SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on March 14th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 168 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H10B80/00 (13), H10B43/27 (12), H01L23/00 (12), H01L24/16 (11), H01L25/065 (11)
With keywords such as: device, configured, including, based, semiconductor, layer, data, surface, direction, and signal in patent application abstracts.
See the following report for SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024: SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Jihwan CHUN of Suwon-si (KR) for samsung electronics co., ltd., Hangyu HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jiwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungchang BAEK of Suwon-si (KR) for samsung electronics co., ltd., Changhyeok SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sungho CHO of Suwon-si (KR) for samsung electronics co., ltd., Minwoo YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A45C11/00, H04B1/3888
Abstract: a case includes a base plate, a hole formed through the base plate, a pattern that is on one surface of the base plate and includes a plurality of crests and a plurality of troughs. the case further includes an inclined area that is between the hole and the pattern, and at least one step that is between the inclined area and the hole, in which a first angle that the inclined area forms with a central axis of the hole is greater than a second angle that is an angle of view through the hole.
Inventor(s): Seehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeoncheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunju LEE of Suwon-si (KR) for samsung electronics co., ltd., Kihwan KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyunho LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungryong CHA of Suwon-si (KR) for samsung electronics co., ltd., Ingyu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/14, A47L9/00, A47L9/28
Abstract: a cleaning apparatus includes a cleaner including a dust container in which contaminants are collected and a dust container cover rotatably coupled to the dust container to open or close the dust container, and a docking station on which the cleaner is detachably mounted, the docking station including a collecting portion to collect the contaminants in the dust container in response to the mounting and a duct portion forming a channel to guide the contaminants in the dust container to the collecting portion in response to the mounting; a cover opening device configured to open the dust container cover, and a cover closing device configured to close the dust container cover, the cover closing device including a rotary lever configured to be movable between a first position forming a portion of the channel of the duct portion and a second position supporting the dust container cover in a closing direction.
Inventor(s): Chang Soon PARK of Suwon-si (KR) for samsung electronics co., ltd., Ui Kum Kwon of Suwon-si (KR) for samsung electronics co., ltd., Young Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Hye Rim Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/021, A61B5/00, A61B5/024
Abstract: an apparatus for non-invasively estimating bio-information and a method of determining whether a bio-signal is normal by the apparatus for estimating bio-information are provided. the apparatus for estimating bio-information according to an embodiment of the disclosure includes: a photoplethysmogram (ppg) sensor configured to measure a ppg signal from an object; and a processor configured to extract a plurality of pairs of local maximum points and local minimum points from a second derivative signal of the ppg signal, to select at least one reference pair from among the extracted plurality of pairs, and to determine whether the ppg signal is normal based on the selected at least one reference pair.
20240082101.MASSAGE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taeseob LIM of Suwon-si (KR) for samsung electronics co., ltd., Taeduk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hohyun RYU of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiho JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H9/00
Abstract: provided is a massage apparatus comprising: a base frame comprising a seat portion, a back rest portion obliquely extending from the seat portion, and arm rest portions provided on both sides of the seat portion; a massage module coupled to a rear side of the back rest portion and configured to provide a massage to a user; air cells disposed in the arm rest portions and providing a massage to the user by expanding as air is introduced into the air cells; a compressor disposed below the seat portion and configured to discharge compressed air; and a duct providing a first flow path guiding air introduced into an inlet to the air cells, and a second flow path guiding air introduced into the inlet to the seat portion and the back rest portion. a valve, ambient sensors, and a processor direct the compressor to discharge air based on ambient conditions.
20240082103.MASSAGE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunggyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Taein EOM of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiho JEONG of Suwon-si (KR) for samsung electronics co., ltd., Daesung KI of Suwon-si (KR) for samsung electronics co., ltd., Taeseob LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H15/00
Abstract: provided is a massage apparatus including: a module drive motor; a module motion shaft provided to rotate by a driving force of the module drive motor; a motion guider provided to move in an extension direction of the module motion shaft as the module motion shaft rotates; a tilt drive motor; a tilt drive shaft arranged in parallel with the module motion shaft, and provided to rotate by a driving force of the tilt drive motor; a rotation axis tilting member coupled to the tilt drive shaft to rotate together with the tilt drive shaft, the rotation axis tilting member including a tilting portion having a rotation axis inclined with respect to the tilt drive shaft; and a roller bracket rotatably supporting a massage roller and connected to the motion guider and the rotation axis tilting member.
Inventor(s): Bonggil BAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63F13/35, A63F13/335, G06F3/16, G06T7/11
Abstract: an electronic apparatus including a communication interface; a memory storing one or more instructions; and a processor configured to execute the instructions to control a display to display content received from a server through the communication interface, obtain a control signal corresponding to a user input for controlling the content displayed, transmit the obtained control signal to the server through the communication interface; obtain an image output control signal corresponding to the obtained control signal while transmitting the obtained control signal to the server, process the content displayed based on the obtained image output control signal, control the display to display the content that was processed based on the obtained image output control signal while awaiting content processed by the server based on the transmitted obtained control signal, receive the content processed by the server, and control the display to display the received content processed by the server.
Inventor(s): Donghoon KWON of Swon-si (KR) for samsung electronics co., ltd., Juhyun LEE of Swon-si (KR) for samsung electronics co., ltd., Chungki MIN of Swon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B08B1/00, B08B1/02, B08B3/02, B08B3/08, B24B53/017, H01L21/02
Abstract: a substrate cleaning device may include a first roll member and a second roll member including a copolymer of a first water-soluble polymer and a second water-soluble polymer. the first roll member may include a first roll body extending in a first direction and first protrusions on a surface of the first roll body. the second roll member may include a second roll body extending in the first direction and second protrusions on a surface of the second roll body.
Inventor(s): Sungmin CHO of Suwon-si (KR) for samsung electronics co., ltd., Yurim PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Sangjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungtae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungsoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Suhyeon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B21D53/06, B21D9/04
Abstract: an apparatus for manufacturing a heat exchanger including a refrigerant tube, the apparatus including a moving rod movable along a first direction; and a tube expansion body connected to the moving rod to be linearly movable along the first direction, the tube expansion body insertable into a tube base material of the refrigerant tub such that the tube base material is expanded outward when the tube expansion body is inserted into the tube base material of the refrigerant tube, wherein the tube expansion body includes a plurality of groove forming protrusions formed on an outer surface of the tube expansion body so as to extend along a direction inclined with respect to the first direction, the groove forming protrusions form a plurality of grooves on an inner surface of the tube base material, when the tube expansion body is moved to be inserted into the tube base material.
20240083033.ROBOT AND CONTROL METHOD THEREOF_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeontaek LIM of Suwon-si (KR) for samsung electronics co., ltd., Saeyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongkook KIM of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J19/02, G06V20/50, G06V40/10, G10L15/22, H04R1/02, H04R1/40, H04R3/00
Abstract: a robot includes: a light detection and ranging (lidar) sensor; a plurality of directional microphones; and at least one processor configured to: identify, based on sensing data obtained through the lidar sensor, an object in a vicinity of the robot, identify, based on the type of the object, a weight to apply to an audio signal received through a directional microphone corresponding to a location of the object from among the plurality of directional microphones, obtain context information of the robot based on the sensing data, identify, based on the context information, a pre-processing model corresponding to each directional microphone of the plurality of directional microphones, apply the weight to an audio signal received through the directional microphone corresponding to the location of the object among a plurality of audio signals received through the plurality of directional microphones, obtain a plurality of pre-processed audio signals by inputting the audio signal to which the weight has been applied, and the remaining audio signals into the pre-processing model corresponding to the respective directional microphone , and perform voice recognition based on the plurality of pre-processed audio signals.
Inventor(s): Jongduk Suh of Suwon-si (KR) for samsung electronics co., ltd., Younghak Ko of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J11/00, B65G47/90
Abstract: a method of controlling a substrate processing device includes aligning a door opener with a front side of a door, wherein the door has closed an entrance of a substrate carrier, coupling the door opener to the door, detaching the door from the substrate carrier after the coupling of the door opener to the door, lowering the door opener coupled to the door and exposing the entrance of the substrate carrier, taking out one of a plurality of substrates from the substrate carrier, aligning the door opener coupled to the door to be adjacent to a front side of the entrance of the substrate carrier, the door coupled with the door opener being inclined at an inclination angle with respect to the entrance, lowering the door opener coupled to the door in a second direction perpendicular to the first direction, and taking another substrate out of the substrate carrier.
Inventor(s): Seongil HAHM of Suwon-si (KR) for samsung electronics co., ltd., Kanghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyun WOO of Suwon-si (KR) for samsung electronics co., ltd., Sangwon AHN of Suwon-si (KR) for samsung electronics co., ltd., Junhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk BANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/18, D06F34/10, D06F39/08
Abstract: a washing machine according to an embodiment comprises: a drum; a motor configured to rotate the drum; a motor driver comprising circuitry configured to a drive current to the motor; a current sensor configured to sense the drive current; a water supplier comprising a conduit configured to supply water to the drum; and at least one controller, wherein one or more of the at least one processor is configured to control the water supplier to perform a plurality of water supply processes, and control the motor driver to perform a plurality of material detection processes, wherein one or more of the at least one controller is configured to: in response to one water supply process from among the plurality of water supply processes, one material detection process from among the plurality of material detection processes, generate a plurality of pieces of input data based on a value of the drive current detected during the plurality of material detection processes, and determine the material of laundry accommodated in the drum, on the basis of the plurality of pieces of input data.
20240084493.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Baek Gyu KWON of Suwon-si (KR) for samsung electronics co., ltd., Dong-Won KIM of Suwon-si (KR) for samsung electronics co., ltd., Do Yun LEE of Yongin-si (KR) for samsung electronics co., ltd., Bo-Kyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Geon Ho LEE of Incheon (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/22, D06F21/04, D06F21/08, D06F37/20, D06F37/26
Abstract: a washing machine including a plurality of washers may include a fixing bracket coupled to a front of a first housing in which a first tub is disposed and a front of a second housing in which a second tub is disposed, to prevent the first housing and the second housing from being separated from each other.
20240084494.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongbin LIM of Suwon-si (KR) for samsung electronics co., ltd., Seungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye LEE of Suwon-si (KR) for samsung electronics co., ltd., Yurim PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/30, D06F21/06, F16H1/28, F16H57/00
Abstract: a washing machine includes a tub, a drum, a pulsator, a motor assembly, including a rotor, to supply a driving force, a reduction gear module couplable to the rotor of the motor assembly so that a portion of the reduction gear module is rotatable at an angular velocity less than an angular velocity at which the rotor is rotated, a washing shaft couplable to the pulsator and the portion of the reduction gear module so that the pulsator is rotatable at an angular velocity less than the angular velocity at which the rotor is rotated, a spin-drying shaft couplable to the drum, and a coupler configured to be couplable to the spin-drying shaft and the rotor so that the spin-drying shaft is rotatable at the angular velocity at which the rotor is rotated, where the coupler includes a coupler body having a receiving space to receive the reduction gear module.
20240084500.DESICCANT-BASED LAUNDRY DRYERS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Guolian Wu of Saint Joseph MI (US) for samsung electronics co., ltd., Raveendran Vaidhyanathan of Rockaway NJ (US) for samsung electronics co., ltd.
IPC Code(s): D06F58/20, B01D53/04, D06F39/04, D06F58/24, D06F58/26
Abstract: an apparatus includes a dryer having a dryer drum configured to receive laundry items to be dried during a drying cycle. the apparatus also includes a desiccant reservoir having a desiccant configured to remove moisture in air from the dryer drum during the drying cycle. the apparatus further includes a heat pump configured to regenerate the desiccant in the desiccant reservoir for use during a subsequent drying cycle. the heat pump includes a condenser configured to condense a refrigerant, an evaporator configured to evaporate the condensed refrigerant, and a compressor configured to compress the evaporated refrigerant and provide the compressed refrigerant to the condenser.
20240084501.CLOTHES CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donggi HAN of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F73/02
Abstract: a clothes care apparatus including a main body having a care compartment with an exhaust port and a supply port; a heat exchanger in the main body; a blowing fan in the main body to generate airflow supplied to the care compartment through the supply port; an exhaust flow path to guide airflow from the exhaust port to pass through the heat exchanger; a circulation flow path to guide airflow from the exhaust flow path to the fan; a bypass opening to connect the care compartment and the circulation flow path; and a bypass door to open and close the bypass opening. when the bypass opening is open, at least a portion of the airflow flows directly into the circulation flow path without passing through the exhaust flow path. when the bypass opening is closed, none of the airflow flows directly from the care compartment into the circulation flow path.
20240084956.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanggoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunggi KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F16M11/20, F16M11/10, F16M11/24
Abstract: provided is a display apparatus including a display, a support arm coupled to a rear surface of the display, and a support stand coupled to the support arm and configured to move the support arm along a vertical direction where the display is pivotally rotatable between a first orientation in which a long side of the display is laterally disposed and a second orientation in which the long side of the display is longitudinally disposed. the support stand is configured to upwardly move the display based on the display being rotated from the first orientation to the second orientation, and downwardly move the display based on the display being rotated from the second orientation to the first orientation.
20240085030.COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Changhoon OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C15/20
Abstract: a cooktop including an upper plate on which to place a cooking vessel, and a suction port penetrating through the upper plate in a first direction; a duct; a chamber to connect the suction port and the duct; and a blower fan connected to the duct to generate airflow so that air around the upper plate is suctioned through the suction port and then through the chamber and then guided by the duct, wherein the chamber include a chamber body includes a chamber outlet arranged in a second direction perpendicular to the first direction and configured to communicate with the duct, and an inner space formed so that air suctioned through the suction port flows through the inner space to the chamber outlet, and a guide rib arranged inside the chamber body to partition the inner space to guide the air suctioned through the suction port to the chamber outlet.
Inventor(s): Myungsoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyongsoo NOH of Suwon-si (KR) for samsung electronics co., ltd., Myungseob SONG of Suwon-si (KR) for samsung electronics co., ltd., Kyuho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Joonoh SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F8/192, B03C3/09, B03C3/36, B03C3/41, F24F1/0353, F24F8/30
Abstract: an air conditioner including a housing including a suction panel; a fan disposed inside the housing and configured to generate an air flow which is sucked into the housing through the suction panel to flow in a first direction from upstream to downstream, the suction panel being perpendicular to the first direction; and an electrostatic precipitator disposed inside the housing and including a discharge electrode configured to receive a voltage and to generate ions toward the suction panel, and an upstream electrode disposed upstream of the discharge electrode with respect to the first direction, grounded to form an electric field with the discharge electrode, and disposed between the discharge electrode and the suction panel, wherein at least a portion of the ions generated from the discharge electrode are passed through the suction panel so as to charge aerosols in air outside the housing.
20240085040.AIR CLEANER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Euysung CHU of Suwon-si (KR) for samsung electronics co., ltd., Taeyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngseok LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F8/22, F24F13/28
Abstract: an air cleaner including a first housing including a first suction port and a first discharge port; a first flow path extending from the first suction port to the first discharge port; a first fan and a dust collector filter in the first flow path; a second housing including a second suction port and a second discharge port; a second flow path extending from the second suction port to the second discharge port; a second fan in the second flow path; a light source in the second flow path to radiate ultraviolet rays; and a connection flow path extending from at least a first portion of the first discharge port to the second suction port and configured so that at least a first portion of air discharged from the first discharge port flows into the connection flow path and to the second flow path through the second suction port.
Inventor(s): Munsub KIM of Suwon-si (KR) for samsung electronics co., ltd., Duhan JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F13/32, F24F1/0057, F24F1/32, F24F1/62
Abstract: a window type air conditioner including an outdoor module including a compressor, an outdoor heat exchanger, and an outdoor housing; an indoor module including an indoor heat exchanger, and an indoor housing spaced apart from the outdoor housing; a refrigerant pipe through which refrigerant moves between the indoor and the outdoor module; and a connection support module including a first connection rod having an inner circumferential surface, and a sealing member inside the first connection rod, wherein the connection support module connects, and supports a positional relationship between, the indoor and the outdoor module, the refrigerant pipe extends through the first connection rod so that an inner circumferential surface of the first connection rod is spaced apart from an outer circumferential surface of the refrigerant pipe, and the sealing member is arranged to form a seal between the refrigerant pipe and the first connection rod.
20240085094.REFRIGERATOR AND HOME APPLIANCE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chomin LEE of Suwon-si (KR) for samsung electronics co., ltd., Yang-Yeol GU of Suwon-si (KR) for samsung electronics co., ltd., Dongyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Byoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonghan KIM of Suwon-si (KR) for samsung electronics co., ltd., Taecheol PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongman SEO of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Yountae SHIN of Suwon-si (KR) for samsung electronics co., ltd., Byungkwan YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02, F25C5/20, F25D23/12
Abstract: a refrigerator including a main body forming a storage compartment, and a door configured to open and close the storage compartment. the door includes a door body rotatably coupled to the main body and including an insulator therein, a panel body positioned in a front of the door body, a first trim disposed at a first edge of the panel body and configured to be coupled to the door body while being rotated with respect to the door body, and a second trim disposed at a second edge opposite to the first edge of the panel body and configured to be coupled to the door body when the first trim is coupled to the door body.
20240085097.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eun Heo of Suwon-si (KR) for samsung electronics co., ltd., Huido Park of Suwon-si (KR) for samsung electronics co., ltd., Kyoungsun Park of Suwon-si (KR) for samsung electronics co., ltd., Jisick Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D25/02, F25D23/02
Abstract: a refrigerator includes a main body; a storage chamber provided in the main body so that a front side of the storage chamber is open; a drawer provided in the storage chamber and configured to be inserted into and withdrawn from the storage chamber, wherein an interior of the drawer forms a storage space; a shelf provided on the drawer, wherein a front surface of the shelf and the drawer are spaced apart by a gap; a cover vertically movably connected to the shelf and configured to cover the gap; and a cover position adjuster contacting the shelf and the cover and configured to adjust an area of the gap by vertically moving the cover.
20240085098.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngmin YOU of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Ilsung BAE of Suwon-si (KR) for samsung electronics co., ltd., Byungkwan YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D27/00, F25D17/06
Abstract: a refrigerator includes an outer case forming the exterior of a main body, an inner case disposed inside the outer case to form a storage compartment, an upper duct including an upper outlet to discharge cold air downward toward the storage compartment, and disposed in the inner case to form an upper flow path to supply cold air to the upper outlet, a rear duct including a rear flow path configured to guide the cold air to the upper flow path, and a rear outlet configured to discharge cold air from the rear flow path into the storage compartment, a light emitting diode (led) module coupled to the upper duct to emit light toward the storage compartment and including a plurality of leds, and a reflective cover disposed on a rear side of the storage compartment to be coupled to the rear duct and reflecting light from the led module.
Inventor(s): Min Chul JO of Suwon-si (KR) for samsung electronics co., ltd., Sang Hyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Su Jin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Gil Ho GU of Suwon-si (KR) for samsung electronics co., ltd., Dae Gon YU of Suwon-si (KR) for samsung electronics co., ltd., So Yeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Yun Bin JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N1/32, B24B7/22
Abstract: there is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. the method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (di) water to an upper surface of a polishing plate through a di water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.
Inventor(s): Yumee KIM of Suwon-si (KR) for samsung electronics co., ltd., Soomin PARK of Seoul (KR) for samsung electronics co., ltd., Jangpyo PARK of Suwon-si (KR) for samsung electronics co., ltd., Joonho KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongwon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/31, D06F43/00
Abstract: a clothes care apparatus includes a main body including a clothes care chamber configured to accommodate one or more clothes items; an optical sensor module configured to photograph an inside of the clothes care chamber, the optical sensor module including a plurality of light receiving elements arranged in an array, each of the plurality of light receiving elements being sensitive to different wavelength bands; and a processor configured to: acquire, from the plurality of light receiving elements, a sensing value for the one or more clothes items accommodated in the clothes care chamber, acquire spectroscopic data for the one or more clothes items accommodated in the clothes care chamber based on the sensing value, acquire feature information corresponding to the one or more clothes items accommodated in the clothes care chamber based on the spectroscopic data, input the feature information into a trained neural network model, acquire, from the trained neural network model, information on materials of the one or more clothes items accommodated in the clothes care chamber, and determine an operation course of the clothes care apparatus based on the information on the materials of the one or more clothes items accommodated in the clothes care chamber.
Inventor(s): Seong Kwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Min Ho KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyung-Sun RYU of Suwon-si (KR) for samsung electronics co., ltd., Cheol Min PARK of Suwon-si (KR) for samsung electronics co., ltd., Jun Yeon WON of Suwon-si (KR) for samsung electronics co., ltd., Jae Moo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/26
Abstract: a transmitting and receiving circuit may include a first cmos inverter configured to receive a first power supply signal and a first input signal. the transmitting and receiving circuit may include a first calculation amplifier including a non-inverted input terminal connected to an output terminal of the first cmos inverter, and a first resistor connected between the output terminal of the first calculation amplifier and a first node. the output terminal of the first calculation amplifier and an inverted input terminal of the first calculation amplifier may be connected to each other. a first output signal may have a level smaller than that of the first input signal and may be output to the first node.
Inventor(s): Seongkwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyungsun Ryu of Suwon-si (KR) for samsung electronics co., ltd., Kangmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaemoo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/319, G01R31/28
Abstract: a tester, which is adapted to test a device under test (dut), includes a first plurality of signal analysis circuits configured to analyze signals generated by a plurality of duts, and a second plurality of signal processing units configured to process the signals analyzed by the first plurality of signal analysis circuits. a switch array is provided, which is electrically coupled between the first plurality of signal analysis circuits and the second plurality of signal processing units. the switch array is configured to electrically connect selected ones of the first plurality of signal analysis circuits with corresponding ones of the second plurality of signal processing units. the number of signal processing units within the second plurality may be less than a maximum number of duts that can be connected to the first plurality of signal analysis circuits when the tester is testing a plurality of the duts.
Inventor(s): Indranil Sinharoy of Richardson TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Songwei Li of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S1/68, G01S1/04, G01S5/02, G05D1/02
Abstract: a method includes identifying a first anchor of a plurality of anchors as an initiator and identifying multiple second anchors of the plurality of anchors as multiple responders, the plurality of anchors located in a service area to be traversed by a robot. the method also includes sending, to the initiator and the responders via a wireless side-link, ranging information and a command to start ultra-wideband (uwb) ranging. the method also includes receiving, from the initiator via the wireless side-link, pair-wise range measurements representing uwb range measurements between the initiator and the responders. the method also includes generating initial location values for the initiator and the responders based on the pair-wise range measurements and one or more geometric constraints imposed on the initiator and the responders. the method also includes estimating 3d coordinates of the initiator and the responders using the initial location values.
Inventor(s): Tatsuhiro OTSUKA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/487, G01S7/4865
Abstract: a light detection and ranging (lidar) device includes a laser light irradiator configured to irradiate a pulsed laser light towards an object, a laser light receiver configured to detect a pulsed laser reflected light signal based on receiving the pulsed laser light reflected from the object, a signal analyzer configured to determine whether the pulsed laser reflected light signal is a low signal to noise ratio (snr) signal based on comparing a level of the pulsed laser reflected light signal with a reference signal level, and a processor configured to, in response to a determination that the pulsed laser reflected light signal is the low snr signal, adjust a dynamic range of an analog-to-digital converter (adc) to sample the pulsed laser reflected light signal.
Inventor(s): Jiheon PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Myoungoh KI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/89, G01B11/22, G01S7/481, G01S7/4911, G01S7/4915, G01S7/497, G06T7/80, H04N25/78
Abstract: provided are image sensors for distance measurement and camera modules. the image sensors for distance measurement include a pixel array including a plurality of unit pixels, a readout circuit configured to read out pixel signals from the pixel array in units of sub-frames and generate raw data, a preprocessing circuit configured to preprocess the raw data to generate phase data, a memory configured to store the phase data, a calibration circuit configured to generate correction data by performing a calibration operation on the phase data, an image signal processor configured to generate depth information using the correction data, and an output interface circuit configured to output depth data including the depth information in units of depth frames.
Inventor(s): Seonghyun YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B5/20, G02B5/00, G02B5/04
Abstract: a prism includes an incident face on which incident light including visible light and infrared is incident, a reflective face from which at least a part of incident light is reflected, and an exit face from which reflected light is emitted. visible light of incident light is totally reflected from the reflective face, and only a part of infrared of incident light is totally reflected from the reflective face.
Inventor(s): Dae Young PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeong Hoon KO of Suwon-si (KR) for samsung electronics co., ltd., Seong Ryeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Young-Gu KIM of Suwon-si (KR) for samsung electronics co., ltd., Tae Hoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Joong KIM of Suwon-si (KR) for samsung electronics co., ltd., Young Ju LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36, G03F1/80, G03F1/84, G03F7/00, G03F7/20
Abstract: provided is a process proximity effect correction method capable of efficiently improving the dispersion of patterns. there is a process proximity effect correction method according to some embodiments, the process proximity effect correction method of a process proximity effect correction device for performing process proximity effect correction (ppc) of a plurality of patterns using a machine learning module executed by a processor, comprising: training a sensitivity model by inputting a layout image of the plurality of patterns and a layout critical dimension (cd) of the plurality of patterns into the machine learning module; estimating an after cleaning inspection critical dimension (aci-cd) sensitivity prediction value of the plurality of patterns by inferring an aci-cd prediction value of the plurality of patterns; and determining a correction rate of the layout cd of the plurality of patterns using the estimated sensitivity prediction value.
Inventor(s): Byungje Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/42, G03F1/36, G03F1/44, G03F1/60, G03F1/72, G03F1/80
Abstract: a photomask includes at least one line pattern monitoring mark having unit blocks that include design line patterns. each of the unit blocks includes three design line patterns sequentially offset in a second direction perpendicular to the first direction, the unit blocks include a first unit block and a second unit block adjacent to the first unit block, the second unit block is offset from the first unit block by a rounding length in the second direction and is spaced apart from the first unit block in the first direction. in a method of manufacturing an integrated circuit device, monitoring line patterns are formed using the photomask, and a line end profile error in the monitoring line patterns is determined based on a cross-sectional structure of the monitoring line patterns taken along a line extending through at least a portion of the monitoring line patterns in the first direction.
Inventor(s): Kyuhee Han of Suwon-si (KR) for samsung electronics co., ltd., Koungmin Ryu of Suwon-si (KR) for samsung electronics co., ltd., Kyeongbeom Park of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Baek of Suwon-si (KR) for samsung electronics co., ltd., Wookyung You of Suwon-si (KR) for samsung electronics co., ltd., Woojin Lee of Suwon-si (KR) for samsung electronics co., ltd., Juhee Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G03F7/20, G03F7/40, H01L21/033
Abstract: a substrate processing apparatus includes a chamber having an internal space configured to process a substrate loaded therein; a light source configured to emit light on the substrate to harden a photoresist pattern coated on the substrate; and a transparent division part provided between the substrate and the light source, wherein the transparent division part divides the chamber into a first space, in which the light source is provided, and a second space, in which the substrate is provided.
Inventor(s): Jaehyun Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B19/418
Abstract: a virtual metrology method for a wafer includes collecting log data including process path information of wafers manufactured in a semiconductor process; collecting measured values of sample wafers of which physical characteristics are measured in the semiconductor process, the sample wafers being a group of wafers selected from among the manufactured wafers; classifying measured values of the sample wafers according to process paths based on the process path information; calculating a moving average value of measured values classified for each process path; and determining a moving average value corresponding to a process path of an unmeasured target wafer from among the manufactured wafers as a predicted value of the physical characteristics of the target wafer.
Inventor(s): Kwanwoo NOH of Seoul (KR) for samsung electronics co., ltd., Sungho SEO of Suwon-si (KR) for samsung electronics co., ltd., Yongwoo JEONG of Seoul (KR) for samsung electronics co., ltd., Dongwoo NAM of Seongnam-si (KR) for samsung electronics co., ltd., Myungsub SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyu JANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/08, G06F1/04, G06F3/06, G06F13/42, G11C7/22, G11C16/32, H04L7/00
Abstract: a storage device and a storage system including the same are provided. the storage device includes a reference clock pin configured to receive a reference clock signal from a host, a reference clock frequency determination circuitry configured to determine a reference clock frequency from the reference clock signal received through the reference clock pin, and a device controller circuitry configured to perform a high speed mode link startup between the host and the storage device according to the reference clock frequency.
Inventor(s): Seungki CHO of Suwon-si (KR) for samsung electronics co., ltd., Han KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaemun SIM of Suwon-si (KR) for samsung electronics co., ltd., Changwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0481, A47G1/02, G06T7/70
Abstract: provided is an electronic device including a first sensor configured to sense a user; a second sensor configured to sense light incident from an external light source; a mirror display; a memory; and a processor configured to: based on the first sensor sensing the user in front of the mirror display, obtain information about a first area in which a first image corresponding to a reflection of the user is located on the mirror display; determine a second area for displaying content to be provided to the user based on the information about the first area; based on information about light being obtained through the second sensor, determine luminance of the second area based on the information about the light; and control the mirror display to display the content with the determined luminance on the second area.
Inventor(s): Kue-Hwan SIHN of Suwon-si (KR) for samsung electronics co., ltd., Beyong-Ho YUU of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04842, G06F3/0481, G06F3/04817, G06F3/0482, G06F3/0488, G06F3/04883, H04M1/00, H04M1/724
Abstract: an electronic device is provided. the electronic device includes a wireless communication receiver, a touchscreen display, and at least one processor, wherein the at least one processor is configured to receive a plurality of messages including at least a first message and a second message, receive a first input including a predetermined gesture, based on the first input, display a notification list, wherein the notification list includes a first notification item including a first application icon corresponding to the first application, a first notification corresponding to the first message, and a first indicator for displaying a second notification corresponding to the second message, and a second notification item including a second application icon corresponding to a second application, a third notification, and a second indicator for displaying a fourth notification corresponding to the second application, receive a second input with respect to the first notification item, and, based on the second input, display the first notification corresponding to the first message, the second notification corresponding to the second message, and a first summary reduction indicator corresponding to the first application.
Inventor(s): Sang Hun JUN of San Jose CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto (CA) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/0815
Abstract: a storage device is disclosed. the storage device may include a volatile storage, a non-volatile storage, and a backup power source configured to provide backup power to the volatile storage. a connector may connect the storage device to a processor. a controller may use the volatile storage as a cache for the non-volatile storage. the controller may copy a data from the volatile storage to the non-volatile storage based at least in part on receiving a signal.
Inventor(s): Jaehwan LIM of Suwon-si (KR) for samsung electronics co., ltd., Yeongyu Ahn of Suwon-si (KR) for samsung electronics co., ltd., Hyunjung Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a storage device includes at least one nonvolatile memory device and a storage controller. the storage controller controls the at least one nonvolatile memory device based on a request from an external host. the storage controller adaptively adjusts an impedance of a transmission driver based on a change of an operating temperature of the storage device. the transmission driver transmits a transmission signal to the external host through a link. the storage device may increase an eye height of the transmission signal transmitted to the host through the link by decreasing impedance of the transmission driver as the operating temperature increases. therefore, the storage device according to example embodiments may maintain reliability of the link even though the operating temperature of the storage device increases.
Inventor(s): Xiang Lian of Cupertino CA (US) for samsung electronics co., ltd., Chao Yang of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a provided a storage device configured to support a number of namespaces. the storage device includes a memory and a controller coupled to the memory. the controller includes a host interface layer and a flash translation layer configured to report to the host interface layer a first over-provisioning chunk from an over-provisioning pool and a first chunk separate from the over-provisioning pool. the controller is configured to receive a command at the host interface layer to utilize a portion of the memory for a first namespace from among the number of namespaces and the first namespace includes an unaligned chunk. the controller is configured to utilize the first over-provisioning chunk as the unaligned chunk of the first namespace. a number of over-provisioning chunks to be utilized as unaligned chunks is less than the number of namespaces.
Inventor(s): Ramdas P. Kachare of Pleasanton CA (US) for samsung electronics co., ltd., Amir Beygi of San Jose CA (US) for samsung electronics co., ltd., Mostafa Aghaee of San Jose CA (US) for samsung electronics co., ltd., Jingchi Yang of Sunnyvale CA (US) for samsung electronics co., ltd., Tinh Tri Lac of Manteca CA (US) for samsung electronics co., ltd., Sonny Pham of Ramon CA (US) for samsung electronics co., ltd., Nayankumar Patel of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F13/38
Abstract: systems and methods for executing a data processing function are disclosed. a first processing device of a storage accelerator loads a first instruction set associated with a first application of a host computing device. a second processing device of the storage accelerator loads a second instruction set associated with the first application. a command is received from the host computing device. the command may be associated with data associated with the first application. the first processing device identifies at least a first criterion or a second criterion associated with the data. the first processing device processes the data according to the first instruction set in response to identifying the first criterion. the first processing device writes the data to a buffer of the second processing device in response to identifying the second criterion. the second processing device processes the data in the buffer according to the second instruction set.
Inventor(s): Bei QI of XiAn (CN) for samsung electronics co., ltd., Kun Zhang of XiAn (CN) for samsung electronics co., ltd., Kun Dou of XiAn (CN) for samsung electronics co., ltd., Ruyi Zhang of XiAn (CN) for samsung electronics co., ltd., Zongyuan Zhang of XiAn (CN) for samsung electronics co., ltd., Yutao Li of XiAn (CN) for samsung electronics co., ltd., Dan Cao of XiAn (CN) for samsung electronics co., ltd., Tianyi Zhang of XiAn (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a data storage method includes: in response to a stream id carried by an io write request of a host satisfying a first preset condition, writing data corresponding to the io write request into a first storage unit; and in response to the stream id carried by the io write request satisfying a second preset condition, writing the data corresponding to the io write request into a second storage unit, wherein the stream id indicates write latency requirement information of the data corresponding to the io write request, wherein a data write latency indicated by the stream id satisfying the first preset condition is less than the data write latency indicated by the stream id satisfying the second preset condition, wherein a read and write performance of the first storage unit is higher than the read and write performance of the second storage unit.
Inventor(s): HENG ZHANG of SHAANXI (CN) for samsung electronics co., ltd., Wenwen CHEN of SHAANXI (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a synchronous write method includes: receiving a synchronous write command of a process; if a process state table indicates that another synchronous write command of the process has not been added to a command queue, adding the synchronous write command to the command queue; if the process state table indicates that the other synchronous write command has been added to the command queue, adding an order preserving command to the command queue, and then adding the synchronous write command to the command queue; and sending commands in the command queue to a storage device according to the order of the commands in the command queue. the order preserving command is used to indicate that a synchronous write commands located before the order preserving command in the command queue is to be executed prior to the synchronous write command by the storage device.
20240086135.MULTI-DISPLAY BASED DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Duk Ki HONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyuk KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeong Hun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jae Bong YOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyung Soo LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jun Hak LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Min Gyew KIM of Seoul (KR) for samsung electronics co., ltd., Na Jung Seo of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06T1/20, G09G5/00, H04M1/724
Abstract: an electronic device is provided that includes a first display and a second display. the electronic device also includes a processor configured to allocate a first set of resources to the first display and a second set of resources to the second display. the first set of resources is different from the second set of resources. each of the first set of resources and the second set of resources includes one or more of at least one available hardware resource and at least one available software resource.
Inventor(s): Sungmeen MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Dong-Jin CHANG of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Daekun YOON of Suwon-si (KR) for samsung electronics co., ltd., Seok Ju YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/544, G06F7/40
Abstract: a multi-bit accumulator includes 1-bit wallace trees each configured to perform an add operation on single-bit input data, tristate logic circuits each configured to output a result of the add operation of the 1-bit wallace trees according to an enable signal provided to the tristate logic circuits, and a shift-adder configured to perform an accumulation operation on the result of the add operation of the 1-bit wallace trees by a shift operation based on a clock signal.
Inventor(s): Ganji Manoj KUMAR of Bengaluru (IN) for samsung electronics co., ltd., Jaitirth Anthony JACOB of Bengaluru (IN) for samsung electronics co., ltd., Rishabh RAJ of Bengaluru (IN) for samsung electronics co., ltd., Vaisakh Punnekkattu Chirayil SUDHEESH BABU of Bengaluru (IN) for samsung electronics co., ltd., Renju Chirakarotu NAIR of Bengaluru (IN) for samsung electronics co., ltd., Hakryoul KIM of Suwon-si (KR) for samsung electronics co., ltd., Shweta RATANPURA of Bengaluru (IN) for samsung electronics co., ltd., Tarun GOPALAKRISHNAN of Bengaluru (IN) for samsung electronics co., ltd., Sriram SHASHANK of Bengaluru (IN) for samsung electronics co., ltd., Raju Suresh DIXIT of Bengaluru (IN) for samsung electronics co., ltd., Youngjoo JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F9/50, G06N20/00
Abstract: a method for managing memory for applications in a computing system includes receiving a selection of a preferred application. during user-controlled operation over the application, the transitions of selected application between foreground and background are monitored. a retention of the application in memory is triggered upon a transition of the application to background during the user operation. retention of the application includes compressing memory portions of the application. accordingly, the application is retained within the memory based on said compressed memory portions. a requirement to restore the retained application is sensed based on either a user selection or an automatically generated prediction and the application is restored from the retained state back to the foreground.
Inventor(s): Jonglae Park of Suwon-si (KR) for samsung electronics co., ltd., Eunok JO of Suwon-si (KR) for samsung electronics co., ltd., Bumgyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Seyeong BYEON of Suwon-si (KR) for samsung electronics co., ltd., Daeyeong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48
Abstract: an electronic device includes: a plurality of processing cores and a memory including a plurality of task queues respectively corresponding to the plurality of processing cores and a plurality of task relation tables respectively corresponding to a plurality of tasks. each of the plurality of task relation tables includes: one or more entries representing a mapping relationship between an identifier of a waker task that wakes up a wakee task, and an occurrence count that is a number of times the wakee task is woken up by the waker task. at least one of the plurality of processing cores is configured to: execute a scheduler, search for a task set includes related tasks, based on the plurality of task relation tables, store a subset of tasks of the task set in at least one of the plurality of task queues, and schedule the task set.
Inventor(s): Sean Christopher KOCOL of Vista CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/16, G06F11/20
Abstract: a method includes generating a new storage target assignment for a placement group (pg) as a last started set, the pg including the last started set and a last clean set, wherein the last started set includes a current set of storage targets assigned for the pg, and the last clean set includes a set of storage targets assigned for the pg at the last time all data stores in its acting set of storage targets were online and up-to-date; performing a process to rebalance or add new data stores in the last started set; storing one or more of the new data stores in a supplemental clean list; and performing one or more update operations on the last started set, based on the supplemental clean list.
Inventor(s): Krishna T. Malladi of San Jose CA (US) for samsung electronics co., ltd., Wenqin Huangfu of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/30, G06F11/34
Abstract: a method for computing. in some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.
Inventor(s): Changhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Mingon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/14, G06F1/30, G06F13/16
Abstract: disclosed is a method of operating a storage device which communicates with a host device. the method includes allocating a secure region and a user region, storing first data encrypted by using a first encryption key in a first data block of the secure region, receiving a first request indicating a first secure delete operation of the first data from the host device, decrypting at least one valid data of the first data block by using the first encryption key based on the first request, wherein the at least one valid data do not include the first data, encrypting the decrypted at least one valid data by using a second encryption key different from the first encryption key, storing the encrypted at least one valid data in a second data block of the secure region, and deleting the first encryption key.
Inventor(s): Rajinikanth PANDURANGAN of Fremont CA (US) for samsung electronics co., ltd., Changho CHOI of San Jose CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd., Sungwook RYU of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/10, G06F9/445
Abstract: a method for communicating with a device may include running, at a device, an operating system, communicating, using a first function of an interconnect, with the device, and communicating, using a second function of the interconnect, with the operating system. the operating system may include communication logic, and the communicating with the operating may include communicating with the communication logic. the communication logic may one or more terminal support drivers, and the communicating with the communication logic may include communicating with the one or more terminal support drivers using a terminal application. the terminal application may run on a host. the second function of the interconnect may be configured to operate with a controller. the communicating with the operating system may include communicating with the operating system based on a privilege information. the host may be a management controller. the method may further include controlling, using the second function of the interconnect, a program on the operating system.
20240086342.SEMICONDUCTOR SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): HYUN JUN PARK of Seoul (KR) for samsung electronics co., ltd., WOO-SEOK CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F13/20, G11C7/10, H03K17/687
Abstract: a semiconductor system including a transmitter configured to output a plurality of data as a plurality of data input/output signals through a plurality of channels based on a matrix e, and a receiver configured to generate the plurality of data by differentially amplifying the plurality of data input/output signals received through the plurality of channels based on a matrix d, in which all components of the matrix e and the matrix d are integers, a product matrix of the matrix d and the matrix e is a diagonal matrix, a sum of the components of each row of the matrix d is 0, and a sum of absolute values of the components of each column of the matrix d is less than or equal to a threshold value.
Inventor(s): Sang-Hyuk KWON of Seoul (KR) for samsung electronics co., ltd., Nam Sung KIM of Yongin-si (KR) for samsung electronics co., ltd., Kyomin SOHN of Yongin-si (KR) for samsung electronics co., ltd., Jaeyoun YOUN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, H01L25/065
Abstract: a memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. the plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.
Inventor(s): DongSik CHO of Yongin-si (KR) for samsung electronics co., ltd., Jeonghoon KIM of Yongin-si (KR) for samsung electronics co., ltd., Rohitaswa BHATTACHARYA of Suwon-si (KR) for samsung electronics co., ltd., Jaeshin LEE of Seoul (KR) for samsung electronics co., ltd., Honggi JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/40, G06F13/364
Abstract: a system on chip, semiconductor device, and/or method are provided that include a plurality of masters, an interface, and a semaphore unit. the interface interfaces the plurality of masters with a slave device. the semaphore unit detects requests of the plurality of masters, controlling the salve device, about an access to the interface and assigns a semaphore about each of the plurality of masters by a specific operation unit according to the detection result.
Inventor(s): Andrew Zhenwen CHANG of Los Altos CA (US) for samsung electronics co., ltd., Vincent Tung PHAM of San Jose CA (US) for samsung electronics co., ltd., Jaemin JUNG of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/2453, G06F12/0882, G06F16/2455, G06F16/248
Abstract: an accelerator is disclosed. the accelerator may include an on-chip memory to store a data from a database. the on-chip memory may include a first memory bank and a second memory bank. the first memory bank may store the data, which may include a first value and a second value. a computational engine may execute, in parallel, a command on the first value in the data and the command on the second value in the data in the on-chip memory. the on-chip memory may be configured to load a second data from the database into the second memory bank in parallel with the computation engine executing the command on the first value in the data and executing the command on the second value in the data.
Inventor(s): Jinhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwoon JANG of Suwon-si (KR) for samsung electronics co., ltd., Sangjun YU of Suwon-si (KR) for samsung electronics co., ltd., Inkoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Ildo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon WON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/32, G06F21/45, G06V40/16, G06V40/18, G06V40/19, H04N23/68, H04N25/47
Abstract: an example electronic device may receive user input in a state in which security of the electronic device is configured; based on receiving of the user input, display a designated screen on a display; acquire image data including a face of a user through an image sensor; detect a radial movement from a part of the face using a dvs while acquiring the image data; detect first face data corresponding to the face from the image data and compare the detected first face data with second face data stored in the electronic device; and, based on the detection of the radial movement and correspondence between the first face data and the second face data, release the state in which the security is configured.
Inventor(s): Hyunjoong Kim of Seoul (KR) for samsung electronics co., ltd., Jaepil Shin of Suwon-si (KR) for samsung electronics co., ltd., Moonhyun Cha of Yongin-si (KR) for samsung electronics co., ltd., Changwook Jeong of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/27, G06N3/045, G06N3/08
Abstract: a system for modeling a semiconductor fabrication process includes at least one first processor and at least one second processor. the at least one first processor is configured to provide at least one machine learning (ml) model, which is trained by using a plurality of pairs of images of a design pattern sample and a physical pattern sample. the physical pattern sample is formed from the design pattern sample by using the semiconductor fabrication process. the at least one second processor is configured to provide an input image representing a shape of a design pattern and/or a physical pattern to the at least one first processor and to generate output data defining the physical pattern and/or the design pattern based on an output image received from the at least one first processor.
Inventor(s): Ki Soo KWON of Suwon-si (KR) for samsung electronics co., ltd., Kyunghyun CHO of New York NY (US) for samsung electronics co., ltd., Hoshik LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0455, G06F16/23
Abstract: an electronic device includes one or more processors and a memory storing instructions configured to, when executed by the one or more processors, cause the one or more processors to: implement a machine learning-based conditional generative model configured to reconstruct target data from latent vectors, the conditional generative model trained based on an existing data set for a target task; determine an extrapolation weight; generate an augmented latent vector and augmented condition data by extrapolating, based on the extrapolation weight, from a latent vector corresponding to the existing dataset and from existing condition data corresponding to the existing dataset; and generate a new dataset comprising augmented target data generated by the conditional generative model based on the augmented condition data and based on the augmented latent vector.
Inventor(s): Sungho Kim of Yongin-si (KR) for samsung electronics co., ltd., Cheheung KIM of Yongin-si (KR) for samsung electronics co., ltd., Jaeho LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/063, G06F7/501, G06F7/523, G11C11/54
Abstract: a neuromorphic apparatus configured to process a multi-bit neuromorphic operation including a single axon circuit, a single synaptic circuit, a single neuron circuit, and a controller. the single axon circuit is configured to receive, as a first input, an i-th bit of an n-bit axon. the single synaptic circuit is configured to store, as a second input, a j-th bit of an m-bit synaptic weight and output a synaptic operation value between the first input and the second input. the single neuron circuit is configured to obtain each bit value of a multi-bit neuromorphic operation result between the n-bit axon and the m-bit synaptic weight, based on the output synaptic operation value. the controller is configured to respectively determine the i-th bit and the j-th bit to be sequentially assigned for each time period of different time periods to the single axon circuit and the single synaptic circuit.
Inventor(s): Jihye LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungkyu CHO of Suwon-si (KR) for samsung electronics co., ltd., Kangjin YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q20/32, G06Q20/36, G06Q20/38
Abstract: the present disclosure discloses a method for a uwb-based payment service. a method of a first electronic device using uwb communication, of the present disclosure, may comprise the operations of: receiving, from a second electronic device, an initiation message for uwb ranging, which includes a random number generated by means of the second electronic device, transmitting, to the second electronic device, a response message to the initiation message, which includes identification information about the first electronic device encrypted using a session key generated on the basis of the random number, receiving, from the second electronic device, a transaction information message including request type information indicating the type of request associated with a payment, and transmitting, to the second electronic device, a payment information message including response data based on the request type information.
Inventor(s): Younghyun Jo of Suwon-si (KR) for samsung electronics co., ltd., Sehwan Ki of Suwon-si, (KR) for samsung electronics co., ltd., Eunhee Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyong Euk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40
Abstract: systems and methods for super-resolution (sr) are described. the sr method includes determining a direction type of an input image based on a gradient of the input image, obtaining a first intermediate image based on the direction type using a look-up table (lut) that stores an sr operation result of a pixel value combination corresponding to a kernel set mapped to the determined direction type, wherein the first intermediate image is an sr image corresponding to the input image, applying sr interpolation to the input image to obtain a baseline image, and obtaining an output image based on the first intermediate image and the baseline image.
Inventor(s): Mingzhao Yu of State College PA (US) for samsung electronics co., ltd., Zeeshan Nadir of Allen TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd., John W. Glotzbach of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T11/40, G06T5/00, G06T5/40, G06T7/11, G06T7/90, G06T11/20
Abstract: a method includes obtaining a raw image in a first image domain. the method also includes determining a color distribution and an amount of variation in the raw image. the method further includes using an iterative process to generate a dead leaf image from a blank image in the first image domain. the iterative process includes adding multiple circles and multiple sticks to the blank image until the dead leaf image is filled. the iterative process also includes blurring portions of the dead leaf image during at least one iteration of the iterative process. textures of the multiple circles are blended based on the color distribution and the amount of variation in the raw image.
Inventor(s): Erkan Volkan of Lodi NJ (US) for samsung electronics co., ltd., Siva Penke of San Jose CA (US) for samsung electronics co., ltd., Siva Boggala of San Ramon CA (US) for samsung electronics co., ltd., Laszlo Gombos of Winchester MA (US) for samsung electronics co., ltd., Jisun Park of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T13/40, G06T13/20, G06T17/00, G10L13/02, G10L13/08
Abstract: in one embodiment, a method includes determining, by a client computing device, that a user has selected text displayed on a display of the client computing device. the method further includes presenting, in response to the determination, a ui element on the display of the client computing device. the ui element includes a plurality of selectable portions, each associated with a distinct speaking action for a 3d avatar to perform with respect to the selected text. in response to the user's selection, the method includes presenting on the display of the client computing device an animation of the 3d avatar performing a speaking action corresponding to the selected portion; and providing, by the client computing device, speech audio synchronized with the speaking action of the animated 3d avatar.
Inventor(s): Kanghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Dongchoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Woojung HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06F3/04815, G06F3/14, G06F21/62
Abstract: a server for providing content shared to an object is provided. the server is configured to establish communication between a first electronic device of a user and a second electronic device of another user and provide, to the first electronic device and the second electronic device, a virtual space and an object in the virtual space. the server selects, based on an input of the user, at least one content shared to the object in the virtual space by the other user of the second electronic device entering the same virtual space as the first electronic device. the server activates the object to identically output the selected content to at least one electronic device entering the virtual space. based on the second electronic device leaving the virtual space, the server stops providing the content shared by the other user.
Inventor(s): Woojung HAN of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongchoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kanghee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06T13/40, G06V20/40, G06V40/20
Abstract: an example electronic device may include a display module, a memory configured to store computer-executable instructions, and a processor configured to execute the instructions by accessing the memory. the processor may be configured to create a preliminary persona based on first information related to history of a target user, create a first persona from the preliminary persona based on second information related to a time and a space of the target user, apply the first persona to an avatar object in a virtual space and corresponding to the target user, and, when an occurrence of an event related to the target user is detected, create a second persona from the first persona based on the event occurrence and apply the second persona, instead of the first persona, to the avatar object.
Inventor(s): Ranjan Kumar SAMAL of Bengaluru (IN) for samsung electronics co., ltd., Vivek Paul JOSEPH of Bengaluru (IN) for samsung electronics co., ltd., Rajin BABU of Bengaluru (IN) for samsung electronics co., ltd., Abhishek PANDEY of Bengaluru (IN) for samsung electronics co., ltd., Nagaraj ADIGA of Bengaluru (IN) for samsung electronics co., ltd., Somesh NANDA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/01, G06T13/40
Abstract: an electronic device presents a virtual behavior of a participant in a metaverse. the electronic device determines a context of the metaverse including the people meeting with the participant. the electronic device determines a real-world behavior of the participant while immersed in the metaverse. the electronic device generates virtual behavior of the participant based on the context of the metaverse and the real-world behavior of the participant while immersed in the metaverse. the electronic device renders an avatar of the participant having the virtual behavior of the participant.
Inventor(s): Sujoy SAHA of Bangalore (IN) for samsung electronics co., ltd., Rajas Jayant JOSHI of Nagpur (IN) for samsung electronics co., ltd., Rajat Kumar JAIN of Pune (IN) for samsung electronics co., ltd., Aditi SINGHAL of Meerut Cantt (IN) for samsung electronics co., ltd., Amita BADHWAR of Phagwara (IN) for samsung electronics co., ltd., Sathyanarayanan KULASEKARAN of Bangalore IN (US) for samsung electronics co., ltd., Sarthak SENGUPTA of Ghaziabad (IN) for samsung electronics co., ltd., Lokesh Rayasandra BOREGOWDA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06T19/00
Abstract: provided is a method for generating augmented reality (ar) content that includes: receiving a plurality of image frames of at least one scene captured by a plurality of participant devices in an ar or a virtual reality (vr) environment; storing the plurality of image frames and metadata associated with the plurality of image frames, in a database; receiving an ar content generation request to generate an ar content view of a user in the ar/vr environment, the ar content generation request including an identifier (id) of the user and information of the at least one scene; retrieving a set of image frames from a plurality of stored image frames in the database based on the id of the user, the information of the at least one scene, and metadata associated with the set of image frames, the set of images including the user in the at least one scene in the ar/vr environment; generating the ar content view of the user by combining the set of image frames retrieved from the database, based on the metadata associated with the set of image frames; and displaying the ar content view.
Inventor(s): Youngjun KWAK of Seoul (KR) for samsung electronics co., ltd., Minsu KO of Suwon-si (KR) for samsung electronics co., ltd., Youngsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Heewon KIM of Seoul (KR) for samsung electronics co., ltd., Ju Hwan SONG of Suwon-si (KR) for samsung electronics co., ltd., Byung In YOO of Seoul (KR) for samsung electronics co., ltd., Seon Min RHEE of Seoul (KR) for samsung electronics co., ltd., Yong-il LEE of Daejeon (KR) for samsung electronics co., ltd., Jiho CHOI of Seoul (KR) for samsung electronics co., ltd., Seungju HAN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/16, G06F21/32, G06T7/00, G06T7/73, G06V10/143, G06V40/40
Abstract: a processor-implemented method includes generating a preprocessed infrared (ir) image by performing first preprocessing based on an ir image including an object; generating a preprocessed depth image by performing second preprocessing based on a depth image including the object; and determining whether the object is a genuine object based on the preprocessed ir image and the preprocessed depth image
Inventor(s): Taeksu Kwon of Suwon-si (KR) for samsung electronics co., ltd., Dongwook Suh of Bucheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20
Abstract: a display device includes a first gamma line providing a first gamma voltage; a second gamma line providing a second gamma voltage; a local tab point line; a first switch configured to connect the first gamma line to the local tab point line based on a tab division enable signal; and a second switch configured to connect the second gamma line to the local tab point line based on the tab division enable signal.
Inventor(s): Yongkoo HER of Suwon-si (KR) for samsung electronics co., ltd., Kiwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seoungyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Hongkook LEE of Suwon-si (KR) for samsung electronics co., ltd., Euntaek JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3233, G06F3/01, G09G3/20
Abstract: an electronic device may include a display module for displaying image data, and a processor operatively connected to the display module to provide the image data to the display module, and the display module may include a display panel including a plurality of pixel lines including a plurality of pixels, and a display driving circuit for driving a plurality of pixels of the display panel. various other embodiments are possible.
Inventor(s): Ravibhushan B. TAYSHETE of Bangalore (IN) for samsung electronics co., ltd., Sourabh TIWARI of Bangalore (IN) for samsung electronics co., ltd., Vinay Vasanth PATAGE of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/18, G10L15/30
Abstract: a voice command resolution apparatus, including a memory configured to store instructions; and a processor configured to execute the instructions to: recognize a voice command of a user in an input sound, analyze a non-speech sound included in the input sound, and determine at least one target internet of things (iot) device related to execution of the voice command, based on an analysis result of the non-speech sound.
Inventor(s): Boddu Venkata Krishna VINAY of Karnataka (IN) for samsung electronics co., ltd., Bhiman Kumar BAGHEL of Karnataka (IN) for samsung electronics co., ltd., Gorang MANIAR of Karnataka (IN) for samsung electronics co., ltd., Syed Khaja MOINUDDIN of Karnataka (IN) for samsung electronics co., ltd., Sudhansu Ranjan ACHARYA of Karnataka (IN) for samsung electronics co., ltd.
IPC Code(s): G10L15/30, G10L15/22
Abstract: methods, systems, and apparatuses for enabling indirect interactions between users in an internet of things (iot) environment are provided. a method includes receiving, by a first device, an utterance from a first user, wherein the utterance relates to at least one task that is to be performed by the first user; based on receiving the utterance, identifying, by the first device, one or more second users related to the at least one task; providing, by the first device, an interactable interface to one or more second devices which are located closer to the one or more second users than the first device; receiving, by the first device, one or more inputs corresponding to the at least one task from the one or more second users through the interactable interface; and appending, by the first device, the received one or more inputs to the at least one task.
Inventor(s): Hingkwan Huen of Daly City CA (US) for samsung electronics co., ltd., Changho Choi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G11C7/10, G06F3/06
Abstract: a multi-port memory device in communication with a controller includes a memory array for storing data provided by the controller, a first port coupled to the controller via a first controller channel, a second port coupled to the controller via a second controller channel, a processor, and a processor memory local to the processor, wherein the processor memory has stored thereon instructions that, when executed by the processor, cause the processor to: enable data transfer through the first port and/or the second port in response to a first control signal received from the first controller channel and/or a second control signal received from second controller channel, decode at least one of the received first and second control signals to identify a data operation to perform, the identified data operation including a read or write operation from or to the memory array, and execute the identified data operation.
20240087640.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seongjin Cho of Suwon-si (KR) for samsung electronics co., ltd., Kyuchang Kang of Suwon-si (KR) for samsung electronics co., ltd., Keonwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Donghak Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/408, G11C11/4091, H01L25/065, H10B12/00, H10B80/00
Abstract: a semiconductor device includes a memory cell array that includes a plurality of memory cells electrically connected to a plurality of word lines and a plurality of bit lines, a word line driving circuit that includes a plurality of sub-word line decoders electrically connected to the plurality of word lines, and a control logic configured to determine a selected word line and unselected word lines among the plurality of word lines, and configured to control the word line driving circuit such that at least one of the unselected word lines that is adjacent to the selected word line is floated during at least a portion of a period in which a voltage of the selected word line returns to an initial level.
Inventor(s): Jiwon Son of Suwon-si (KR) for samsung electronics co., ltd., Sunggil Kang of Suwon-si (KR) for samsung electronics co., ltd., Kangmin Do of Suwon-si (KR) for samsung electronics co., ltd., Youngsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Younghoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangjin An of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, C23C16/455
Abstract: a substrate treating apparatus includes a process chamber configured to perform plasma treatment, a substrate support in a lower portion of the process chamber and configured to support a substrate, a showerhead in an upper portion of the process chamber and configured to supply a process gas for the plasma treatment toward the substrate, and a baffle surrounding the substrate support. the substrate support functions as a first electrode for generating plasma, the showerhead and the baffle function as a second electrode for generating the plasma, the baffle has a variable height, and an area of the second electrode varies as a height of the baffle varies.
Inventor(s): GYEOM KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Dongwoo Kim of Incheon (KR) for samsung electronics co., ltd., Jihye Yi of Suwon-si (KR) for samsung electronics co., ltd., JINBUM KIM of Seoul (KR) for samsung electronics co., ltd., Sangmoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Seunghun Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, H01L21/285, H01L21/768, H01L21/8234, H01L23/485, H01L29/06, H01L29/08, H01L29/165, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/78, H01L29/786
Abstract: a semiconductor device is provided. the semiconductor device includes: an active region on a semiconductor substrate; a channel region on the active region; a source/drain region adjacent to the channel region on the active region; a gate structure overlapping the channel region, on the channel region; a contact structure on the source/drain region; a gate spacer between the contact structure and the gate structure; and a contact spacer surrounding a side surface of the contact structure. the source/drain region includes a first epitaxial region having a recessed surface and a second epitaxial region on the recessed surface of the first epitaxial region, and the second epitaxial region includes an extended portion, extended from a portion overlapping the contact structure in a vertical direction, in a horizontal direction and overlapping the contact spacer in the vertical direction.
Inventor(s): Jaehyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, B32B43/00
Abstract: a light irradiation apparatus including a stage configured to support a substrate; and a light emitting diode (led) module spaced apart from the stage, wherein the led module includes a plurality of leds, wherein some of the plurality of leds are arranged in a first direction, and wherein others of the plurality of leds are provided in a second direction, the second direction intersecting the first direction.
Inventor(s): Minsung KIM of SUWON-SI (KR) for samsung electronics co., ltd., Youngsoo LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/683
Abstract: a chip pick-up head includes a collet in contact with an upper surface of a chip of a diced wafer. the chip pick-up head detaches and picks up the chip from an adhesive film. the chip pick-up head further includes a head part coupled to the collet, a vibration transfer rod coupled to the head part and configured to transfer a vibration to the head part and the collet, and a vibration generator coupled to the vibration transfer rod and configured to generate the vibration.
Inventor(s): Cheonil PARK of Suwon-si (KR) for samsung electronics co., ltd., Myoungchul EUM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, C09J7/29, C09J7/38
Abstract: a wafer temporary adhesive tape includes a device adhesive layer configured to be attached to a device wafer, a base layer on the device adhesive layer, and a carrier adhesive layer on the base layer and configured to be attached to a carrier wafer, wherein the base layer includes a laser decomposable material layer that can be chemically decomposed by absorbing a laser beam.
Inventor(s): Woojin LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Hoon Seok SEO of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon AHN of Hwaseong-si (KR) for samsung electronics co., ltd., Kyu-Hee HAN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L23/528
Abstract: a semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.
20240087976.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngdeuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Mina Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/36, H01L23/00, H01L23/42, H01L25/065, H10B80/00
Abstract: provided is a semiconductor package including a first substrate, a first chip structure on the first substrate, the first chip structure including at least one chip, a heat dissipation member on the first chip structure, the heat dissipation member including a heat dissipation plate including a first surface facing the first chip structure and a second surface opposite to the first surface and a seed metal layer on the second surface of the heat dissipation plate, and a metal thermal interfacial material (tim) on the seed metal layer.
Inventor(s): Daewoong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/42, H01L21/48, H01L21/56, H01L23/31, H01L23/498, H01L25/10
Abstract: there is provided a method of manufacturing a semiconductor package, a first redistribution wiring layer including a chip mounting region and a peripheral region surrounding the chip mounting region is formed, and the first redistribution wiring layer has first redistribution wires stacked in at least two layers. a first semiconductor device is mounted on the chip mounting region on the first redistribution wiring layer. a sealing member is formed on the first redistribution wiring layer to cover the first semiconductor device. a plurality of conductive connectors is formed on the peripheral region, and the conductive connectors penetrate the sealing member and are electrically connected to the first redistribution wires. a plurality of through openings extending from an upper surface of the sealing member is formed on the chip mounting region and exposes an upper surface of the first semiconductor device. the through openings are filled up with a conductive material to form a plurality of heat transfer plugs.
20240087991.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jae Hyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Sung Woo PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyun Jong MOON of Suwon-si (KR) for samsung electronics co., ltd., Kwang Jin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/495, H01L23/00, H01L23/31
Abstract: a semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.
20240087998.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kilsoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/538, H01L25/10, H10B80/00
Abstract: a semiconductor package including a first semiconductor device including a semiconductor chip; an interposer including silicon and electrically connected to the first semiconductor device, wherein the first semiconductor is provided on the interposer; a second semiconductor device; and a substrate, wherein the interposer and the second semiconductor device, are provided on the substrate apart from each other, and wherein the interposer is electrically connected to the second semiconductor device; wherein a first volume of a first shape, in which the first semiconductor device overlaps an upper surface of the substrate, is less than or equal to a second volume of a second shape, in which the interposer overlaps an upper surface of the substrate.
Inventor(s): Narae SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjun YOON of Suwon-si (KR) for samsung electronics co., ltd., Jeongkyu HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00
Abstract: a semiconductor package includes a film substrate; a plurality of wires on an upper surface of the film substrate; an upper insulating film covering the plurality of wires on the upper surface of the film substrate and defining a plurality of pad openings and a mounting region opening such that, the plurality of pad openings expose at least a portion of an outer lead bonding portion of the plurality of wires along at least one of the first side surface or the second side surface and the mounting region opening exposes at least a portion of an inner lead bonding portion of the plurality of wiring; a semiconductor chip bonded to and electrically connected to the exposed inner lead bonding portion, and at least one support pattern on a lower surface of the film substrate and extending in the first direction to overlap with the plurality of pad openings.
20240088006.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangcheon PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Soohwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/538
Abstract: provided is a semiconductor package including a substrate including a first surface and a second surface opposite to the first surface, a connecting circuit arranged on the first surface of the substrate, a through silicon via (tsv) structure penetrating the substrate, a first passivation layer arranged on the connecting circuit, a second passivation layer arranged on the second surface, a first bumping pad arranged inside the first passivation layer, and a second bumping pad arranged inside the second passivation layer, wherein the first bumping pad includes a first pad plug, and a first seed layer surrounding a lower surface and sidewalls of the first pad plug, wherein the second bumping pad includes a second pad plug, and a second seed layer surrounding an upper surface and sidewalls of the second pad plug, and wherein the first seed layer and the second seed layer include materials having different reactivities to water.
Inventor(s): Jeewoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hojun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungmoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungmin CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/528, H01L23/58
Abstract: an integrated circuit device comprising: a dielectric layer; a first power delivery network layer on a first surface of the dielectric layer; a second power delivery network layer on a second surface of the dielectric layer, wherein the second surface is opposite to the first surface in a vertical direction; and a via capacitor between the first surface and the second surface of the dielectric layer, wherein the via capacitor includes a first via electrode structure and a second via electrode structure that are spaced apart from each other in one of a first horizontal direction and a second horizontal direction that intersects with the first horizontal direction, and a first end portion and a second end portion that is opposite to the first end portion of the via capacitor are electrically connected to the first power delivery network layer and the second power delivery network layer, respectively.
20240088039.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungho DO of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon BAEK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L27/02, H01L27/092, H01L29/423, H01L29/786
Abstract: a semiconductor device includes a substrate having an active region, a first group of standard cells arranged in a first row on the active region of the substrate and having a first height defined in a column direction, a second group of standard cells arranged in a second row on the active region of the substrate, and having a second height, and a plurality of power lines extending in a row direction and respectively extending along boundaries of the first and the second groups of standard cells. the first and second groups of standard cells each further include a plurality of wiring lines extending in the row direction and arranged in the column direction, and at least some of wiring lines in at least one standard cell of the first and second groups of standard cells are arranged at different spacings and/or pitches.
Inventor(s): Jun Hyoung KIM of Seoul (KR) for samsung electronics co., ltd., Young-Jin KWON of Suwon-si (KR) for samsung electronics co., ltd., Geun Won LIM of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L21/768, H10B43/27, H10B43/40
Abstract: a semiconductor device, in which a cell array region and an extension region are arranged along a first direction, and in which contact regions and through regions are alternately arranged along the first direction in the extension region, including: a mold structure including a plurality of first insulating patterns and a plurality of gate electrodes, which are alternately stacked on a first substrate; a channel structure penetrating the mold structure in the cell array region to intersect the plurality of gate electrodes; respective gate contacts that are on the mold structure in the contact regions and are connected to each of the gate electrodes; and a plurality of second insulating patterns, the second insulating patterns being stacked alternately with the first insulating patterns in the mold structure in the through regions, the plurality of second insulating patterns including a different material from the plurality of first insulating patterns.
Inventor(s): Inhyung SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaegwon Jang of Suwon-si (KR) for samsung electronics co., ltd., Yeonho Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L23/31, H01L23/498, H01L25/10
Abstract: a semiconductor package includes a base structure having a fan-in area and fan-out areas surrounding the fan-in area, a semiconductor chip in the fan-in area, a package body layer in the fan-in area and the fan-out areas and covering the semiconductor chip, a redistribution structure on the package body layer, and alignment marks on the redistribution structure in a plan view. each of the alignment marks includes a plurality of metal layers, and a plurality of auxiliary patterns are in the redistribution structure under the alignment marks to assist in recognition of the alignment marks.
20240088075.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunkyoung SEO of Cheonan-si (KR) for samsung electronics co., ltd., Teak Hoon LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Chajea JO of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H01L25/10
Abstract: a semiconductor package includes a sequential stack of first and second semiconductor chips, and a first internal connection member that connects the first and second semiconductor chips to each other. the first semiconductor chip includes a first substrate that has a first top surface and a first bottom surface that are opposite to each other, and a first conductive pad on the first top surface. the second semiconductor chip includes a second substrate that has a second top surface and a second bottom surface that are opposite to each other, and a second conductive bump on the second bottom surface. the first internal connection member connects the first conductive pad to the second conductive bump. the first conductive pad has a first width in one direction. the second conductive bump has a second width in the one direction. the first width is smaller than the second width.
20240088082.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sang Ho Cha of Suwon-si (KR) for samsung electronics co., ltd., Yun-Rae Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/522, H01L23/544, H01L25/065
Abstract: a semiconductor package, including a substrate extending in first direction and a second direction intersecting the first direction and including a solder resist layer having an open area thereon; a semiconductor chip on the substrate in a third direction, the third direction intersecting the first direction and the second direction, a first surface of the semiconductor chip facing the substrate; and a bump structure in contact with a first connection pad on the open area and a second connection pad on the first surface of the semiconductor chip, and configured to connect the substrate to the semiconductor chip, wherein the open area includes a first area and a second area disposed in a peripheral part of the first area, and wherein a length of the first area in the first direction is greater than a length of the second area in the first direction.
20240088092.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaekyung Yoo of Suwon-si (KR) for samsung electronics co., ltd., Woohyeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Jayeon Lee of Suwon-si (KR) for samsung electronics co., ltd., Chungsun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/31, H01L23/498, H01L23/538
Abstract: a semiconductor package includes a redistribution substrate having a first surface including first and a second regions and a second surface opposite to the first surface, and including a first redistribution layer, first and second semiconductor chips positioned in a first direction on the first region the redistribution substrate, each of the first and second semiconductor chips being electrically connected to the first redistribution layer, a first molding layer on the first region on the first and second semiconductor chips, a redistribution structure on the first molding layer and including a second redistribution layer, conductive posts on the first region and electrically connecting the first redistribution layer to the second redistribution layer, third and fourth semiconductor chips positioned in a second direction, intersecting the first direction, and each electrically connected to the second redistribution layer, and a second molding layer on the second region the redistribution substrate and on the third and fourth semiconductor chips.
Inventor(s): Hyojin Yun of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Seokbong Park of Suwon-si (KR) for samsung electronics co., ltd., Sechul Park of Suwon-si (KR) for samsung electronics co., ltd., Junyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Teahwa Jeong of Suwon-si (KR) for samsung electronics co., ltd., Juil Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/538
Abstract: a semiconductor package includes a substrate including a first region, a second region in contact with the first region with the first and second regions stacked in a first direction, and a third region extending from the first and second regions in a second direction, perpendicular to the first direction, to connect the first and second regions to each other in bent form, a first semiconductor chip on a first side opposite to a second side of the first region in contact with the second region, a second semiconductor chip on a first side opposite to a second side of the second region in contact with the first region, a first molding member on the first region and covering at least a portion of the first semiconductor chip, and a second molding member on the second region and covering at least a portion of the second semiconductor chip.
Inventor(s): JIHOON KIM of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/31, H01L23/48
Abstract: a semiconductor package includes a first semiconductor chip and a second semiconductor chip. the first semiconductor chip includes a peripheral region having a groove and a bonding region that is disposed higher than the groove. the second semiconductor chip is disposed in the bonding region of the first semiconductor chip. the second semiconductor chip is directly electrically connected to the first semiconductor chip. the second semiconductor chip includes an overhang protruded from the bonding region. the overhang is spaced apart from a bottom surface of the groove. thus, a bonding failure, which may be caused by particles generated during a cutting the wafer and adhered to the edge portion of the second semiconductor chip, between the first semiconductor chip and the second semiconductor chip might be avoided.
20240088108.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonghyun BAEK of Suwon-si (KR) for samsung electronics co., ltd., Yuduk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/498
Abstract: a semiconductor package includes: a base chip; semiconductor chips disposed on the base chip and including front pads disposed on a front surface opposing the base chip, rear pads disposed on a rear surface opposing the front surface, and through-vias; bumps disposed between the semiconductor chips; a dam structure disposed on at least a portion of the rear pads; and insulating adhesive layers at least partially surrounding the bumps and the dam structure, wherein the rear pads include first pads that are disposed in a center region that crosses a center of the rear surface and that are electrically connected to the through-vias, and second pads that are disposed in a peripheral region adjacent to the center region, wherein the second pads include a line pad of which at least a portion has a polygonal shape, and wherein the dam structure has a bent shape.
20240088118.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Manho LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Eunseok SONG of Hwaseong-si (KR) for samsung electronics co., ltd., Keung Beum KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Kyung Suk OH of Seongnam-si (KR) for samsung electronics co., ltd., Eon Soo JANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/48, H01L23/522, H01L23/528, H01L27/01
Abstract: a semiconductor package including a first semiconductor chip including a logic structure and a second semiconductor chip bonded to the first semiconductor chip may be provided. the first semiconductor chip may include signal lines on a first surface of a first semiconductor substrate and connected to the logic structure, a power delivery network on a second surface of the first semiconductor substrate, the second surface being opposite to the first surface, and penetration vias penetrating the first semiconductor substrate and connecting the power delivery network to the logic structure. the second semiconductor chip may include a capacitor layer that is on a second semiconductor substrate and is adjacent to the power delivery network.
20240088150.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yeondo Jung of Suwon-si (KR) for samsung electronics co., ltd., Chul Kim of Suwon-si (KR) for samsung electronics co., ltd., Kichul Kim of Suwon-si (KR) for samsung electronics co., ltd., Gwirim Park of Suwon-si (KR) for samsung electronics co., ltd., Haejun Yu of Suwon-si (KR) for samsung electronics co., ltd., Chaeyeong Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyungin Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
Abstract: an integrated circuit device includes a pair of fin-type active regions, which extend in a first horizontal direction on a substrate, and a fin isolation insulator between ones of the pair of fin-type active regions to extend in a second horizontal direction that intersects with the first horizontal direction. the fin isolation insulator includes a first nitrogen-rich barrier film having at least one protrusion at a position that is higher than respective top surfaces of each of the pair of fin-type active regions with respect to the substrate, and a second nitrogen-rich barrier film, which is spaced apart from the first nitrogen-rich barrier film and is in a space defined by the first nitrogen-rich barrier film.
20240088176.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsub SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/57, H04N25/77, H04N25/78
Abstract: an image sensor includes a pixel array in which a plurality of pixels are arranged, wherein each of the pixels includes a photodiode, a transfer transistor, first to third floating diffusion nodes, a first capacitor, a second capacitor, a third capacitor, a first switch transistor, a second switch transistor, and a reset transistor. the second switch transistor is configured to turn off in a first period and to turn on in a second period of an exposure period of the photodiode, and the reset transistor is configured to turn on in the first period and to turn off in the second period of the exposure period of the photodiode.
20240088181.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jehyung Ryu of Suwon-si (KR) for samsung electronics co., ltd., Hajin Lim of Suwon-si (KR) for samsung electronics co., ltd., Taeksoo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: provided is an image sensor including a semiconductor substrate including a first pixel and a second pixel adjacent to the first pixel, a pixel isolation structure between the first pixel and the second pixel, an anti-reflection layer on the first pixel, the second pixel, and the pixel isolation structure, and a through via structure in a through via hole that is in the anti-reflection layer and the semiconductor substrate. the through via structure may include a first conductive layer on an inner wall of the through via hole, and a second conductive layer on the first conductive layer on the inner wall of the through via hole, and the anti-reflection layer may include tio, and the first conductive layer may include a material having a higher work function than ti.
20240088200.INTEGRATED CIRCUIT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeewoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Hojun Kim of Suwon-si (KR) for samsung electronics co., ltd., Taiko Yamaguchi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/08, H01F27/28, H01F27/29, H01L23/522, H01L23/58
Abstract: an integrated circuit including an inductive element according to some embodiments is provided. the inductive element includes a first through electrode extending in a first direction that is perpendicular to a substrate (e.g., an upper surface of the substrate), an upper metallization pattern connected to the first through electrode and extending in a second direction that is perpendicular to the first direction, and a lower metallization pattern connected to the first through electrode and extending in the second direction, wherein the upper metallization pattern and the lower metallization pattern are spaced apart from each other with the first through electrode therebetween.
Inventor(s): Jeonggyu SONG of Seongnam-si (KR) for samsung electronics co., ltd., Younsoo KIM of Yongin-si (KR) for samsung electronics co., ltd., Jooho LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Narae HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: provided is a semiconductor device including a lower electrode, an upper electrode isolated from direct contact with the lower electrode, and a dielectric layer between the lower electrode and the upper electrode, the dielectric layer comprising a first metal oxide area, a second metal oxide area, and a third metal oxide area. the third metal oxide area is between the first metal oxide area and the second metal oxide area, and includes boron and one or more metal elements selected from aluminum (al), magnesium (mg), silicon (si), or beryllium (be). in the third metal oxide area, a content of boron (b) is less than or equal to a content of the metal elements of al, mg, si, and/or be.
20240088219.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Pilkwang KIM of SUWON-SI (KR) for samsung electronics co., ltd., Seunghyun SONG of HWASEONG-SI (KR) for samsung electronics co., ltd., Yoonsuk KIM of SUWON-SI (KR) for samsung electronics co., ltd., Gwangjun KIM of SUWON-SI (KR) for samsung electronics co., ltd., Jaemin KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/08, H01L29/423, H01L29/775, H01L29/786
Abstract: a semiconductor device includes an active region, a plurality of channel layers spaced apart from each other on the active region, a gate structure including a gate dielectric layer and a gate electrode, and source/drain regions on both sides of the gate structure. the gate structure includes an upper portion and lower portions. a first lower portion of the lower portions has a first lower surface, a first upper surface, and first and second side surfaces. each of the first and second side surfaces includes a first inclined portion sloped at a first acute angle from the first lower surface and a second inclined portion sloped at a second acute angle from the first upper surface. the gate dielectric layer includes portions disposed between the gate electrode and the plurality of channel layers and between the gate electrode and the source/drain regions.
20240088239.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sang-Yong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin-Hong Park of Seoul (KR) for samsung electronics co., ltd., Ju-Hee Lee of Ansan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/775, H01L29/786
Abstract: a semiconductor device includes a substrate. a first channel pattern is disposed on the substrate. the first channel pattern includes a first side and a second side opposite to each other in a first direction. a first gate electrode is disposed on the first side of the first channel pattern. a first source/drain electrode is disposed on the first side of the first channel pattern. a second source/drain electrode is disposed on the second side of the first channel pattern. the first gate electrode overlaps the second source/drain electrode in the first direction.
Inventor(s): Jinseong HEO of Seoul (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd., Taehwan MOON of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun JO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/51, H01L21/28
Abstract: an electronic device includes a seed layer including a two-dimensional (2d) material, and a ferroelectric layer on the seed layer. the ferroelectric layer is configured to be aligned in a direction in which a (111) crystal direction is perpendicular to a top surface of a substrate on which the seed layer is located and/or a top surface of the seed layer.
Inventor(s): Sungwoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Dongryul CHANG of Suwon-si (KR) for samsung electronics co., ltd., Byoungchul PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyesoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungrey WI of Suwon-si (KR) for samsung electronics co., ltd., Yunjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwangil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaesang CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hayeong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Soonchoel HER of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/40
Abstract: a method of manufacturing an integrated circuit device includes forming a dummy gate insulating layer on first to third active regions of a substrate, forming first to third dummy gates on the first to third active regions, respectively, forming an inter-gate insulating layer covering the first to third dummy gates, forming a third gate space by removing the third dummy gate while the first and second dummy gates are covered, forming an extra gate insulating layer on the dummy gate insulating layer exposed to the third gate space, forming first and second gate spaces by removing the first and second dummy gates while the third dummy gate is covered, removing a first portion of the dummy gate insulating layer exposed to the first gate space while the second and third gate spaces are covered, and forming a gate insulating layer and a gate electrode in the gate spaces.
20240088264.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/06, H01L29/08, H01L29/417, H01L29/423, H01L29/775
Abstract: disclosed is a semiconductor device comprising a substrate that comprises an active pattern, a channel pattern on the active pattern and comprising a plurality of semiconductor patterns that are spaced apart from and vertically stacked on each other, a source/drain pattern electrically connected to the plurality of semiconductor patterns, a gate electrode on the plurality of semiconductor patterns and comprising a plurality of electrodes that are respectively below respective ones of the plurality of semiconductor patterns, the plurality of electrodes comprising a lowermost first electrode and a second electrode on the first electrode, and a first spacer between the first electrode and the source/drain pattern, wherein a horizontal width of the first electrode is less than a horizontal width of the second electrode.
20240088295.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junggun YOU of Ansan-si (KR) for samsung electronics co., ltd., Yoonjoong KIM of Seoul (KR) for samsung electronics co., ltd., Seungwoo DO of Yongin-si, (KR) for samsung electronics co., ltd., Sungil PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L29/10
Abstract: a semiconductor device including a substrate that includes first to third regions; a first channel structure on the first region and including first channel patterns that are vertically stacked on the substrate; a second channel structure on the second region and including a second channel pattern on the substrate; a third channel structure on the third region and including third channel patterns and fourth channel patterns that are vertically and alternately stacked on the substrate; first to third gate electrodes on the first to third channel structures; and first to third source/drain patterns on opposite sides of the first to third channel structures, wherein the first, second, and fourth channel patterns include a first semiconductor material, and the third channel patterns include a second semiconductor material different from the first semiconductor material.
Inventor(s): Eunhye KIM of Suwons-si (KR) for samsung electronics co., ltd., Sangmoo Park of Suwon-si (KR) for samsung electronics co., ltd., Dongyeob Lee of Suwon-si (KR) for samsung electronics co., ltd., Yoonsuk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/40, H01L25/075, H01L33/62
Abstract: a display module includes a thin film transistor (tft) substrate including a glass substrate, a tft layer provided at a front surface of the glass substrate and comprising a tft electrode pad, and a driving circuit provided at a rear surface of the glass substrate and configured to drive the tft layer, at least one light-emitting diode (led) comprising at least one led electrode pad, and a junction structure provided between the at least one led electrode pad and the tft electrode pad. the junction structure is formed in a metallically bonded state.
Inventor(s): Woongeun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jungsik PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M10/42, H01M50/178, H01M50/211, H01M50/55, H01M50/553, H05K1/02
Abstract: an electronic device is provided. the electronic device includes a housing, a main circuit board, a battery, a battery protection module disposed on one side surface of the battery, a protective holder that surrounds at least part of the battery protection module, and a flexible printed circuit board that extends from one side surface of the battery protection module and that is connected to the main circuit board. the flexible printed circuit board includes a first portion extending from the battery protection module in a second direction perpendicular to a first direction toward the main circuit board, a second portion extending from the first portion while being bent, a third portion extending from the second portion in a third direction opposite to the second direction, a fourth portion extending from the third portion in the first direction, and a connector connected to an end portion of the fourth portion and connected to the main circuit board.
Inventor(s): Seongil LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Yongsub JEON of Gyeonggi-do (KR) for samsung electronics co., ltd., Gusup KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngho SEO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01M50/581, H01M50/105, H01M50/119, H01M50/178, H01M50/186
Abstract: according to certain embodiments, a battery comprises: a case comprising an internal space and a metal layer; and an electrode assembly at least partially disposed in the internal space, the electrode assembly comprising a first electrode tab and a second electrode tab; a first critical temperature resistor (ctr) disposed on the first electrode tab and a second ctr disposed in on the second electrode tab, wherein the first ctr and the second ctr overlap an edge of the case, wherein at least one of the first electrode tab and the second electrode tab are configured to be electrically connected to an external component, thereby forming a first conductive path between the electrode assembly and the external component, and wherein the first ctr and the second ctr are electrically connected to the metal layer.
Inventor(s): Sungchul PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Wonjoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/42, H01Q3/36, H01Q21/06
Abstract: an electronic device, according to one embodiment of the present invention, may comprise: a first dielectric which forms at least a part of the front surface of the electronic device; a second dielectric which forms at least a part of the rear surface of the electronic device; a side surface member which surrounds a space formed between the front surface and the rear surface and of which a part comprises a third dielectric; a display positioned in the space and visually exposed through the first dielectric; and an antenna module positioned in the space. the antenna module comprises: a printed circuit board comprising a first surface which faces, in the space, the third dielectric, and a second surface which is oriented in a direction opposite to that of the first surface; and at least one antenna element which is disposed on the first surface or inside the printed circuit board so as to be adjacent to the first surface, and which forms a beam pattern toward the side surface member. in addition, other various embodiments are possible.
20240088575.ELECTRONIC DEVICE COMPRISING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonbin HONG of Pohang-si (KR) for samsung electronics co., ltd., Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JO of Suwon-si (KR) for samsung electronics co., ltd., Dongkwon CHOI of Pohang-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/28, H01Q1/24, H01Q1/38, H01Q3/30
Abstract: an electronic device is provided. the electronic device includes a wireless communication circuit, a plurality of antennas, and a processor, a first antenna including a first conductive portion, a second conductive portion, a third conductive portion, a first conductive stub including a first portion extending in a direction parallel to a printed circuit board (pcb) with the third conductive portion at a first end of the third conductive portion contacting a first conductive portion and a portion bending at one end of the first portion and extending to a third point of the pcb, and a second conductive stub including a second portion extending in a direction parallel to the pcb with the third conductive portion at a second end of the third conductive portion contacting a second conductive portion and a portion bending at one end of the second portion and extending to a fourth point of the pcb.
Inventor(s): Min Sang PARK of Yongin-si (KR) for samsung electronics co., ltd., Dongjin KEUM of Seoul (KR) for samsung electronics co., ltd., Byoungmook KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M1/00, H02M3/157, H02M3/158
Abstract: an apparatus configured to measure a load current provided to a load of a switching converter includes a pulse generation circuit configured to generate a control pulse based on a power switch driving signal of the switching converter, a reference current generation circuit configured to generate a reference current based on the control pulse, a clock generation circuit configured to generate a clock signal based on the control pulse and the reference current, and a clock counter configured to count the number of cycles of the clock signal during a switching period of the switching converter. the reference current generation circuit is configured to adjust the reference current to compensate for a leakage current generated in the clock generation circuit during the switching period.
Inventor(s): Hyun Seok NAM of Suwon-si (KR) for samsung electronics co., ltd., Jeong Woon KONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158, H02H1/00, H02H7/12, H02M1/088
Abstract: a switching regulator is provided. the switching regulator comprises a switching controller configured to activate a switching conversion operation based on an enable signal, a gate driver configured to generate first and second gate signals under control of the switching controller and a switching circuit configured to convert an input voltage applied to an input voltage node to a output voltage. the switching circuit includes a p-type transistor connected between the input voltage node and a switching node and gated based on the first gate signal, an n-type transistor connected between the switching node and a power ground terminal and gated based on the second gate signal and an inductor connected between the switching node and an output node and configured to output the output voltage.
Inventor(s): Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd., Ho Bin LEE of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H03M7/30, G06F3/06, H03M7/46
Abstract: a storage device is disclosed. the storage device may comprise storage for input encoded data. a controller may process read requests and write requests from a host computer on the data in the storage. an in-storage compute controller may receive a predicate from the host computer to be applied to the input encoded data. a transcoder may include an index mapper to map an input dictionary to an output dictionary, with one entry in the input dictionary mapped to an entry in the output dictionary, and another entry in the input dictionary mapped to a “don't care” entry in the output dictionary.
Inventor(s): HORANG JANG of SUWON-SI (KR) for samsung electronics co., ltd., BEOMWOO LEE of SUWON-SI (KR) for samsung electronics co., ltd., SOOMIN LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H03F3/45
Abstract: a communication device includes a first device and a second device. the first device includes a transmitting circuit configured to output and transmit a differential signal including a first signal and a second signal to the second device using an input signal and an enable signal. the second device includes a first amplifier configured to receive the differential signal from the first device, a gate circuit configured to gate an output signal of the first amplifier based on a deactivated reset signal, and a count circuit configured to: (1) count a section in which a value of the differential signal is constant based on a clock signal and an output signal of the gate circuit and (2) generate an activated reset signal when the count of the section exceeds a threshold value.
Inventor(s): Hongmin Choi of Suwon-si (KR) for samsung electronics co., ltd., Heesang Noh of Suwon-si (KR) for samsung electronics co., ltd., Kyungwoo Yoo of Suwon-si (KR) for samsung electronics co., ltd., Hyungsun Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04
Abstract: a wireless communication device includes a pre-distortion circuit configured to generate a pre-distortion signal by pre-distorting an input signal based on a pre-distortion coefficient, a power amplifier configured to generate an output signal by amplifying the pre-distortion signal, a measurement circuit configured to measure a magnitude of a first frequency component of a first adjacent channel and a magnitude of a second frequency component of a second adjacent channel of the output signal, a filtering circuit, that includes an error filter, configured to generate a filtered error signal by filtering an error signal that is based on the input signal and the output signal, the error filter is configured based on the magnitude of the first frequency component and the magnitude of the second frequency component, and a pre-distortion coefficient update circuit configured to update the pre-distortion coefficient based on the error signal or the filtered error signal.
Inventor(s): Caleb K. Lo of San Jose CA (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Ravindranath Kanamangala of Murphy TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
Abstract: methods and apparatuses for support of machine learning (ml) or artificial intelligence (ai) assisted channel state information (csi) feedback. a method performed by a user equipment (ue) includes transmitting capability information indicating a capability of the ue to support a ml based parameter configuration associated with csi reports; receiving configuration information that indicates parameters for the ml based parameter configuration associated with the csi reports; and receiving csi reference signals (rss). the method further includes measuring the csi-rss; determining, based on the configuration information, the measured csi-rss, and information related to localized observations of channel statistics in one or more domains, configuration parameters in the one or more domains for the csi reports; determining, based on the configuration parameters in the one or more domains, a csi report; and transmitting the csi report.
Inventor(s): Yan LI of Beijing (CN) for samsung electronics co., ltd., Huiyang WANG of Beijing (CN) for samsung electronics co., ltd., Meifang JING of Beijing (CN) for samsung electronics co., ltd., Jiajia WANG of Beijing (CN) for samsung electronics co., ltd., Yi ZHAO of Beijing (CN) for samsung electronics co., ltd., Xiaohui YANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0408, H04B17/336
Abstract: the disclosure relates to a method performed by an electronic device of a base station. the method includes: obtaining beam priority information of a plurality of beams for a plurality of user equipments (ues); obtaining inter-beam interference information of the plurality of beams; identifying, based on the beam priority information and the inter-beam interference information, one of a plurality of beam pairing sets comprising two or more beams among the plurality of beams; and performing communication with at least one of the plurality of ues via the identified beam pairing set.
Inventor(s): Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W72/044, H04W72/23, H04W72/53
Abstract: methods and apparatuses for a multi-beam downlink and uplink wireless system. a method of a user equipment includes receiving configuration information for one or more transmission configuration indication (tci) states and corresponding tci state identifiers (ids) and receiving one or more tci state ids. the method also includes determining, based on the one or more tci state ids, at least one of one or more first spatial domain filters for reception of one or more layers, respectively, of a downlink channel and one or more second spatial domain filters for transmission of one or more layers, respectively, of an uplink channel. the method further includes at least one of receiving the one or more layers of the downlink channel using the one or more first spatial domain filters, respectively, and transmitting the one or more layers of the uplink channel using the one or more second spatial domain filters, respectively.
Inventor(s): Sung Ung KWAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/32, G06F21/60, G06F21/72, G06F21/75
Abstract: an integrated circuit for a physically unclonable function (puf) includes a controller configured to generate a control signal with reference to an address table, the address table representing a first mapping relationship between a first puf cell group and a second puf cell group having a first predetermined mismatch distance in relation to a puf cell characteristic, and representing a second mapping relationship between a third puf cell group and a fourth puf cell group having a second predetermined mismatch distance in relation to the puf cell characteristic; and a puf block configured to provide puf cell data groups in accordance with the first and second mapping relationships to the controller, in response to the control signal. the controller may be configured to generate an authentication key by respectively comparing the puf cell data groups with reference data groups.
Inventor(s): Byounggyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Taejeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Kidoc SON of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan SONG of Suwon-si (KR) for samsung electronics co., ltd., Garam LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
Abstract: an electronic device may include a first housing, a second housing slidably coupled to the first housing along a first direction, and a flexible display disposed to be supported by the first housing and the second housing. the electronic device may include a support member disposed under the flexible display to support at least a portion of the flexible display. the support member may include an elastic body including a first surface facing the flexible display and a second surface facing the opposite direction to the first surface, and a plurality of shafts at least partially embedded in the elastic body and spaced apart from each other at predetermined intervals, and each of the plurality of shafts may be disposed to have a length in a second direction perpendicular to the first direction.
Inventor(s): Hyunjoon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Minho Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongouk Moon of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung Ji of Suwon-si (KR) for samsung electronics co., ltd., Sanghwa Jin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/159, G06V10/25, G06V10/74, G06V40/16, H04N19/46
Abstract: an operating method of a storage device, includes: receiving decoded data from a codec; determining whether the decoded data includes a region of interest (roi); based on determining the roi is included in the decoded data, determining whether the decoded data includes a first background region, other than the roi, identical to a second background region of an adjacent frame; based on determining the first background region is identical to the second background region, determining a similarity for the roi between the decoded data and the adjacent frame; determining whether the similarity is lower than a reference value; and based on determining the similarity is lower than the reference value, generating detection information indicating that the decoded data is faked.
Inventor(s): Keun Joo PARK of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiwon IM of Suwon-si (KR) for samsung electronics co., ltd., Junseok KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/182, H04N19/126, H04N19/132, H04N19/186
Abstract: an operation method of an image signal processing device includes receiving a raw pixel code from an external image sensor device including an image pixel, generating a non-linear pixel code by performing non-linear mapping on the raw pixel code, and outputting a downsized pixel code obtained by performing a masking operation on bit positions including a first bit position corresponding to a most significant bit of the non-linear pixel code and a second bit position corresponding to a least significant bit of the non-linear pixel code. an amplitude of the raw pixel code is linear to illuminance of a light incident onto the image pixel, an amplitude of the non-linear pixel code is non-linear to the amplitude of the raw pixel code, and the non-linear pixel code has a first code length, and the downsized pixel code has a second code length smaller than the first code length.
Inventor(s): Seungeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonhee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/513, H04N19/105, H04N19/137, H04N19/172
Abstract: disclosed are an apparatus and method with video processing. a computing apparatus includes one or more processors and storage storing instructions configured to, when executed by the one or more processors, cause the one or more processors to: generate cluster maps using clusters generated by performing clustering, wherein the generating the cluster maps performed based on a reference frame of a video generated based on a previous point in time of the video, generate a predicted frame by performing motion compensation based on the cluster maps, and generate a decoded frame by performing decoding based on the current frame and the predicted frame.
Inventor(s): Anton Nikolaevich SOFRONOV of St. Petersburg (RU) for samsung electronics co., ltd., Sergey Nikolaevich KOPTYAEV of Nizhniy Tagil (RU) for samsung electronics co., ltd., Maxim Vladimirovich RYABKO of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): H04N23/11, G01J5/0818, G01J5/24
Abstract: a thermal sensor, a thermal sensor array, an electronic apparatus including the thermal sensor, and an operating method of the thermal sensor are provided. the thermal sensor includes a first region onto which first infrared light is incident, a visible light radiation region configured to radiate visible light generated by incidence of the first infrared light on the first region, a second region onto which second infrared light is incident, and an image sensor configured to receive the visible light radiated from the visible light radiation region. the first region, the second region, and the visible light radiation region each include a nonlinear optical material.
Inventor(s): Jihyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jisu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/63, H04N5/76, H04N23/62, H04N23/667
Abstract: disclosed is an electronic device comprising: a camera, a display, at least one processor, and memory, wherein the memory can store instructions that, when executed by one or more of the at least one processor, cause the electronic device to: display a timeline of first content in a first area displayed via the display; display, in a second area displayed via the display, a preview screen of the first content on the timeline, wherein the first content corresponds to a first indicator indicating a position on the timeline displayed in the first area; display second content received via the camera in the second area based on an input while maintaining the display in the first area; and record the second content, displayed in the second area, based on an input on a first icon displayed via the display, wherein the second content is recorded starting from a portion corresponding to the first indicator.
Inventor(s): Ibrahim Pekkucuksen of Plano TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04N23/72, H04N23/741
Abstract: a method includes obtaining, using at least one processing device of an electronic device, multiple image frames having different exposure levels. the method also includes determining whether a moving saturated region is present in at least some of the image frames. the method further includes selecting one of the image frames as a reference frame, where the selected image frame depends on whether the moving saturated region is present in at least some of the image frames. the selected image frame may have a first exposure level when the moving saturated region is present in at least some of the image frames, and the selected image frame may have a second exposure level longer than the first exposure level when the moving saturated region is not present in the image frames.
Inventor(s): Taekseong JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/741, G06T7/246, G06V40/16, H04N5/265, H04N23/611, H04N23/62, H04N23/63, H04N23/71, H04N23/72, H04N23/73
Abstract: an electronic device may include: a camera; a display; and at least one processor electrically connected to the camera and the display. the at least one processor may: display, on the display, as a preview image, an image acquired by driving the camera; determine a first region in the preview image to be a main region; by varying the field of view of the camera, acquire, according to a predetermined sequence, a plurality of images corresponding to the respective plurality of fields of view; acquire a first image for the first region by using the camera; and generate a result image on the basis of the acquired plurality of images and first image, wherein at least a portion of the first image may overlap with at least one of the plurality of images. other various embodiments are possible as identified in the specification.
20240089626.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): EUN SUB SHIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/709, H04N25/78
Abstract: an image sensor includes: a pixel including a boosting capacitor with one electrode connected to a first node to which a charge generated from a photoelectric element is transmitted, and outputting a pixel voltage based on the first node; a row driver outputting a reset-signal that resets the first node, a boosting control-signal applied to the other electrode, and a transmission-signal transmitting the charge to the first node; a read-out-circuit receiving the pixel voltage as a first-signal before the transmission-signal is output to the pixel, and receiving the pixel voltage as a second-signal after the transmission-signal is output to the pixel. a controller controlling the row driver to change the boosting control-signal from a first-level to a second-level lower than the first-level after changing the reset-signal from an enable to a disable, and controlling the read-out-circuit to receive the first-signal and the second-signal during which the boosting control-signal is at the second-level.
Inventor(s): Wontae JEONG of Suwon-si (KR) for samsung electronics co., ltd., Eungkyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongyeop LEE of Suwon-si (KR) for samsung electronics co., ltd., Yonghwa KIM of Suwon-si (KR) for samsung electronics co., ltd., Gihoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaehwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungbum CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyounggil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Changryong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02, H01F38/14, H01M50/209, H01M50/24, H05K5/00, H05K5/02, H05K5/03, H05K5/06
Abstract: an electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. the electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Diwakar SHARMA of Bangalore (IN) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/06, H04W72/0446, H04W72/0453, H04W72/232, H04W72/30
Abstract: embodiments herein disclose a method and apparatus for resource allocation in a wireless communication system supporting multicast and broadcast services (mbs). the method comprises receiving, from a base station, configuration information associated with the mbs, and receiving, from the base station, mbs data on a common frequency resource (cfr) configured based on the configuration information, wherein the cfr is configured in a unicast bandwidth part (bwp).
Inventor(s): Jeongyeob OAK of Suwon-si (KR) for samsung electronics co., ltd., Jisoo SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04W24/02
Abstract: a method and an apparatus for controlling user equipment (ue) context between a plurality of nodes are provided. the method includes transmitting, to a second node, a first message to request a user equipment (ue) context update, receiving, from the second node, a second message indicative of a completion of the ue context update or a third message indicative of a failure of the ue context update in response to the transmission of the first message, and determining whether to retransmit the first message to the second node based on the reception of the second message or the third message. the procedure of the ue context update may be initiated by the transmission of a message to request an operation of the ue context update to be performed between a ue and a third node from the second node to the third node.
Inventor(s): Sunghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W28/24, H04W36/00, H04W36/14
Abstract: the disclosure relates to a method and apparatus for monitoring and changing information about quality of service (qos) allowed to be supported to a user equipment (ue) in a mobile communication system, and an operating method of a target base station (bs) in the mobile communication system includes receiving, from a source bs, alternative quality of service (qos) profile (aqp) information, determining whether information matching qos information allowed to be supported for a ue to be served is included in the aqp information, and when the information matching the qos information allowed to be supported for the ue to be served is included in the aqp information, transmitting the matching information to an access and mobility management function (amf).
Inventor(s): Jajohn Mathew MATTAM of Bangalore (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/14, H04W48/16
Abstract: the present disclosure relates to a method and a user equipment (ue) for radio access network (ran) slicing in wireless. a method for a user equipment (ue) is provided. the method includes receiving, from a base station (bs), network slice information on a plurality of network slices supported by a serving cell of the ue and at least one neighbor cell from a plurality of cells via a broadcasted system information block (sib); identifying a priority order of the plurality of network slices based on the network slice information; selecting a cell based on the priority order of the plurality of network slices; and camping on the selected cell.
Inventor(s): Ji Young CHA of Gyeonggi-do (KR) for samsung electronics co., ltd., Hye Jeong KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jung Hoon AHN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W4/20
Abstract: an electronic device is provided. the electronic device includes a first communication circuit, a second communication circuit, a processor configured to be electrically connected with the first communication circuit and the second communication circuit, and a memory configured to be electrically connected with the processor. the memory includes instructions, when executed by the processor, cause the processor to obtain location information of the electronic device, transmit a first message for requesting to change a state of the electronic device to a network, receive a first response message to the transmitted first message from the network, transmit a second message for requesting a parameter for an operation cycle of the second communication circuit to the network, receive a second response message to the second message from the network, and change the operation cycle of the second communication circuit to a value corresponding to a current state of the electronic device.
Inventor(s): Jaemoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Seonyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunmim HWANG of Suswon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/24
Abstract: an electronic device according to various embodiments may include: at least one antenna; and at least one communication processor configured to support first network communication with a first network and second network communication with a second network different from the first network. the at least one communication processor may be configured to: identify a first cumulative sar value based on radiation of a communication signal corresponding to the first network communication via a first part of the at least one antenna and a second cumulative sar value based on radiation of a communication signal corresponding to the second network communication via a second part of the at least one antenna; and adjust one of a transmission intensity of a first communication signal corresponding to the first network communication or a transmission intensity of a second communication signal corresponding to the second network communication, based on a designated condition satisfied by the first cumulative sar value and the second cumulative sar value.
Inventor(s): Yinan QI of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W52/32, H04B7/0456, H04L5/00
Abstract: the disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). according to an embodiment of the disclosure, a method for operating a user equipment (ue) in a wireless communication system includes determining power of at least one phase tracking reference signal (pt-rs), and transmitting the at least one pt-rs according to non-codebook based transmission. herein, the power is determined based on a number of at least one port for the at least one pt-rs.
Inventor(s): Jungshin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd., Youngkyo BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W60/00, H04W12/06, H04W48/20
Abstract: the disclosure provides a method of registering a user equipment (ue) at a second network via a first network, the method including: receiving, from the ue, a registration request message including at least one of first network identification (id) information, id information of the ue in the first network, second network id information, and id information of the ue in the second network; selecting an authentication server function (ausf) of the first network which is configured to perform a first authentication procedure of service subscription authentication for the ue in the first network; performing the first authentication procedure with the ausf of the first network and unified data management (udm) of the first network; determining, based on a result of the first authentication procedure, whether to perform a second authentication procedure of service subscription authentication for the ue in the second network; performing, based on a result of the determining, the second authentication procedure with an ausf of the second network and udm of the second network; and transmitting, to the ue, a registration acceptance message including information of at least one of the result of the first authentication procedure and a result of the second authentication procedure.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04W68/02, H04W72/232
Abstract: methods and apparatuses for positioning in rrc_idle or rrc_inactive states. a method of a user equipment (ue) in a wireless communication system includes determining a first set of configurations for positioning and determining a second set of configurations for positioning. the first and second sets of configurations include configurations for a downlink (dl) positioning reference signal (prs) based positioning measurement or an uplink (ul) sounding reference signal (srs) transmission. the method further includes receiving a downlink control information (dci) format including an indication on which of the first or second sets of configurations to use for positioning.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Mangesh Abhimanyu INGALE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/00, H04W76/28
Abstract: a communication method and system for converging a fifth generation (5g) communication system for supporting higher data rates beyond a fourth generation (4g) system with a technology for internet of things (iot) are provided. the communication method and system may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method of a terminal receiving a paging message is provided. in addition, a method of a terminal acquiring system information is provided.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W48/18, H04W74/08, H04W76/28
Abstract: the present disclosure relates to a pre-5th generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th generation (4g) communication system such as long term evolution (lte). embodiments herein provide a method for paging collision avoidance. the method includes detecting a potential paging collision between a first rat network and a second rat network, wherein the first rat network is associated with a first sim and the second rat network is associated with a second sim, determining and selecting one of the first rat network and the second rat network for avoiding the paging collision based on a paging collision avoidance criteria, and sending a signaling message to one of the selected first rat network and the selected second rat network to avoid the paging collision between the first rat network and the second rat network.
Inventor(s): Jeongho YEO of Suwon-si (KR) for samsung electronics co., ltd., Younsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Hosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L1/1812, H04L1/1867, H04L27/26, H04W72/0446, H04W72/0453, H04W72/23
Abstract: the disclosure relates to a communication technique that converges a 5g communication system for supporting a higher data rate after a 4g system with iot technology, and a system thereof. the disclosure can be applied to intelligent services (e.g., smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail business, security and safety related services, and the like) based on 5g communication technology and iot related technology. the disclosure discloses a method and device for a terminal to perform satellite communication.
Inventor(s): Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L5/14, H04W72/0446, H04W72/23, H04W72/566
Abstract: methods are disclosed for enhanced physical uplink control channel (pucch) transmission for 3generation partnership project (3gpp) new radio (nr) technologies.
Inventor(s): Yaser Mohamed Mostafa Kamal FOUAD of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Jungwon LEE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/20, H04J13/00, H04W4/40, H04W72/02
Abstract: a method and user equipment (ue) are provided. the method includes transmitting, from a first ue, an assistance request to at least one neighboring ue, receiving, by the first ue and from the at least one neighboring ue, assistance information including an indication of at least one resource for transmission, and transmitting, from the first ue, over the indicated at least one resource.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04L5/00, H04W16/14, H04W16/28
Abstract: methods and apparatuses for adapting a channel sensing threshold in a wireless communication system operating with shared spectrum channel access. a method for operating a base station (bs) includes determining whether an antenna configuration for channel sensing is omni-directional or directional and determining a channel sensing threshold. the channel sensing threshold includes two parts: a first part of the channel sensing threshold being common for omni-directional and directional antenna configurations and a second part of the channel sensing threshold depending on the antenna configuration. the method further includes performing a channel sensing procedure based on the antenna configuration and the channel sensing threshold and transmitting downlink (dl) data over a channel based on the channel being sensed as idle in the channel sensing procedure.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W28/06, H04W48/16, H04W48/18, H04W76/27
Abstract: a communication method and system for converging a fifth generation (5g) communication system for supporting higher data rates beyond a fourth generation (4g) system with a technology for internet of things (iot) are provided. the communication method and system may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method of a terminal for performing a random access procedure in a wireless communication system is provided. in addition, a method by a terminal for system information (si) request is provided. a method includes receiving, from a base station, information on resources for si request including information on a start index of at least one random access preamble for the si request; receiving, from the base station, at least one synchronization signal block (ssb); selecting an ssb among the at least one ssb; determining a preamble for the si request corresponding to the selected ssb based on the information on the start index; and transmitting, to the base station, the determined preamble based on a physical random access channel (prach) occasion corresponding to the selected ssb.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W76/27
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides method and apparatus for small data transmission.
Inventor(s): Bu-Seop JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jung-Hun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/11, H04L67/104, H04W8/00, H04W12/06, H04W48/16
Abstract: a method and an apparatus for wi-fi connection based on wi-fi protected setup (wps) in a portable terminal are provided. the method includes entering a group owner mode of wi-fi direct when enabling of wps is requested, after entering the group owner mode, entering a wps session mode where the portable terminal is operable in a wps registrar mode, determining whether an access point (ap) whose wps session of the wps registrar mode is enabled or a device whose group owner mode is enabled, exists nearby, and when an ap whose wps registrar mode is enabled is discovered, disabling the wps registrar mode and the group owner mode, enabling a wps session where the portable terminal is to operate in a wps enrollee mode, and accessing the discovered ap.
20240090062.METHOD AND DEVICE FOR NETWORK ACCESS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Xiaowan KE of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/18, H04W76/11, H04W76/19, H04W76/27
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). the embodiments of the present invention provide methods and devices for network access. the method includes receiving a first request message forwarded by a distributed unit in a base station and indication information of the distributed unit with respect to the first request message, the first request message requesting to connect a user equipment to a network; determining a processing to be performed on the first request message based on the indication information; and transmitting an indication of the determined processing to the distributed unit.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/19
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present application relates to the field of wireless communication technologies, and discloses a method for processing an radio link control (rlc) failure, an electronic device and a computer readable storage medium. the method includes: receiving, by a first network device, rlc failure related information of a user equipment (ue); processing the rlc failure correspondingly by interacting with a second network device, based on the received rlc failure related information.
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/27, H04W72/04, H04W72/56
Abstract: methods and apparatuses for signaling transmission configuration indication (tci) states. a method performed by a user equipment (ue) includes receiving, in a first radio resource control (rrc) signaling, a list of tci states comprising first and second groups of tci states; receiving, in a medium access control (mac) control element (ce), one or more sets of transmission configuration indication (tci) states; and receiving, in a downlink control information (dci), a tci codepoint indicating a set of one or more first indicated tci states or one or more second indicated tci states. the method further includes identifying, based on the first rrc signaling, the first and second groups of tci states; identifying, based on the tci codepoint in the dci, a set of one or more first and second applicable tci states; and transmitting or receiving a signal based on an applicable tci state from the identified set.
20240090093.COOKING APPLIANCE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Namsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyungkwen HAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/64, E05C3/00, E05C3/16
Abstract: a cooking appliance including a door; a key member on the door; a main body; and a latch device on the main body. the latch device includes a first lever, and a second lever that, when the door is being closed, is pressed by the key member to thereby cause the second lever to rotate in a first direction so as to press the first lever and thereby cause the first lever to rotate in the first direction. a spring holding portion is on the first lever. a first end of a spring is attached to the first lever and slidably held by the spring holding portion. a second end of the spring is attached to the body. the spring provides an elastic force to cause the first lever to rotate in a second direction opposite to the first direction when the door is being opened.
Inventor(s): Eunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yeram KIM of Suwon-si (KR) for samsung electronics co., ltd., Siwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinah KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyongsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seonbaek LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device may include an active pattern, a capacitor contact structure electrically connected to the active pattern, and a capacitor structure electrically connected to the capacitor contact structure. the capacitor structure may include a first lower electrode and a second lower electrode that are adjacent to each other, a supporter supporting the first and second lower electrodes, a capacitor insulating layer covering the first and second lower electrodes, and an upper electrode on the capacitor insulating layer. the supporter may include a first supporter curved sidewall connected to the first lower electrode and the second lower electrode, and the upper electrode may include an intervening electrode portion enclosed by the supporter. the first supporter curved sidewall may be convex toward the intervening electrode portion.
20240090199.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jingyu Park of Suwon-si (KR) for samsung electronics co., ltd., Jongyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Koh of Suwon-si (KR) for samsung electronics co., ltd., Kiyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Sundoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a first active pattern on a substrate, the first active pattern extending in a third direction having an acute angle with respect to a first direction and a second direction, the first direction and the second direction being substantially parallel to an upper surface of the substrate and substantially perpendicular to each other, a first conductive filling pattern on an upper surface of a central portion of the first active pattern, the first conductive filling pattern having a shape of a parallelogram, a gate structure extending in the first direction in an upper portion of the first active pattern, and a bit line structure on the first conductive filling pattern and extending in the second direction.
20240090200.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hanjin Lim of Suwon-si (KR) for samsung electronics co., ltd., Jungmin Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit device includes a transistor on a substrate and a capacitor structure electrically connected to the transistor, wherein the capacitor structure includes a first electrode including a first conductive material having a first work function, a dielectric layer on the first electrode, the dielectric layer including first metal, a second electrode on the first electrode with the dielectric layer therebetween and including a second conductive material having a second work function that is less than the first work function, and an interfacial layer between the dielectric layer and the second electrode, where an electrical energy barrier between the second electrode and the dielectric layer is increased by the interfacial layer relative to that of a direct interface therebetween.
Inventor(s): Jihoon CHANG of Suwon-si (KR) for samsung electronics co., ltd., Jaejoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Heonjun HA of Suwon-si (KR) for samsung electronics co., ltd., Jongmoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/522
Abstract: a semiconductor device includes a lower structure, an interlayer insulating layer on the lower structure, a conductive shielding line on the lower structure and penetrating through the interlayer insulating layer, a capping insulating layer on the interlayer insulating layer and the conductive shielding line, and a bit line on the lower structure and penetrating through the capping insulating layer and the interlayer insulating layer. an upper surface of the bit line is at a higher level than an upper surface of the conductive shielding line. a lower surface of the bit line is at a level equal to or lower than a level of a lower surface of the conductive shielding line.
Inventor(s): Soyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sung-Min HWANG of Suwon-si (KR) for samsung electronics co., ltd., Dong-Sik LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun CHO of Suwon-si (KR) for samsung electronics co., ltd., Bongtae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jae-Joo SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, H01L23/528, H10B41/10, H10B41/35, H10B43/10, H10B43/27, H10B43/35
Abstract: a semiconductor memory device includes a gate stack structure including insulating layers, a lower selection line and word lines, the word lines including a first word line adjacent to the lower selection line and a second word line on the first word line, a memory channel structure penetrating the gate stack structure, a plurality of first contact plugs electrically connected to the first word line, a plurality of second contact plugs electrically connected to the second word line, a first conductive line connected to the plurality of first contact plugs, and a second conductive line connected to one of the plurality of second contact plugs.
20240090219.VERTICAL MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongseon AHN of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Heesuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Yejin Park of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang Sim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27, H10B41/35, H10B41/41, H10B43/35, H10B43/40
Abstract: a vertical memory device includes: a lower pad pattern disposed on a substrate; a cell stack structure disposed on the lower pad pattern and including first insulation layers and gate patterns, wherein the cell stack structure has a stepped shape; a through cell contact including a first through portion and a first protrusion, wherein the first through portion passes through a portion of the cell stack structure, and wherein the first protrusion protrudes from the first through portion and contacts an uppermost gate pattern of the gate patterns; and a first insulation pattern at least partially surrounding a sidewall, of the first through portion, that is below the first protrusion, wherein the first insulation pattern is longer than the first protrusion in a horizontal direction from the first through portion, and wherein a vertical thickness of the first protrusion is greater than a vertical thickness of the uppermost gate pattern.
Inventor(s): Jaemin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Byongju KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghwa LEE of Suwon-si (KR) for samsung electronics co., ltd., Changheon CHEON of Suwon-si (KR) for samsung electronics co., ltd., Dongsung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, G11C5/06, G11C16/04, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/35, H10B43/40, H10B80/00
Abstract: a semiconductor device includes a plurality of gate electrodes spaced apart from each other in a vertical direction on a substrate, a plurality of channel structures respectively penetrating a plurality of gate electrodes and extending in the vertical direction, each comprising a channel layer having a stacked structure of a first oxide semiconductor channel layer and a second oxide semiconductor channel layer which have different conductivities, and a gate insulating layer disposed between the channel layer and each of the plurality of gate electrodes, and a plurality of bit lines disposed on the plurality of channel structures and respectively connected to the plurality of channel structures, and the gate insulating layer, the first oxide semiconductor channel layer, and the second oxide semiconductor channel layer are sequentially disposed.
Inventor(s): Euntaek JUNG of Seongnam-si (KR) for samsung electronics co., ltd., JoongShik Shin of Suwon-si (KR) for samsung electronics co., ltd., JiHye YUN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L21/28, H01L21/285, H01L21/768, H01L23/528, H01L23/532, H10B41/27, H10B41/35, H10B41/41, H10B43/35, H10B43/40
Abstract: a three-dimensional (3d) semiconductor memory device includes a source structure disposed on a horizontal semiconductor layer and including a first source conductive pattern and a second source conductive pattern which are sequentially stacked on the horizontal semiconductor layer, an electrode structure including a plurality of electrodes vertically stacked on the source structure, and a vertical semiconductor pattern penetrating the electrode structure and the source structure, wherein a portion of a sidewall of the vertical semiconductor pattern is in contact with the source structure. the first source conductive pattern includes a discontinuous interface at a level between a top surface of the horizontal semiconductor layer and a bottom surface of the second source conductive pattern.
Inventor(s): Hoyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sanghun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L23/522, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B80/00
Abstract: a semiconductor memory device comprises a first substrate, a peripheral circuit structure, and a cell array structure including a cell array region and a cell array contact region. the cell array structure includes a second substrate, a stack structure including first and second stack structures, a vertical channel structure in the cell array region, and a cell contact plug in the cell array contact region. the cell contact plug includes a first pillar part and a first protrusion part. at the level of the top surface of the first protrusion part, a first width is given as a maximum diameter at an outer perimeter of the first protrusion part. at a level of an interface between the first and second stack structures, a second width is given as a maximum width of the vertical channel structure. the first width is greater than the second width.
20240090240.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): TAKUYA FUTATSUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Daeseok Byeon of Suwon-si (KR) for samsung electronics co., ltd., Gyosoo Choo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/065, H01L25/18
Abstract: an integrated circuit (ic) device includes a peripheral circuit structure and cell array structure. the peripheral circuit structure includes a circuit substrate, a peripheral circuit, a first insulating layer covering the circuit substrate and the peripheral circuit, and a first bonding pad. the cell array structure includes an insulating structure having first and second surfaces opposing each other, a conductive plate on the first surface, a memory cell array on the conductive plate, a second insulating layer, a second bonding pad disposed on the second insulating layer, first and second wiring lines spaced apart from each other on the second surface, a conductive via passing through the insulating structure and connecting the conductive plate to the first wiring line, and a contact structure electrically connecting the first wiring line to the second bonding pad. the first bonding pad is in contact with the second bonding pad.
Inventor(s): Sung Woo KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Tae Ho KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., You Jung CHUNG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Taehyung KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Ilyoung LEE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Heejae LEE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Moon Gyu HAN of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/115, C09K11/54, C09K11/62, H10K50/16
Abstract: an electroluminescent device including a first electrode and a second electrode facing each other; a light emitting layer disposed between the first electrode and the second electrode; and an electron transport layer disposed between the light emitting layer and the second electrode. the light emitting layer includes a plurality of semiconductor nanoparticles, and the electron transport layer includes a plurality of zinc oxide nanoparticles, the zinc oxide nanoparticles further include magnesium and gallium.
20240090338.MAGNETIC MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungil HONG of Suwon-si (KR) for samsung electronics co., ltd., Junghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Gyuwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/10, G11C5/08, H10B61/00
Abstract: a magnetic memory device may include a substrate, an data storage pattern disposed on the substrate, and a lower contact plug between the substrate and the data storage pattern, the lower contact plug may include a lower insulating pattern, a lower contact pattern on the lower insulating pattern, and a lower barrier pattern extending along a lower surface and a side surface of the lower insulating pattern and a side surface of the lower contact pattern.
SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- A45C11/00
- H04B1/3888
- Samsung electronics co., ltd.
- A47L9/14
- A47L9/00
- A47L9/28
- A61B5/021
- A61B5/00
- A61B5/024
- A61H9/00
- A61H15/00
- A63F13/35
- A63F13/335
- G06F3/16
- G06T7/11
- B08B1/00
- B08B1/02
- B08B3/02
- B08B3/08
- B24B53/017
- H01L21/02
- B21D53/06
- B21D9/04
- B25J9/16
- B25J19/02
- G06V20/50
- G06V40/10
- G10L15/22
- H04R1/02
- H04R1/40
- H04R3/00
- B25J11/00
- B65G47/90
- D06F34/18
- D06F34/10
- D06F39/08
- D06F37/22
- D06F21/04
- D06F21/08
- D06F37/20
- D06F37/26
- D06F37/30
- D06F21/06
- F16H1/28
- F16H57/00
- D06F58/20
- B01D53/04
- D06F39/04
- D06F58/24
- D06F58/26
- D06F73/02
- F16M11/20
- F16M11/10
- F16M11/24
- F24C15/20
- F24F8/192
- B03C3/09
- B03C3/36
- B03C3/41
- F24F1/0353
- F24F8/30
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