18237174. SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION simplified abstract (Micron Technology, Inc.)
SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION
Organization Name
Inventor(s)
Kyle K. Kirby of Eagle ID (US)
Terrence B. Mcdaniel of Boise ID (US)
SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18237174 titled 'SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION
Simplified Explanation
The semiconductor assembly described in the patent application involves a semiconductor die with first and second circuitry, a reservoir of conductive material, and an interlayer dielectric with openings.
- The reservoir of conductive material is heated to expand through the openings, creating vias that electrically connect the first circuitry and the reservoir.
- This process allows for the assembly of a connected semiconductor device.
Potential Applications
- This technology can be used in the manufacturing of semiconductor devices such as integrated circuits and microprocessors.
Problems Solved
- This technology solves the problem of efficiently and effectively connecting different circuitry within a semiconductor die.
Benefits
- Improved electrical connectivity within semiconductor devices.
- Enhanced performance and reliability of semiconductor assemblies.
Original Abstract Submitted
A semiconductor assembly is described that includes a semiconductor die having first circuitry. The semiconductor die further includes second circuitry with a reservoir of conductive material and an interlayer dielectric having one or more openings between the first circuitry and the reservoir of conductive material. The reservoir of conductive material is heated effective to cause the reservoir of conductive material to volumetrically expand through the one or more openings to create one or more vias that electrically couples the first circuitry and the reservoir of conductive material. In doing so, a connected semiconductor device may be assembled.
