc.)
- 17895286. Conductive Via With Improved Gap Filling Performance simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17897876. SKIP VIA WITH LOCALIZED SPACER simplified abstract (International Business Machines Corporation)
- 17899586. SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 17900151. LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17931767. INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE TYPES OF BACKSIDE TO FRONTSIDE VIAS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17933000. INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER simplified abstract (Intel Corporation)
- 17937360. METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17944343. Memory Circuitry And Method Used In Forming Memory Circuitry simplified abstract (Micron Technology, Inc.)
- 17951474. INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17955803. LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE simplified abstract (International Business Machines Corporation)
- 17956334. MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER simplified abstract (International Business Machines Corporation)
- 17958040. SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17958283. ULTRA-THIN SEMI-METALS FOR LOW TEMPERATURE CONDUCTION simplified abstract (Intel Corporation)
- 17958284. INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS simplified abstract (Intel Corporation)
- 17963062. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 17972923. COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (Intel Corporation)
- 18047412. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18062502. METHOD OF FORMING LOW-RESISTIVITY RU ALD THROUGH A BI-LAYER PROCESS AND RELATED STRUCTURES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18065799. NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18085871. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18095080. SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.)
- 18097418. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18134966. POWER MODULE simplified abstract (Hyundai Motor Company)
- 18134966. POWER MODULE simplified abstract (Kia Corporation)
- 18154540. SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18170933. ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18209820. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18217724. SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18219244. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18232894. INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18237174. SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION simplified abstract (Micron Technology, Inc.)
- 18296056. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18307109. INTERCONNECTION STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18310300. METAL WIRING OF SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18330672. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18366814. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18367292. GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18373392. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18446827. VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTICAL SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18447539. CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18456927. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491711. MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18504136. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18504901. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18512139. SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO INCREASE RELIABILITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515130. SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515536. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18516373. HYBRID CONDUCTIVE STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18518081. Metal Contact Structure and Method of Forming the Same in a Semiconductor Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519516. SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519862. CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18524627. FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18535623. INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES simplified abstract (Intel Corporation)
B
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 7th, 2024
I
- Intel corporation (20240105520). TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240105588). INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE simplified abstract
- Intel corporation (20240105597). DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240105598). DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
- Intel corporation (20240105635). SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS simplified abstract
- Intel corporation (20240112952). INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES simplified abstract
- Intel corporation (20240113025). ULTRA-THIN SEMI-METALS FOR LOW TEMPERATURE CONDUCTION simplified abstract
- Intel corporation (20240113027). INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS simplified abstract
- Intel corporation (20240136243). COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on February 29th, 2024
- INTEL CORPORATION patent applications on February 8th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 28th, 2024
- International business machines corporation (20240105590). STACKED FET CONTACT FORMATION simplified abstract
- International business machines corporation (20240105620). INTERCONNECT WITH DISCONNECTED LINER AND METAL CAP simplified abstract
- International business machines corporation (20240113018). LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE simplified abstract
- International business machines corporation (20240113024). MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER simplified abstract
- International Business Machines Corporation patent applications on April 4th, 2024
- International Business Machines Corporation patent applications on February 29th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 28th, 2024
M
S
- Samsung electronics co., ltd. (20240096796). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240096797). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128171). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. patent applications on January 25th, 2024
- Sk hynix inc. (20240120275). METAL WIRING OF SEMICONDUCTOR DEVICE simplified abstract
- SK hynix Inc. patent applications on April 11th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096697). CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096998). HYBRID CONDUCTIVE STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240099005). FLASH MEMORY STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240136221). INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136291). LOW-STRESS PASSIVATION LAYER simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Texas instruments incorporated (20240113042). SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
U
- US Patent Application 17751976. DIELECTRIC SILICON NITRIDE BARRIER DEPOSITION PROCESS FOR IMPROVED METAL LEAKAGE AND ADHESION simplified abstract
- US Patent Application 17819679. Semiconductor Devices Including Backside Power Via and Methods of Forming the Same simplified abstract
- US Patent Application 17825345. INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS simplified abstract
- US Patent Application 18167024. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract
- US Patent Application 18201995. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18231254. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE simplified abstract
- US Patent Application 18232718. Contact Structure For Semiconductor Device simplified abstract
- US Patent Application 18232722. Liner-Free Conductive Structures With Anchor Points simplified abstract
- US Patent Application 18232833. METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER simplified abstract
- US Patent Application 18232937. METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR GAP simplified abstract
- US Patent Application 18351226. INTERLAYER DIELECTRIC LAYER simplified abstract
- US Patent Application 18359036. Conductive Feature Formation and Structure simplified abstract
- US Patent Application 18359122. CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18359383. GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE simplified abstract
- US Patent Application 18359414. SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18359486. Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices simplified abstract
- US Patent Application 18360012. INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT simplified abstract
- US Patent Application 18360617. FINFET STRUCTURE WITH CONTROLLED AIR GAPS simplified abstract
- US Patent Application 18361560. REDUCING RC DELAY IN SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18362083. Method of Fabricating Redistribution Circuit Structure simplified abstract
- US Patent Application 18362248. ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES simplified abstract
- US Patent Application 18362739. SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract
- US Patent Application 18362797. IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION simplified abstract
- US Patent Application 18362839. SEMICONDUCTOR DEVICE INCLUDING STANDARD-CELL-ADAPTED POWER GRID ARRANGEMENT simplified abstract
- US Patent Application 18362968. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18363515. SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18363692. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18363865. DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO INCREASE STABILITY simplified abstract
- US Patent Application 18363987. METAL NITRIDE DIFFUSION BARRIER AND METHODS OF FORMATION simplified abstract
- US Patent Application 18365490. SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18366831. LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE simplified abstract
- US Patent Application 18446183. Semiconductor Device with Air Gaps and Method of Fabrication Thereof simplified abstract
- US Patent Application 18446591. SEMICONDUCTOR DEVICE AND METHOD simplified abstract