Intel corporation (20240105597). DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract

DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Organization Name

intel corporation

Inventor(s)

Leonard P. Guler of Hillsboro OR (US)

Robert Joachim of Beaverton OR (US)

Shengsi Liu of Portland OR (US)

Tahir Ghani of Portland OR (US)

Charles H. Wallace of Portland OR (US)

DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105597 titled 'DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Simplified Explanation

The integrated circuit structure fabrication patent application describes a structure with conductive lines and an inter-layer dielectric structure with a dielectric plug portion.

• The integrated circuit structure includes multiple conductive lines in the same direction.
• One of the conductive lines has a break, which is filled with a dielectric plug portion in the inter-layer dielectric structure.
• The dielectric plug portion has a tapered profile from top to bottom and is continuous with other portions of the inter-layer dielectric structure.

Potential Applications

This technology could be applied in the fabrication of integrated circuits, specifically in improving the reliability and performance of the circuit structure.

Problems Solved

This innovation helps to address issues related to breaks in conductive lines within integrated circuits, ensuring proper functionality and connectivity.

Benefits

The dielectric plug portion enhances the structural integrity of the integrated circuit, reducing the risk of signal interference or loss due to breaks in the conductive lines.

Potential Commercial Applications

This technology could be valuable in the semiconductor industry for manufacturing high-quality integrated circuits with improved reliability and performance.

Possible Prior Art

Prior art may include similar techniques for repairing breaks in conductive lines within integrated circuits, but the specific design and features of the dielectric plug portion may be novel.

How does this technology compare to existing methods for repairing breaks in conductive lines within integrated circuits?

This article does not provide a direct comparison to existing methods, leaving the reader to wonder about the advantages and limitations of this new approach.

What are the specific manufacturing processes involved in implementing the dielectric plug portion in the inter-layer dielectric structure?

The article does not delve into the detailed manufacturing processes, leaving room for further exploration into the practical aspects of implementing this technology.

Original Abstract Submitted

embodiments of the disclosure are in the field of integrated circuit structure fabrication. in an example, an integrated circuit structure includes a plurality of conductive lines along a same direction, one of the conductive lines having a break therein. an inter-layer dielectric (ild) structure has portions between adjacent ones of the plurality of conductive lines and has a dielectric plug portion in a location of the break in the one of the conductive lines. the dielectric plug portion of the ild structure is continuous with one or more of the portions of the ild structure between adjacent ones of the plurality of conductive lines. the dielectric plug portion of the ild structure has an inwardly tapering profile from top to bottom.