17822726. MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

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MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS

Organization Name

Micron Technology, Inc.

Inventor(s)

Xiao Li of Boise ID (US)

Jordan D. Greenlee of Boise ID (US)

MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17822726 titled 'MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS

Simplified Explanation

The patent application describes a microelectronic device that includes a stack structure, a contact structure, a liner material, and a boron-containing material. The stack structure consists of alternating conductive structures and dielectric structures, while the contact structure extends through the stack structure. The liner material is positioned between the stack structure and the contact structure, and the boron-containing material is located between the liner material and the stack structure.

  • The microelectronic device includes a stack structure with alternating conductive and dielectric structures.
  • A contact structure extends through the stack structure.
  • A liner material is positioned between the stack structure and the contact structure.
  • A boron-containing material is located between the liner material and the stack structure.

Potential Applications:

  • This microelectronic device can be used in various electronic systems, such as integrated circuits, microprocessors, and memory devices.
  • It can be applied in the manufacturing of electronic devices for consumer electronics, telecommunications, automotive, aerospace, and other industries.

Problems Solved:

  • The use of the liner material and boron-containing material helps to improve the performance and reliability of the microelectronic device.
  • It addresses issues related to electrical conductivity, insulation, and contact resistance in the stack structure.

Benefits:

  • The improved performance and reliability of the microelectronic device can lead to enhanced functionality and efficiency in electronic systems.
  • The use of the liner material and boron-containing material can contribute to the miniaturization and integration of electronic components, enabling smaller and more advanced devices.


Original Abstract Submitted

A microelectronic device comprises a stack structure, a contact structure, a liner material, and a boron-containing material. The stack structure comprises alternating conductive structures and dielectric structures. The contact structure extends through the stack structure. The liner material is between the stack structure and the contact structure. The boron-containing material is between the liner material and the stack structure. Related electronic systems and methods are also described.

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