US Patent Application 18362797. IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION simplified abstract
IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Hsun-Chung Kuang of Hsinchu (TW)
IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18362797 titled 'IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION
Simplified Explanation
The patent application describes a semiconductor structure that uses a self-assembled monolayer to improve the adhesion between metal and dielectric materials, as well as prevent metal diffusion.
- The semiconductor structure includes a substrate and a first dielectric layer on top of it.
- Embedded within the first dielectric layer is a contact structure, which contains a conductive line.
- A self-assembled monolayer is applied onto the conductive line, forming a chemical bond with both the conductive line and a second dielectric layer.
- The second dielectric layer is also present on top of the first dielectric layer and the conductive line.
- The self-assembled monolayer enhances the adhesion between the conductive line and the second dielectric layer, preventing any metal diffusion.
Original Abstract Submitted
A semiconductor structure including a self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusion is provided. The semiconductor structure includes a substrate and a first dielectric layer on the substrate. A contact structure is embedded in the first dielectric layer and includes a conductive line. The semiconductor structure further includes a self-assembled monolayer on the conductive line, and a second dielectric layer on the first dielectric layer and the conductive line. The self-assembled monolayer is chemically bonded to the conductive line and the second dielectric layer.
