18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES
Organization Name
Inventor(s)
Elise Brutschea of Cambridge MA (US)
Hongkun Park of Cambridge MA (US)
INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18471715 titled 'INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES
Simplified Explanation
The abstract describes an interconnection layer structure that includes a two-dimensional material and a work function modulation layer. The structure is part of an electronic device and an electronic apparatus.
- The interconnection layer structure includes a first interconnection layer and a work function modulation layer made of ruthenium (Ru) directly on one surface of the first interconnection layer.
- The first interconnection layer consists of a metal layer.
- The work function modulation layer is a two-dimensional material layer.
Potential Applications
The technology can be applied in:
- Semiconductor devices
- Integrated circuits
- Flexible electronics
Problems Solved
This technology helps in:
- Improving electronic device performance
- Enhancing interconnection efficiency
- Reducing power consumption
Benefits
The benefits of this technology include:
- Increased device reliability
- Enhanced signal transmission
- Improved overall device functionality
Potential Commercial Applications
Potential commercial applications of this technology include:
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
Possible Prior Art
One possible prior art could be the use of traditional metal interconnection layers in electronic devices.
Unanswered Questions
How does the work function modulation layer impact the overall performance of the electronic device?
The abstract does not provide specific details on how the work function modulation layer affects the device's performance.
Are there any limitations or drawbacks to using a two-dimensional material as the work function modulation layer?
The abstract does not mention any potential limitations or drawbacks associated with using a two-dimensional material in this context.
Original Abstract Submitted
An interconnection layer structure including a two-dimensional (2D) material, an electronic device including the interconnection layer structure, and an electronic apparatus including the electronic device are disclosed. The interconnection layer structure may include a first interconnection layer, and a work function modulation layer directly on one surface of the first interconnection layer. The first interconnection layer may include a metal layer, and the work function modulation layer may be a two-dimensional (2D) material layer that includes ruthenium (Ru).
