17457444. TOP VIA WITH PROTECTIVE LINER simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
Contents
TOP VIA WITH PROTECTIVE LINER
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Tao Li of Slingerlands NY (US)
Ruilong Xie of Niskayuna NY (US)
Tsung-Sheng Kang of Ballston Lake NY (US)
Chih-Chao Yang of Glenmont NY (US)
TOP VIA WITH PROTECTIVE LINER - A simplified explanation of the abstract
This abstract first appeared for US patent application 17457444 titled 'TOP VIA WITH PROTECTIVE LINER
Simplified Explanation
The abstract describes an interconnect structure and a method of forming it. The structure consists of metal lines and top vias in direct contact with the metal lines. A liner is formed on the sidewalls of the top vias and top portions of the metal lines.
- The interconnect structure includes metal lines and top vias.
- The top vias are in direct contact with the metal lines.
- A liner is formed on the sidewalls of the top vias and top portions of the metal lines.
Potential applications of this technology:
- Integrated circuits
- Semiconductor devices
- Electronic devices
Problems solved by this technology:
- Improved interconnect structure for electronic devices
- Enhanced electrical conductivity and reliability
Benefits of this technology:
- Improved performance of integrated circuits and electronic devices
- Enhanced electrical conductivity and reliability of interconnects
Original Abstract Submitted
An interconnect structure and a method of forming the interconnect structure are provided. The interconnect structure includes one or more metal lines and one or more top vias in direct contact with a top surface of the one or more metal lines. The interconnect structure also includes a liner formed on sidewalls of the one or more top vias and top portions of the one or more metal lines.
