18219244. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 INTEGRATED CIRCUIT DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18219244 titled 'INTEGRATED CIRCUIT DEVICE
Simplified Explanation
The patent application describes an integrated circuit device with multiple wiring structures on a substrate, each including a wiring layer, insulating pattern, capping layer, via layer, and interlayer insulating layer.
- The wiring structures extend in a first direction parallel to the substrate's upper surface.
- The insulating pattern surrounds the wiring layer's sidewall and is made of a first insulating material.
- The capping layer on top of the wiring layer is made of a conductive material.
- The via layer electrically connects the wiring structures.
- The interlayer insulating layer covers the insulating pattern's sidewall between each wiring structure, with an upper surface higher than the wiring layer and insulating pattern.
Potential Applications
This technology can be applied in the manufacturing of advanced integrated circuits, microprocessors, memory chips, and other electronic devices requiring complex wiring structures.
Problems Solved
This innovation solves the problem of signal interference and crosstalk in densely packed wiring structures on integrated circuits, improving overall performance and reliability.
Benefits
- Enhanced signal integrity - Increased circuit density - Improved electrical performance - Higher reliability and longevity
Potential Commercial Applications
"Advanced Wiring Structures for Integrated Circuits: Enhancing Performance and Reliability"
Possible Prior Art
Prior art in the field of integrated circuit manufacturing may include similar techniques for improving wiring structures' performance and reliability, such as insulating layers and capping layers.
Unanswered Questions
How does this technology impact power consumption in integrated circuits?
The article does not address the specific impact of this technology on power consumption in integrated circuits.
Are there any limitations to the size or complexity of circuits that can benefit from this technology?
The article does not mention any limitations regarding the size or complexity of circuits that can benefit from this technology.
Original Abstract Submitted
An integrated circuit device includes a plurality of wiring structures on a substrate and extending in a first direction parallel to an upper surface of the substrate and each including a wiring layer on the substrate and extending in a direction perpendicular to the upper surface of the substrate; an insulating pattern surrounding a sidewall of the wiring layer and including a first insulating material; and a capping layer on an upper surface of the wiring layer and including a conductive material; a via layer on the wiring structures, the via layer being electrically connected to one wiring structure; and an interlayer insulating layer covering a sidewall of the insulating pattern between each wiring structure of the plurality of wiring structures, the interlayer insulating layer having an upper surface higher than an upper surface of each wiring layer and an upper surface of each insulating pattern.
