17819538. ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
Mark S. Swenson of Meridian ID (US)
Surendranath C. Eruvuru of Boise ID (US)
ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17819538 titled 'ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS
Simplified Explanation
The patent application describes an electronic device with a unique structure involving alternating conductive and insulative layers, as well as dielectric-filled slots and isolation structures.
- The electronic device includes a stack with conductive and insulative structures arranged in tiers.
- Dielectric-filled slots extend vertically through the stack in a first horizontal direction, defined between internal sidewalls of the stack.
- Additional dielectric-filled slots extend vertically through the stack in a second horizontal direction perpendicular to the first direction.
- Isolation structures are placed between the dielectric-filled slots, laterally adjacent to the conductive structures and vertically adjacent to the insulative structures.
Potential Applications:
- Integrated circuits
- Microprocessors
- Memory devices
Problems Solved:
- Improved signal transmission
- Enhanced insulation between components
- Efficient use of space in electronic devices
Benefits:
- Increased performance and reliability
- Enhanced functionality
- Compact design for electronic devices
Original Abstract Submitted
An electronic device comprises a stack comprising an alternating sequence of conductive structures and insulative structures arranged in tiers, and at least one dielectric-filled slot extending vertically through the stack and extending in a first horizontal direction. The at least one dielectric-filled slot is defined between two internal sidewalls of the stack. The electronic device comprises additional dielectric-filled slots extending vertically through the stack and extending in a second horizontal direction transverse to the first horizontal direction, and isolation structures laterally interposed between the at least one dielectric-filled slot and the additional dielectric-filled slots. The isolation structures are laterally adjacent to the conductive structures of the stack, and at least some of the isolation structures are vertically adjacent to the insulative structures of the stack. Related systems and methods of forming the electronic devices are also disclosed.
