US Patent Application 18362739. SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract

SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chung-Liang Cheng of Hsinchu (TW)

SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18362739 titled 'SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

Simplified Explanation

- The patent application describes a semiconductor process system that etches thin films on semiconductor wafers. - The system includes a machine learning based analysis model that helps in selecting the optimal process conditions for the etching process. - The analysis model takes into account both static process conditions and target thin-film data to determine the best process conditions. - By analyzing the data, the analysis model identifies dynamic process conditions that, when combined with the static process conditions, will result in predicted remaining thin-film data that matches the target thin-film data. - The system then uses the determined static and dynamic process conditions for the next etching process. - The innovation lies in the use of machine learning and data analysis to optimize the etching process and achieve desired thin-film results.

Original Abstract Submitted

A semiconductor process system etches thin films on semiconductor wafers. The semiconductor process system includes a machine learning based analysis model. The analysis model dynamically selects process conditions for an etching process by receiving static process conditions and target thin-film data. The analysis model identifies dynamic process conditions data that, together with the static process conditions data, result in predicted remaining thin-film data that matches the target thin-film data. The process system then uses the static and dynamic process conditions data for the next etching process.