17899586. SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)

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SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME

Organization Name

Micron Technology, Inc.

Inventor(s)

Thiagarajan Raman of Boise ID (US)

SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17899586 titled 'SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME

Simplified Explanation

The semiconductor device assembly described in the patent application includes a substrate, semiconductor devices, central and peripheral interconnect structures, and an encapsulant material.

  • The assembly has semiconductor devices placed on the inner surface of the substrate.
  • A central interconnect structure is located between the devices, consisting of conductors surrounded by a dielectric material sheath.
  • Peripheral interconnect structures surround the devices and are electrically coupled to them.
  • The encapsulant material partially encapsulates the devices and interconnects, made of a different material than the dielectric material.

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      1. Potential Applications
  • This technology can be used in the manufacturing of various semiconductor devices such as integrated circuits, microprocessors, and memory chips.
      1. Problems Solved
  • Provides improved electrical connectivity and isolation between semiconductor devices.
  • Enhances the reliability and performance of semiconductor assemblies by protecting them from external factors.
      1. Benefits
  • Increased efficiency and functionality of semiconductor devices.
  • Enhanced durability and longevity of the semiconductor assembly.
  • Improved overall performance and reliability of electronic devices utilizing this technology.


Original Abstract Submitted

A semiconductor device assembly is provided. The assembly includes a substrate with an inner and outer surface, a plurality of semiconductor devices disposed on the inner surface, a central interconnect structure disposed between the devices, a plurality of peripheral interconnect structures disposed around the devices, and an encapsulant material at least partially encapsulating the devices and the interconnects. The central interconnect structure includes a plurality of conductors and a sheath of dielectric material that surrounds and electrically isolates each of the plurality of conductors. Each of the peripheral interconnect structures is electrically coupled to at least one of the semiconductor devices. The encapsulant comprises a different material than the dielectric material.

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