17546682. BARRIER LINER FREE INTERFACE FOR METAL VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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BARRIER LINER FREE INTERFACE FOR METAL VIA

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Koichi Motoyama of Clifton Park NY (US)

Chanro Park of Clifton Park NY (US)

Kenneth Chun Kuen Cheng of Shatin (HK)

BARRIER LINER FREE INTERFACE FOR METAL VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 17546682 titled 'BARRIER LINER FREE INTERFACE FOR METAL VIA

Simplified Explanation

The abstract describes an electrical communication structure that includes multiple metal line levels, with a first metal line in a lower level and a second metal line in an upper level. A via connects the first and second metal lines, but does not connect with any intermediate metal lines between the levels. The via has a metal fill that directly contacts the metal fill of the first metal line.

  • The patent application describes an electrical communication structure with multiple metal line levels.
  • The structure includes a first metal line in a lower level and a second metal line in an upper level.
  • The base of the second metal line is on a metal etch stop layer aligned with its edges.
  • A via connects the first and second metal lines, but does not connect with any intermediate metal lines.
  • The via has a metal fill that directly contacts the metal fill of the first metal line.

Potential Applications

This technology can be applied in various fields where electrical communication structures are used, such as:

  • Integrated circuits
  • Semiconductor devices
  • Electronic devices

Problems Solved

The technology addresses the following problems:

  • Efficient and reliable electrical communication between different metal line levels.
  • Avoiding electrical communication with intermediate metal lines.
  • Ensuring direct contact between metal fills in the via and the first metal line.

Benefits

The technology offers several benefits:

  • Improved performance and functionality of integrated circuits and electronic devices.
  • Enhanced reliability and efficiency of electrical communication.
  • Simplified manufacturing processes for electrical communication structures.


Original Abstract Submitted

An electrical communication structure that includes a plurality of metal line levels, a first metal line in a first metal line level of the plurality of line levels, and a second metal line in an upper metal line level of the plurality of line levels. A base of the second metal line is atop a metal etch stop layer that is aligned with edges of the second metal line. The electrical communication structure further includes a via that extends from the first metal line to the second metal line through the plurality of line levels. the via is not in electrical communication with at least one an intermediate metal line within the plurality of line levels between the first metal line level and the upper metal line level. The via has a metal fill that is in direct contact with a metal fill of the first metal line.

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