17955803. LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE simplified abstract (International Business Machines Corporation)

LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE

Organization Name

International Business Machines Corporation

Inventor(s)

Oscar Van Der Straten of Guilderland Center NY (US)

Koichi Motoyama of Clifton Park NY (US)

Scott A. Devries of Albany NY (US)

Chih-Chao Yang of Glenmont NY (US)

LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17955803 titled 'LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE

Simplified Explanation

The patent application describes a wire interconnect structure with locally widened profiles, including portions of varying widths stacked on top of each other.

• The wire interconnect includes a first portion with a certain width.
• A second portion of the wire interconnect has a greater width than the first portion and is positioned above it.
• A third portion of the wire interconnect has a width less than the second portion and is positioned above the second portion.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as integrated circuits and microprocessors, where precise and efficient wire interconnect structures are needed.

Problems Solved

This innovation solves the problem of optimizing wire interconnect structures to improve signal transmission and reduce signal interference in electronic devices.

Benefits

The locally widened profiles of the wire interconnect structure allow for better signal transmission, reduced signal interference, and overall improved performance of electronic devices.

Potential Commercial Applications

• "Enhancing Signal Transmission in Electronic Devices with Locally Widened Wire Interconnect Profiles"

Possible Prior Art

There may be prior art related to wire interconnect structures with varying widths, but further research is needed to identify specific examples.

How does this technology compare to existing wire interconnect structures in terms of signal transmission efficiency?

This article does not provide a direct comparison between this technology and existing wire interconnect structures in terms of signal transmission efficiency. Further research or testing may be needed to determine the effectiveness of this innovation in comparison to current solutions.

What are the potential limitations or challenges in implementing wire interconnect structures with locally widened profiles in mass production?

This article does not address the potential limitations or challenges in implementing this technology in mass production. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations that are not covered in the provided information.

Original Abstract Submitted

A wire interconnect, a wire interconnect structure, and a method to form wire interconnect structures with locally widened profiles. The wire interconnect may include a first portion of the wire interconnect with a first width. The wire interconnect may also include a second portion of the wire interconnect with a second width, where the second width is greater than the first width, and where the second portion of the wire interconnect is above the first portion of the wire interconnect. The wire interconnect may also include a third portion of the wire interconnect with a third width, where the third width is less than the second width, and where the third portion of the wire interconnect is above the second portion of the wire interconnect.