Intel corporation (20240105598). DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
Contents
- 1 DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
Organization Name
Inventor(s)
Leonard P. Guler of Hillsboro OR (US)
Tahir Ghani of Portland OR (US)
Charles H. Wallace of Portland OR (US)
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105598 titled 'DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
Simplified Explanation
The integrated circuit structure described in the abstract includes multiple conductive lines on the same level and in the same direction, with varying widths and compositions. The structure also includes an inter-layer dielectric (ILD) structure between the conductive lines.
- The integrated circuit structure consists of multiple conductive lines with different widths and compositions on the same level and in the same direction.
- The ILD structure is present between adjacent conductive lines to provide insulation and support.
Potential Applications
The technology described in this patent application could be applied in the fabrication of advanced integrated circuits for various electronic devices, such as smartphones, computers, and IoT devices.
Problems Solved
This technology addresses the need for improved performance and efficiency in integrated circuit structures by optimizing the design of conductive lines and inter-layer dielectric structures.
Benefits
The benefits of this technology include enhanced signal transmission, reduced power consumption, and increased reliability of integrated circuits.
Potential Commercial Applications
The technology could be utilized by semiconductor manufacturers to produce high-performance integrated circuits for consumer electronics, automotive systems, and industrial applications.
Possible Prior Art
One possible prior art for this technology could be the use of different materials and structures in integrated circuit fabrication to improve performance and functionality.
What are the specific compositions of the conductive lines in the integrated circuit structure described in the patent application?
The specific compositions of the conductive lines are not provided in the abstract, but they are mentioned to be different for each line.
How does the presence of the inter-layer dielectric (ILD) structure contribute to the overall performance of the integrated circuit structure?
The ILD structure between adjacent conductive lines provides insulation and support, reducing interference and improving signal transmission within the integrated circuit.
Original Abstract Submitted
embodiments of the disclosure are in the field of integrated circuit structure fabrication. in an example, an integrated circuit structure includes a plurality of conductive lines on a same level and along a same direction, a first one of the plurality of conductive lines having a first width and a first composition, and a second one of the plurality of conductive lines having a second width and a second composition. the second width greater than the first width, and the second composition is different than the first composition. the integrated circuit structure also includes an inter-layer dielectric (ild) structure having portions between adjacent ones of the plurality of conductive lines.
