Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
Patent Applications by Samsung Electronics Co., Ltd. on March 21st, 2024
Samsung Electronics Co., Ltd.: 178 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L29/775 (20), H01L29/06 (14), H01L23/00 (13), H10B80/00 (12), H01L29/0673 (11)
With keywords such as: device, based, including, circuit, layer, semiconductor, configured, information, surface, and signal in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Yoonkyung CHO of Suwon-si (KR) for samsung electronics co., ltd., Seehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongsoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Gihyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Ahyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd., Seungryong CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/14, A47L9/28
Abstract: a cleaning device and a method therefor are provided. the cleaning device includes a vacuum cleaner including a dust collecting container and a docking station to which the dust collecting container is coupled. the docking station includes a suction device configured to move air from the dust collecting container to inside of the docking station, a collector configured to collect a foreign substance that is moved together with the air by driving of the suction device, a suction flow path along which air moves inside the docking station, a flow adjusting device configured to open or close the suction flow path, and at least one processor configured to control the suction device to operate based on the dust collecting container being coupled to the docking station, and control the flow adjusting device to periodically open and close the suction flow path in a state in which the suction device operates.
Inventor(s): Yeohwan YOON of Suwon-si (KR) for samsung electronics co., ltd., Kyungwon MOON of Suwon-si (KR) for samsung electronics co., ltd., Chulgon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28
Abstract: according to an embodiment of the disclosure, a charging cradle for mounting and charging a wireless vacuum cleaner, may include: a cradle, and a cleaning station including an automatic cover opening/closing device physically connected to the wireless cleaner and disposed on the cradle. the automatic cover opening/closing device may include: a lower case, an upper case integrally connected to the lower case, a middle case coupled to each of the lower case and the upper case and configured to be movable away from the lower case or toward the lower case, the middle case being rotatably coupled to the lower case, a cover configured to open/close the upper case, a driver comprising a motor and meshing with the middle case and configured to provide a force for rotating and moving the middle case, and a mechanical device provided in the middle case and configured to open/close the cover in response to operation of the driver.
Inventor(s): Myoung Hoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kun Sun EOM of Suwon-si (KR) for samsung electronics co., ltd., Jin Young PARK of Suwon-si (KR) for samsung electronics co., ltd., Yoon Jae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Seok MOON of Suwon-si (KR) for samsung electronics co., ltd., Jeong Eun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00
Abstract: an apparatus for estimating bio-information includes: a sensor including one or more light sources configured to emit light to an object and a plurality of detectors configured to detect light reflected from the object; and a processor configured to transform a plurality of light quantities obtained from respective detectors of the plurality of detectors to a distance domain, to combine the plurality of transformed light quantities in the distance domain, to correct the combined light quantity based on a reference light quantity for correcting a deviation of a distance between the one or more light sources and the plurality of detectors, and to estimate bio-information based on a light quantity resulting from the correction.
Inventor(s): Keehong SEO of Seoul (KR) for samsung electronics co., ltd., Byung-Kwon CHOI of Seongnam-si (KR) for samsung electronics co., ltd., Bokman LIM of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H3/00, A61B5/11, A61H1/02, B25J9/00
Abstract: an torque pattern adjustment apparatus including a display configured to display a first torque pattern corresponding to a gait cycle, and a generator configured to generate a second torque pattern by adjusting at least a portion of the first torque pattern in response to a reception of an input, and a torque pattern adjustment method using the same may be provided. the first torque pattern may be applied to a joint of a user.
Inventor(s): Mijong KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongjin HAM of Suwon-si (KR) for samsung electronics co., ltd., Hyukjae KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyun Chul LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01D46/00, A61L9/014, A61L9/20, B01D39/20, B01D46/24, B01D46/62, B01D53/88
Abstract: an air purification module which purifies introduced unpurified air and discharge purified air, includes a first filter supporter extending in a first direction and having a penetrating shape including a first hollow region, a first filter which is supported by the first filter supporter and penetrates a side portion of the first filter supporter, a second filter supporter extending in the first direction, having a penetrating shape including a second hollow region, and disposed in the first hollow region, a second filter which is supported by the second filter supporter and penetrates a side portion of the second filter supporter, and a light source module disposed in the second hollow region.
20240091785.FOOD WASTE DISPOSER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongkwan CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngchul KO of Suwon-si (KR) for samsung electronics co., ltd., Dohyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewan HONG of Suwon-si (KR) for samsung electronics co., ltd., Donghyo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kisup LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B02C18/00, B02C18/12, B02C18/16, B02C23/26
Abstract: a food waste disposer including a housing; a grinding device inside the housing to grind food waste; an exhaust fan inside the housing to form an air flow; an exhaust pipe connected to the exhaust fan to form an exhaust flow path along which air from the grinding device flows via the air flow formed by the exhaust fan; a filter assembly to adsorb contaminants from the air flowing along the exhaust flow path; a branch pipe branching from the exhaust pipe between the grinding device and the exhaust fan to form a connection flow path communicating with the exhaust flow path; and a sterilization device connected to the branch pipe to selectively open and close the connection flow path, and, with the connection flow path being open, generate and supply plasma to the exhaust pipe through the connection flow path via an intake airflow formed by the exhaust fan.
Inventor(s): Sangyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Younghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/32, B24B57/02
Abstract: provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. a slurry groove is upwardly recessed from a bottom surface of the retainer ring. the slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. a curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.
Inventor(s): Jungseok HONG of Minneapolis MN (US) for samsung electronics co., ltd., Suveer Garg of New York NY (US) for samsung electronics co., ltd., Ibrahim Volkan Isler of Saint Paul MN (US) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, G06T7/11, G06T7/50, G06T7/60, G06T7/70, G06V10/776, G06V20/50, G06V20/70
Abstract: the present disclosure provides methods, apparatuses, and computer-readable mediums for evaluating a reliability of three-dimensional shape predictions. in some embodiments, a method includes obtaining a scene representation including one or more images, estimating semantic information of partially-observed objects in the scene representation, based on geometric information extracted from the one or more images, determining segmented pointclouds of the partially-observed objects based on the semantic information and the geometric information, creating metric embeddings of the segmented pointclouds corresponding to the partially-observed objects, predicting completed shape pointclouds of the partially-observed objects, generating, using a probabilistic machine learning model, confidence scores for each point of the completed shape pointclouds, based on a correlation between the geometric information and the semantic information, and controlling a motion of a robot based on the confidence scores for each point of the completed shape pointclouds.
Inventor(s): Nikhil Narsingh CHAVAN DAFLE of Jersey City NJ (US) for samsung electronics co., ltd., Vasileios VASILOPOULOS of Woodbridge NJ (US) for samsung electronics co., ltd., Shubham AGRAWAL of Jersey City NJ (US) for samsung electronics co., ltd., Jinwook HUH of Millburn NJ (US) for samsung electronics co., ltd., Suveer GARG of New York NY (US) for samsung electronics co., ltd., Pedro PIACENZA of Jersey City NJ (US) for samsung electronics co., ltd., Isaac Hisano KASAHARA of Brooklyn NY (US) for samsung electronics co., ltd., Kazim Selim ENGIN of Weehawken NJ (US) for samsung electronics co., ltd., Zhanpeng HE of New York NY (US) for samsung electronics co., ltd., Shuran SONG of New York NY (US) for samsung electronics co., ltd., Ibrahim Volkan ISLER of Saint Paul MN (US) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, G06T7/60, G06T7/73
Abstract: systems, methods, and apparatuses for controlling a robot including a manipulator, including: determining three-dimensional (3d) geometry information about a target object based on an image of the target object; determining 3d geometry information about a scene in which the target object is to be placed based on at least one image of the scene; obtaining affordance information by providing the 3d geometry information about the target object and the 3d geometry information about the scene to at least one neural network model; commanding the robot to grasp the target object using the manipulator according to a grasp orientation corresponding to the affordance information; and commanding the robot to position the manipulator according to a placement direction corresponding to the affordance information in order to place the target object at a location in the scene.
Inventor(s): Hyungmin SON of Suwon-si (KR) for samsung electronics co., ltd., Sajid SADI of Mountain View CA (US) for samsung electronics co., ltd., Leo JUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J11/00, B25J9/00, B25J9/06, B25J9/10, B25J9/12, B25J13/08, B25J15/00
Abstract: a manipulator may include a base link having a ring shape; a first ring-shaped link having a ring shape and disposed to rotate at a predetermined angle at a front end of the base link; a second ring-shaped link having a ring shape and disposed to rotate at a predetermined angle at a front end of the first ring-shaped link; a first borden cable and a second borden cable connected to the first ring-shaped link and formed to rotate the first ring-shaped link; a third borden cable and a fourth borden cable connected to the second ring-shaped link and formed to rotate the second ring-shaped link; and a driving device that operates the first borden cable, the second borden cable, the third borden cable, and the fourth borden cable.
Inventor(s): Younhwan Shin of Suwon-si (KR) for samsung electronics co., ltd., Dongju Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B26D1/00, B26D1/06
Abstract: a blade for sawing a panel, including a first blade portion configured to saw the panel along a first direction, wherein the panel includes a plurality of panel level packages (plps) arranged in the first direction and a second direction which is substantially perpendicular to the first direction; and a second blade portion arranged on an upper surface of the first blade portion, and configured to saw the panel along the second direction, wherein a width of the second blade portion is greater than a width of the first blade portion.
Inventor(s): Seho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jaeheung PARK of Seoul (KR) for samsung electronics co., ltd., Minsoo KIM of Seoul (KR) for samsung electronics co., ltd., Joonwoo AHN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): B60W30/06, B60W60/00, G06N3/0464
Abstract: a device and method with continuous real-time autonomous parking planning and control are disclosed. a method of training a path distribution estimation model includes: obtaining initial information including map information, departure information of an autonomous driving device, and destination information of the autonomous driving device; obtaining paths through which the autonomous driving device is movable by inputting the initial information to the path distribution estimation model which predicts the paths; and training the path distribution estimation model to output a path distribution corresponding to the paths based on the initial information.
Inventor(s): Jiyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C03C17/42, F24C15/10, H05B3/74
Abstract: a cooking apparatus includes a main body, and a cooking plate mounted on an upper surface of the main body to cook a cooking material. the cooking plate includes a base material, a diamond-like carbon (dlc) coating layer formed on an upper surface of the base material, to contact a cooking container when the cooking container is placed on the cooking plate, and an adhesive layer interposed between the base material and the dlc coating layer, and including at least one of si and siox.
Inventor(s): Jooseong SOHN of Suwon-si (KR) for samsung electronics co., ltd., Nohcheol PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08L23/12
Abstract: disclosed herein are a recycled polypropylene composite material resin composition and a washing machine including the same. a glass fiber-reinforced recycled polypropylene resin composition includes, in weight percent of the glass fiber-reinforced recycle polypropylene resin composition, about 10 to 30% of waste glass fiber mat-reinforced thermoplastic (gmt), about 35 to 47% of a homo-polypropylene base resin, about 30 to 45% of long glass fiber-reinforced polypropylene, and about 0.5 to 3.0% of a compatibilizer, and a weight average molecular weight of the composition may be about 250,000 g/mol or more.
Inventor(s): HONGTAEK LIM of Suwon-si (KR) for samsung electronics co., ltd., HAKJUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., HONGSIK PARK of Suwon-si (KR) for samsung electronics co., ltd., DONGGI LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/458, C23C16/44, C23C16/455, H01L21/285, H01L21/687
Abstract: an edge ring includes a ring body having an axis parallel to a first direction; and a plurality of protrusions provided at an inner side surface of the ring body and protruding toward the axis, the plurality of protrusions being spaced apart from each other in a circumference direction of the edge ring, wherein a first distance between the axis and a first point on the inner side surface of the ring body between two adjacent protrusions of the plurality of protrusions is larger than a second distance between the axis and a second point on the inner side surface of the ring body at which a protrusion of the plurality of protrusions is provided.
20240093419.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangho PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyungsub SIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwoon LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/24, D06F37/20, D06F37/26
Abstract: disclosed herein is a washing machine including a cabinet, a tub provided in the cabinet, a rotating tub rotatably provided in the tub, a shaft connected to rotate the rotating tub, a motor configured to rotate the shaft and including a rotor and a stator, a drip pan disposed at a lower end of the cabinet, and a friction member mounted on a lower end of the shaft and configured to contact with at least one surface of the drip pan, wherein the friction member includes a first portion secured to the shaft, a second portion connected to the first portion and having a curved surface in contact with the at least one surface of the drip pan.
20240093874.COOKING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yunwon MOON of Suwon-si (KR) for samsung electronics co., ltd., Sungkoo CHO of Suwon-si (KR) for samsung electronics co., ltd., Jihyung HA of Suwon-si (KR) for samsung electronics co., ltd., Sangyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungah CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C7/08, F24C15/00
Abstract: a cooking device including a main body; a cooking chamber inside the main body; a grill heater in an upper portion of the cooking chamber and including a plurality of straight sections arranged in parallel, and a plurality of curved sections connecting the plurality of straight sections; a camera module above the grill heater to photograph the inside of the cooking chamber; first and second lighting modules at opposite sides of the camera module above the grill heater to radiate light toward the inside of the cooking chamber, wherein portions of at least some of the straight sections and at least some of the curved sections are configured as detour sections bypassing a photographing area of the camera module and light irradiation areas of the first and the second lighting modules so that the grill heater does not interfere with the photographing area and the light irradiation areas.
20240093876.COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sooncheol KWEON of Suwon-si (KR) for samsung electronics co., ltd., Bokhyun JANG of Suwon-si (KR) for samsung electronics co., ltd., Jaegyeong MA of Suwon-si (KR) for samsung electronics co., ltd., Soojong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hanseong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C7/08, F24C15/16
Abstract: a cooking apparatus including a main body; an inner case which forms a cooking chamber; a heating device configured to heat the cooking chamber; a transparent member configured as at least a portion of an upper wall of the inner case; and a camera disposed above the transparent member, wherein the camera and the transparent member are configured so that the camera is operable to capture an image, through the transparent member, of an inside of the cooking chamber, and a viewing angle (a) of the camera along a left and right direction of the main body is 80 degrees or more.
20240093877.COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sooncheol KWEON of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun YEO of Suwon-si (KR) for samsung electronics co., ltd., Sunghoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Bokhyun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C15/00
Abstract: a cooking apparatus including a main body including an inner case, a cooking chamber inside the inner case, and an electronic compartment outside the inner case. the cooking apparatus further includes an electronic compartment cooling fan configured to cool the electronic compartment, an electronic compartment duct dividing the electronic compartment into an electronic component space and an exhaust space, a camera cooling duct including a camera receiving space; a camera in the camera receiving space and configured to obtain an image of an inside of the cooking chamber, and a camera cooling fan configured to cool the camera.
Inventor(s): Suyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Q-Han PARK of Seoul (KR) for samsung electronics co., ltd., Unjeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hojung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjun MA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01J3/28, G01J3/02
Abstract: provided are a spectral camera and an electronic apparatus including the same. the spectral camera includes an image sensor including a plurality of channels configured to detect a plurality of central wavelengths; an optical module configured to be movable with respect to the image sensor to provide an image of an object on the image sensor; a memory configured to store first information about a change in an optical characteristic of each of the plurality of channels in the image sensor, the change in the optical characteristic of each of the plurality of channels corresponding to a movement of the optical module; and a processor configured to: obtain the first information from the memory, obtain second information corresponding to the plurality of central wavelengths detected by the image sensor, and obtain third information by correcting the second information based on the first information.
Inventor(s): Sangyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Woomok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd., Dongshin SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyunmi CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/56, G05D1/02
Abstract: provided is a diagnostic robot including: a communication interface; and at least one processor configured to: control the communication interface to search for at least one candidate electronic device, select a target electronic device from among the at least one candidate electronic device, and identify a component of the target electronic device on which to perform a fault diagnosis, control the communication interface to transmit information associated with a diagnosis range to the target electronic device, obtain first diagnostic data by performing a first fault diagnosis on a component of the diagnostic robot, control the communication interface to receive, from the target electronic device, second diagnostic data generated from a second fault diagnosis performed on the component of the target electronic device while the target electronic device is positioned at a diagnosis area within the diagnosis range, and identify whether there is an abnormality in the component of the target electronic device based on the first diagnostic data and the second diagnostic data.
Inventor(s): Sungdo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seung Tae KHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/35, G01S7/03, G01S13/42, G01S13/931
Abstract: a method includes extracting a first chirp sequence signal and a second chirp sequence signal from a radar signal, determining a first phase difference of the first chirp sequence signal based on a distance between antenna elements of the array antenna, determining a second phase difference of the second chirp sequence signal based on the distance between the antenna elements of the array antenna, determining a first direction of arrival (doa) frequency based on a first carrier frequency based on the first phase difference, determining a second doa frequency based on a second carrier frequency based on the second phase difference, estimating a preliminary doa of a target based on a frequency difference between the first doa frequency and the second doa frequency, determining ambiguous doa candidates, and selecting a final doa of the target from the ambiguous doa candidates based on the preliminary doa.
Inventor(s): Youngsuk YOO of Suwon-si (KR) for samsung electronics co., ltd., Woosup LEE of Suwon-si (KR) for samsung electronics co., ltd., Sukgi HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/76
Abstract: an electronic device that performs a positioning operation is disclosed. the electronic device may comprise: a wireless communication circuit, at least one processor, and a memory. the electronic device may be configured to: transmit a first positioning signal to a first external electronic device by the wireless communication circuit; receive, from the first external electronic device, a first response signal corresponding to the first positioning signal; identify a first separation distance and an angle of arrival based on the first response signal; transmit, based on determining that the first separation distance exceeds a specified value, a second positioning signal to a second external electronic device; receive, from the second external electronic device, a second response signal corresponding to the second positioning signal; identify a second separation distance based on the second response signal; and determine that the first external electronic device is located in a first radial area corresponding to the first separation distance, a second radial area corresponding to the second separation distance, and an overlapping area of an area corresponding to the angle of arrival.
Inventor(s): Dongjae SHIN of Seoul (KR) for samsung electronics co., ltd., Dongsik SHIM of Hwaseong-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Seoul (KR) for samsung electronics co., ltd., Changbum LEE of Seoul (KR) for samsung electronics co., ltd., Bongyong JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B6/12, G02B6/125, G02B6/136
Abstract: a photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. the photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.
Inventor(s): Yongjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Haneung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B13/00, H04N23/55, H04N23/57, H04N23/68
Abstract: an electronic device includes at least one lens, an image sensor aligned along an optical axis from the at least one lens, and a reflective and refractive member disposed between the at least one lens and the image sensor on the optical axis. the reflective and refractive member includes an incident surface on which light passing through the at least one lens is incident, a first reflective surface inclined with respect to the incident surface, and a second reflective surface inclined with respect to the incident surface and spaced apart from the first reflective surface. first and second cutting planes are inclined with respect to the incident surface and face first and second directions, respectively.
Inventor(s): Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngmin NAM of Suwon-si (KR) for samsung electronics co., ltd., Changheon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07C65/30, G03F7/20
Abstract: provided are a carboxylate salt represented by formula 1, a photoresist composition including the carboxylate salt represented by formula 1, and a method of forming a pattern by using the photoresist composition
Inventor(s): Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngmin NAM of Suwon-si (KR) for samsung electronics co., ltd., Changheon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07C65/30, G03F7/20
Abstract:
Inventor(s): Katsunobu NISHIHARA of Yokohama (JP) for samsung electronics co., ltd., Nozomi TANAKA of Yokohama (JP) for samsung electronics co., ltd., Tomoyuki JOHZAKI of Yokohama (JP) for samsung electronics co., ltd., Ken OZAWA of Yokohama (JP) for samsung electronics co., ltd., Atsushi SUNAHARA of Yokohama (JP) for samsung electronics co., ltd., Shinji UEYAMA of Yokohama (JP) for samsung electronics co., ltd., Shinsuke FUJIOKA of Yokohama (JP) for samsung electronics co., ltd., Yubo WANG of Yokohama (JP) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, H05G2/00
Abstract: an exposure apparatus includes a droplet supplier to supply a target droplet inside a vacuum chamber, an irradiator irradiating a pulsed laser onto the target droplet, a condensing mirror installed inside the vacuum chamber and configured to condense a light emitted from the target droplet by irradiation of the pulsed laser onto the target droplet, a gas supplier to flow a hydrogen gas along a surface of the condensing mirror, a controller to change a supply condition of the target droplet and an irradiation condition of the pulsed laser to conditions different from conditions during an exposure operation to increase an amount of production of hydrogen radicals in the vacuum chamber, and an exhaust pump to exhaust a gas from an inside of the vacuum chamber.
Inventor(s): Koeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd., Donghee YE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02
Abstract: disclosed is a robot traveling in a specific space. the robot includes a memory in which map information on a driving space is stored, one or more sensors, a driver; and one or more processors configured to identify the specific space as a plurality of subspaces when the specific space is included as a stopover on a traveling route identified based on the map information, identify priority information of each of the plurality of subspaces, identify a location of an object within the specific space based on sensing data acquired through the one or more sensors, update the priority information of each of the plurality of subspaces based on at least one of the identified location of the object or a predicted departure time to a next stopover within the traveling route, and control the driver to move based on the updated priority information.
Inventor(s): Taeyoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kuyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02, G06T7/50
Abstract: a driving robot includes: a camera including a depth camera; and at least one processor configured to: control the camera to acquire depth data in one or more areas where the driving robot moves, identify, from the acquired depth data, a plurality of scan data sets corresponding to a plurality of predetermined height levels, identify, based on the plurality of scan data sets, a plurality of feature scores corresponding to the plurality of scan data sets, and generate at least one area map corresponding to at least one scan data set among the plurality of scan data sets, wherein a feature score, among the plurality of feature scores, corresponding to the at least one scan data set is greater than or equal to a predetermined critical value.
Inventor(s): Sungjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Byoungho JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangil PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwonho SONG of Suwon-si (KR) for samsung electronics co., ltd., Iljoo CHAE of Suwon-si (KR) for samsung electronics co., ltd., Kiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Mooyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/04883
Abstract: an example electronic device may include a foldable housing, including a hinge, a first housing connected to the hinge and including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, and a second housing connected to the hinge, including a third surface facing a third direction and a fourth surface facing a fourth direction opposite the third direction, the second housing configured to be foldable with respect to the first housing about the hinge, wherein the first surface faces the third surface in a folded state of the electronic device; a display extending from the first surface to the third surface to provide the first surface and the third surface and including a touch controller configured to control a receiving function of an input on the display; a processor disposed inside the first or second housing and operatively coupled to the display; and a memory operatively connected to the processor, wherein the memory may store instructions that, when executed, cause the processor to control the electronic device to: detect the occurrence of changing an angle between the first housing and the second housing; receive a touch interrupt produced based on an input on the display; identify characteristics of the input in response to detecting the change in the angle; and determine whether to cancel the touch event corresponding to the input based on the characteristics of the input.
Inventor(s): Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Junyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sukdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, F16H48/08
Abstract: an example electronic device may include a first housing, a second housing coupled to be slidable from the first housing, a flexible display supported by the first housing and the second housing and having a display area that varies based on the second housing being slid in or slid out. the electronic device may include a stopper assembly disposed in the first housing. the stopper assembly may include a stopper body elastically coupled to at least a portion of the first housing, and a pressing member coupled to the stopper body and configured to come into contact with a protrusion located in the second housing, wherein, in a slide-out state, the stopper body is at least partially disposed in a recess in the second housing by pressure from the pressing member being pressed by the protrusion.
Inventor(s): Minhong DO of Suwon-si (KR) for samsung electronics co., ltd., Yongwoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaebum BAE of Suwon-si (KR) for samsung electronics co., ltd., Yonglak CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
Abstract: according to an embodiment of the disclosure, an electronic device may comprise a housing including a first housing and a second housing configured to rotate relative to the first housing and a hinge module rotatably coupling the first housing and the second housing and received in the housing. the hinge module includes a hinge housing including a receiving space, a spring positioned in the receiving space of the hinge housing, a supporting member including an inclined portion coupled to one end of the spring, and a cam coupled to another end of the spring and configured to transfer force to the spring.
Inventor(s): Miyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/16, G06T7/50, G06T7/70
Abstract: an electronic apparatus includes a camera, a driver, a display, and at least one processor operatively connected to the camera, the driver, and the display. the processor is configured to control the camera to capture an image, identify a user posture included in the captured image, identify at least one parameter among a plurality of parameters related to a user based on the user posture, and control the driver to change a position of the electronic apparatus based on the at least one parameter, and change a posture of the display.
Inventor(s): Jaeyung YEO of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Choelmin Choelmin of Suwon-si (KR) for samsung electronics co., ltd., Chungwan HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01
Abstract: a wearable electronic device includes a display, and at least one processor connected to the display, where the at least one processor is configured to obtain a first space necessary for a motion of a user corresponding to a motion of an avatar, the motion of the avatar being performed in a virtual space of virtual reality (vr) content displayed through the display, obtain a second space for safely performing the motion of the user, set a scale value, based on the first space and the second space, and based on obtaining the motion of the user, determine, using the set scale value, a size of the motion of the avatar, the motion of the avatar being performed by the motion of the user.
Inventor(s): Yiwen YANG of Guangzhou (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482
Abstract: a split screen application matching method, including acquiring feature information associated with a first application, based on receiving a split screen instruction; determining a candidate application list using an artificial intelligence model based on the feature information, wherein the artificial intelligence model comprises a feature extraction model and a deep learning model, and the candidate application list comprises at least one candidate second application; and displaying the first application in a first split screen area of the terminal, and displaying the candidate application list in a second split screen area of the terminal.
Inventor(s): Ramzi AMMARI of Santa Clara CA (US) for samsung electronics co., ltd., Mukesh GARG of Stanford CA (US) for samsung electronics co., ltd., Praveen KRISHNAMOORTHY of Fremont CA (US) for samsung electronics co., ltd., Changho CHOI of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: systems and methods for tier management in memory-tiering environments. in some embodiments, a method includes accessing, by a first process, a first page of the first process in a first tier of a non-uniform memory access memory; and locking, by a first thread, the first page against demotion. the first thread may be a tier-management thread of the first process, and the locking of the first page may be based on a service level of the first process.
Inventor(s): Vipin Kumar AGRAWAL of San Jose CA (US) for samsung electronics co., ltd., Young Deok KIM of San Jose (CA) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: an appliance is described. a write engine may process a write request from an application to write a first data into a memory. the write request may including the first data and an address. a compression engine may compress the first data to produce a first compressed data. a write module may store the first compressed data in the memory. the first data may be a first part of a page that may further include a second data as a second part. the first compressed data may be a first part of a compressed page that may further include a second compressed data as a second part.
Inventor(s): Wentao WU of Milpitas CA (US) for samsung electronics co., ltd., Sompong Paul OLARIG of Pleasanton CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F13/40, G06F13/42
Abstract: a data storage system includes: a plurality of data storage devices; a motherboard containing a baseboard management controller (bmc); and a network switch configured to route network traffic to the plurality of data storage devices. the bmc is configured to identify a group of data storage devices among the plurality of data storage devices based on device-specific information received from the plurality of data storage devices and send identifiers of the group of data storage devices to a querying party.
Inventor(s): Minji KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangwon JUNG of Busan (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: disclosed is an operating method of a storage controller communicating with a host and memory regions, which includes receiving a write request for a first memory region of the memory regions from the host, determining the first memory region as unavailable, based on a status information set, generating redirection information indicating that a second memory region of the memory regions is selected instead of the first memory region, performing a write operation in the second memory region based on the redirection information, updating status information of the second memory region in the status information set based on the write operation, outputting redirection result information indicating that write data of the write request are processed in the second memory region, to the host, and receiving a read request corresponding to the write data and including information of the second memory region from the host.
Inventor(s): Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Choelmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaeyung YEO of Suwon-si (KR) for samsung electronics co., ltd., Chungwan HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G03B21/00, G06V40/16, G08B21/18
Abstract: provided is a wearable device that includes: a first display provided on a first surface of the wearable device configured to face a face of a user wearing the wearable device, and a second display provided on a second surface of the wearable device configured to face an external environment of the wearable device when the wearable device is worn by the user. the wearable device may be configured to display a first execution screen of a first application on the first display, while the wearable device is worn by the user, determine a display type for information to be displayed on the second display, while displaying the first execution screen on the first display, and display information related to the first execution screen on the second display based on the display type.
Inventor(s): Byoung Gon Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/501, G06F30/392, H01L27/118, H03K17/00, H03K19/21
Abstract: a compressor circuit and a semiconductor integrated circuit included the compressor circuit are provided. the semiconductor integrated circuit includes a compressor circuit which includes a first full adder circuit which receives an a1 signal, a b1 signal, and a ci signal to output an is signal and an ico signal, and a second full adder circuit which receives a b2 signal, the is signal, and a ci2 signal to output an s signal and a co signal. each of the first full adder circuit and the second full adder circuit are in an l-shaped layout, the first full adder circuit and the second full adder circuit have bent portions that are point-symmetrically engaged with each other, and the compressor circuit is in a rectangular shape. the number of transistors in the second full adder circuit is smaller than the number of transistors in the first full adder circuit.
Inventor(s): Dong-Jin CHANG of Suwon-si (KR) for samsung electronics co., ltd., Sungmeen MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Daekun YOON of Suwon-si (KR) for samsung electronics co., ltd., Seok Ju YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/544, G06F7/40
Abstract: a multi-bit accumulator including a plurality of 1-bit wallace trees configured to perform an add operation on single-bit input data, a plurality of tristate buffers configured to output a result of the add operation of the 1-bit wallace trees, according to an enable signal, and a shift-adder configured to perform an accumulation operation on the result of the add operation of the plurality of 1-bit wallace trees by a shift operation based on a clock signal.
Inventor(s): Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyong MOON of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/451, G06F1/16, G06F3/0346, H04M1/02
Abstract: an electronic device is provided. the electronic device includes a sensor module, at least one display, a memory, and at least one processor. the at least one processor displays a plurality of components through the display in a first mode of the electronic device, determines a pivot region including a plurality of grids, detects a change to a second mode of the electronic device based on sensing information sensed through the sensor module, and maintains a layout of components included in the pivot region and display the plurality of components in the second mode.
Inventor(s): Sanggyu SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F9/54
Abstract: a method including, for each of a plurality of job nodes, corresponding to a job request of a scheduler node, distributing an application container and a sidecar container of a corresponding job node of the plurality of job nodes, and storing, by the sidecar container, information about a respective state of the application container in a memory through a communication between the sidecar container and at least one sidecar container of another job node of the plurality of job nodes.
Inventor(s): TAESUN KIM of SUWON-SI (KR) for samsung electronics co., ltd., JINHONG PARK of SUWON-SI (KR) for samsung electronics co., ltd., HWISOO SO of SEOUL (KR) for samsung electronics co., ltd., KYOUNGWOO LEE of SEOUL (KR) for samsung electronics co., ltd., JINHYO JUNG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/07, G06F9/38
Abstract: a processor includes an instruction pipeline that sequentially processes an original instruction and a duplicate instruction, which is generated by duplicating the original instruction. an original register file stores a result obtained by processing the original instruction in the instruction pipeline within a register of a nindex thereof. a duplicate register file stores a result obtained by processing the duplicate instruction in the instruction pipeline within a register of a nindex thereof. a comparing unit compares the register of the nindex in the original register file with the register of nindex in the duplicate register file and outputs an error detection signal, in response to a control signal.
Inventor(s): Yesin RYU of Seoul (KR) for samsung electronics co., ltd., Sunggi AHN of Jinju-si (KR) for samsung electronics co., ltd., Jaeyoun YOUN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10
Abstract: a memory device including: a memory cell array including a plurality of memory cells disposed at intersections of wordlines and bitlines; an error correction circuit configured to read data from the memory cell array and to correct an error in the read data; and an error check and scrub (ecs) circuit configured to perform a scrubbing operation on the memory cell array, wherein the ecs circuit includes: a first register configured to store an error address obtained in the scrubbing operation; and a second register configured to store a page offline address received from an external device.
Inventor(s): Yehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanwon SEO of Suwon-si (KR) for samsung electronics co., ltd., Sojung YUN of Suwon-si (KR) for samsung electronics co., ltd., Junik JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/34, G06N3/08
Abstract: an example method for controlling an electronic device includes detecting at least one user and acquiring user information of the detected at least one user; determining a user mode based on the acquired user information; determining a service to be provided to the detected at least one user, by inputting the user information and the determined user mode as input data to a model learned by an artificial intelligence algorithm; and providing the determined service corresponding to the user mode. a method for providing the service by the electronic device may at least partially use an artificial intelligence model learned according to at least one of machine learning, neural network, and deep learning algorithms.
Inventor(s): Youngmin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/0802, G06F3/06
Abstract: provided is a method of operating a storage system including a host device and a storage device, the method including: transmitting, by the host device, a first write command and a logical address to the storage device; transmitting, by the storage device, first normal offset information about a normal area and first cache offset information about a cache area included in a host memory of the host device to the host device; copying, by the host device, first write data stored in the normal area to the cache area based on the first normal offset information and the first cache offset information; and transmitting, by the storage device, a first response to the first write command to the host device, wherein reception of the first write data from the host device before transmitting the first response is omitted.
20240095171.INTERFACE FOR REMOTE MEMORY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mukesh GARG of Stanford CA (US) for samsung electronics co., ltd., Ramzi AMMARI of Santa Clara CA (US) for samsung electronics co., ltd., Praveen KRISHNAMOORTHY of Fremont CA (US) for samsung electronics co., ltd., Changho CHOI of San Jose CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0815, G06F13/28
Abstract: a system with an interface for remote memory. in some embodiments, the system includes: an interface circuit having: a first interface, configured to be connected to a processing circuit; and a second interface, configured to be connected to memory, the first interface including a cache coherent interface, and the second interface being different from the first interface.
Inventor(s): Sompong Paul OLARIG of Pleasanton CA (US) for samsung electronics co., ltd., Fred WORLEY of San Jose CA (US) for samsung electronics co., ltd., Oscar P. PINTO of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F3/06, G06F13/40, G06F13/42, H03M13/15
Abstract: a topology is disclosed. the topology may include at least one non-volatile memory express (nvme) solid state drive (ssd), a field programmable gate array (fpga) to implement one or more functions supporting the nvme ssd, such as data acceleration, data deduplication, data integrity, data encryption, and data compression, and a peripheral component interconnect express (pcie) switch. the pcie switch may communicate with both the fpga and the nvme ssd.
Inventor(s): Peng WANG of SHAANXI (CN) for samsung electronics co., ltd., Min LI of SHAANXI (CN) for samsung electronics co., ltd., Hanbing ZHANG of SHAANXI (CN) for samsung electronics co., ltd.
IPC Code(s): G06F21/57, G06F21/12
Abstract: a method for passing data includes: a secure operating system allocating a cache area in trusted execution environment (tee) to data in response to a client application (ca) calling a trusted application (ta) entry to pass the data to a ta; the secure operating system copying the data from a pre-allocated shared memory to the cache area; and the secure operating system running the ta entry so that the ta obtains the data from the cache area.
Inventor(s): Kyoungheun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Incheol OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/57
Abstract: an example server includes a communication circuit, a processor, and memory. the memory stores instructions that, when executed by the processor, cause the server to: obtain regional policy files including firmware update policy to be applied for sequentially distributing firmware update to electronic devices located in a plurality of regions included in a target region list, transmit the regional policy files to edge servers corresponding to the plurality of regions in a content delivery network (cdn) for firmware update, receive a firmware download request originated from an electronic device, wherein the firmware download request is to be processed based on a first regional policy file corresponding to a region in which the electronic device is located; and cause a first edge server, which obtained the first regional policy file, based on an ip address of the electronic device and a location of the first edge server, to provide a firmware package file to the electronic device in response to receiving the firmware download request.
Inventor(s): Jong Hoon SHIN of San Jose CA (US) for samsung electronics co., ltd., Ardavan PEDRAM of Santa Clara CA (US) for samsung electronics co., ltd., Joseph HASSOUN of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/063, G06N3/08
Abstract: a neural processing unit is disclosed that supports dual-sparsity modes. a weight buffer is configured to store weight values in an arrangement selected from a structured weight sparsity arrangement or a random weight sparsity arrangement. a weight multiplexer array is configured to output one or more weight values stored in the weight buffer as first operand values based on the selected weight sparsity arrangement. an activation buffer is configured to store activation values. an activation multiplexer array includes inputs to the activation multiplexer array that are coupled to the activation buffer, and is configured to output one or more activation values stored in the activation buffer as second operand values in which each respective second operand value and a corresponding first operand value forming an operand value pair. a multiplier array is configured to output a product value for each operand value pair.
Inventor(s): Ardavan PEDRAM of Santa Clara CA (US) for samsung electronics co., ltd., Jong Hoon SHIN of San Jose CA (US) for samsung electronics co., ltd., Joseph H. HASSOUN of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
Abstract: a memory system and a method are disclosed for training a neural network model. a decompressor unit decompresses an activation tensor to a first predetermined sparsity density based on the activation tensor being compressed, and decompresses an weight tensor to a second predetermined sparsity density based on the weight tensor being compressed. a buffer unit receives the activation tensor at the first predetermined sparsity density and the weight tensor at the second predetermined sparsity density. a neural processing unit receives the activation tensor and the weight tensor from the buffer unit and computes a result for the activation tensor and the weight tensor based on first predetermined sparsity density of the activation tensor and based on the second predetermined sparsity density of the weight tensor.
Inventor(s): Ardavan PEDRAM of Santa Clara CA (US) for samsung electronics co., ltd., Ali SHAFIEE ARDESTANI of San Jose CA (US) for samsung electronics co., ltd., Jong Hoon SHIN of San Jose CA (US) for samsung electronics co., ltd., Joseph H. HASSOUN of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/08, H03M7/30
Abstract: a neural network inference accelerator includes first and second neural processing units (npus) and a sparsity management unit. the first npu receives activation and weight tensors based on an activation sparsity density and a weight sparsity density both being greater than a predetermined sparsity density. the second npu receives activation and weight tensors based on at least one of the activation sparsity density and the weight sparsity density being less than or equal to the predetermined sparsity density. the sparsity management unit controls transfer of the activation tensor and the weight tensor based on the activation sparsity density and the weight sparsity density with respect to the predetermined sparsity density.
Inventor(s): Hyunsun PARK of Suwon-si (KR) for samsung electronics co., ltd., Yoojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongseok YU of Seoul (KR) for samsung electronics co., ltd., Sehwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Junwoo JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08, G06N3/04
Abstract: a method of processing data includes identifying a sparsity among information, included in input data, based on valid information or invalid information included in the input data, rearranging the input data based on the sparsity among the information indicating a distribution of the invalid values included in the input data, and generating, by performing an operation on the rearranged input data in the neural network, an output data.
Inventor(s): Kai Guo of Suwon-si (KR) for samsung electronics co., ltd., Seungwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongseong Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T5/00
Abstract: a method includes acquiring a current frame, a noise dispersion map for the current frame, and a first denoised frame for a previous frame; generating a weighted first denoised frame based on the noise dispersion map, the current frame, and the first denoised frame using a first neural network; generating an initial fused image based on the current frame and the weighted first denoised frame using a second neural network; and generating a second denoised frame for the current frame based on the initial fused image using a third neural network.
Inventor(s): Rajan Laxman Joshi of San Diego CA (US) for samsung electronics co., ltd., Madhukar Budagavi of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T9/00, H04N19/91
Abstract: an apparatus includes a communication interface and a processor operably coupled to the communication interface. the processor is configured to form a level of detail (lod) signal corresponding to a displacement field. the processor is also configured to identify a current sample in the lod signal. the processor is further configured to derive a context for the current sample in the lod signal. in addition, the processor is configured to produce an output bitstream by encoding the lod signal using the context.
Inventor(s): Lei ZHANG of Suwon-si (KR) for samsung electronics co., ltd., Yehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanwon SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06F18/214, G06N20/00, G06T5/50, G06V10/82, G06V20/70
Abstract: provided is an image processing method according to an embodiment, which includes: obtaining a label of a first image by inputting the first image to a recognition model; obtaining reference style data for a target reference image to which a visual sentiment label is assigned, the visual sentiment label being the same as the obtained label from among visual sentiment labels pre-assigned to reference images; generating second style data based on first style data for the first image and the obtained reference style data; and generating a second image based on the generated second style data.
Inventor(s): Artem Mikhailovich SEVASTOPOLSKIY of Moscow (RU) for samsung electronics co., ltd., Victor Sergeevich LEMPITSKY of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): G06T15/60, G06F18/214, G06N3/084, G06T7/194, G06T15/04, G06T15/10, G06T17/20
Abstract: the disclosure provides a method for generating relightable 3d portrait using a deep neural network and a computing device implementing the method. a possibility of obtaining, in real time and on computing devices having limited processing resources, realistically relighted 3d portraits having quality higher or at least comparable to quality achieved by prior art solutions, but without utilizing complex and costly equipment is provided. a method for rendering a relighted 3d portrait of a person, the method including: receiving an input defining a camera viewpoint and lighting conditions, rasterizing latent descriptors of a 3d point cloud at different resolutions based on the camera viewpoint to obtain rasterized images, wherein the 3d point cloud is generated based on a sequence of images captured by a camera with a blinking flash while moving the camera at least partly around an upper body, the sequence of images comprising a set of flash images and a set of no-flash images, processing the rasterized images with a deep neural network to predict albedo, normals, environmental shadow maps, and segmentation mask for the received camera viewpoint, and fusing the predicted albedo, normals, environmental shadow maps, and segmentation mask into the relighted 3d portrait based on the lighting conditions.
Inventor(s): Eric YIP of Suwon-si (KR) for samsung electronics co., ltd., Hyunkoo YANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeon SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, H04L65/1069, H04L65/75, H04L67/131
Abstract: a method performed by a first terminal is provided. the method includes identifying capabilities of the first terminal connected to at least one component device, establishing, via a server, a session associated with an augmented reality (ar) service based on the capabilities of the first terminal, performing pre-processing on 3 dimensional (3d) media data acquired by the at least one component device, and transmitting, to a second terminal, the pre-processed 3d media data.
Inventor(s): Vijay Narayan TIWARI of Bengaluru (IN) for samsung electronics co., ltd., Ankur TRISAL of Bengaluru (IN) for samsung electronics co., ltd., Dewanshu HASWANI of Bengaluru (IN) for samsung electronics co., ltd., Ashish GOYAL of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06V40/18, G01S7/41, G01S13/89, G06T7/60, G06T7/70, G06V40/19
Abstract: a method and a system for image capturing of an eye are provided. the image capturing method in an electronic device includes directing radar signals on one or more portions of the eye that is required to be captured, determining an amount of signals absorbed into one or more portions of the eye by measuring the amount of signals reflected by one or more portions of the eye and estimating size of one or more portions of the eye based on the amount of signals absorbed, and generating an image of the eye having the portions with the estimated sizes.
Inventor(s): Taeseop LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd., Sangyeob JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G08G5/00, H04W36/32
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a ue in a 5g or 6g communication system for supporting a higher data transmission rate that may efficiently report a flight path of the ue is disclosed. the ue may include a transceiver; and at least one processor configured to receive, from a base station via the transceiver, a first message for configuring a flight path update notification, identify that a flight path is updated, and transmit, to the base station via the transceiver, a second message including a flight path update indication for indicating that the flight path is updated based on the first message and the identification.
Inventor(s): Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Jongmin YOON of Suwon-si (KR) for samsung electronics co., ltd., Seungnyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Gisoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyusik CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20, G06T3/40
Abstract: a wearable device for adjusting the size of an effective display area depending on external illuminance and a control method is provided. the wearable device includes a display module and at least one processor, wherein the at least one processor may be configured to control the display module to output light having a first brightness value from at least one light source of the display module so as to display a virtual object in an effective display area having a first size, determine whether or not surrounding illuminance of the wearable device increases while the light having the first brightness value is output, change, based on the determination that the surrounding illuminance increases, a size of the effective display area displaying the virtual object from the first size to a second size, and control the display module to display the virtual object in the effective display area having the second size.
Inventor(s): Dongki Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihye Kim of Suwon-si (KR) for samsung electronics co., ltd., Changhoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeongphil Seo of Suwon-si (KR) for samsung electronics co., ltd., Kyeongjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungjin Lim of Suwon-si (KR) for samsung electronics co., ltd., Youngho Jung of Suwon-si (KR) for samsung electronics co., ltd., Yujin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/36
Abstract: provided is a display apparatus including: a liquid crystal panel; a source driver configured to output a grayscale voltage to the liquid crystal panel; a timing controller configured to transmit a source control signal to the source driver; a scaler configured to transmit image data corresponding to content received from an external source to the timing controller; and a controller configured to adjust a driving scan rate of the liquid crystal panel to correspond to a set scan rate of the content, and control at least one of the scaler or the timing controller to adjust a data rate of an output signal based on the driving scan rate.
Inventor(s): Junghoon CHO of Suwon-si (KR) for samsung electronics co., ltd., Yongnam Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisun Park of Suwon-si (KR) for samsung electronics co., ltd., Junil Sohn of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun Yi of Suwon-si (KR) for samsung electronics co., ltd., Bonkon Koo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/34, G06V30/19, G06V30/413
Abstract: disclosed is an electronic apparatus including a display, a memory configured to store at least one instruction, and at least one processor configured to execute the at least one instruction stored in the memory to obtain input documents, recognize, an element comprising at least one of a character, an image, or a combination of the character and the image; classify a type of each of the input documents based on a kind of the recognized element, and obtain calibration documents by arranging the recognized elements in a row based on the classified type of each of the input documents; and control the display to display the obtained calibration documents.
Inventor(s): Changbeom LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae Kim of Suwon-si (KR) for samsung electronics co., ltd., Hoseon Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/32, G10L15/22
Abstract: provided is an electronic device that may receive information corresponding to a user utterance from a first external electronic device, identify a second external electronic device to perform at least a part of an action corresponding to the user utterance, based on determining that the first external electronic device and the second external electronic device are not located within a specified range: determine a target external electronic device to provide a first notification and transmit a command to the target external electronic device to provide the first notification, and transmit a command to the second external electronic device to perform the part of the action corresponding to the user utterance.
Inventor(s): Lei YANG of Beijing (CN) for samsung electronics co., ltd., Wei LIU of Beijing (CN) for samsung electronics co., ltd., Lufen TAN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G10L17/02, G10L17/04, G10L17/18, G10L25/18
Abstract: an audio signal processing method, an audio signal processing apparatus, a computer device and a storage medium are provided. the audio signal processing method includes acquiring, by using the voice registration module based on a first audio signal, a first hidden state corresponding to a voice registration module is acquired, and, extracting, based on the first hidden state, a target audio signal from a second audio signal.
Inventor(s): Ji-hye Chung of Seoul (KR) for samsung electronics co., ltd., Cheong-jae Lee of Suwon-si (KR) for samsung electronics co., ltd., Hye-jeong Lee of Seoul (KR) for samsung electronics co., ltd., Yong-wook Shin of Osan-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L21/06, G10L15/22, H04M3/493
Abstract: an electronic apparatus, method, and computer readable medium are provided. the electronic apparatus includes a communicator, and a controller. the controller, based on a first voice input being received, controls the communicator to receive data including first response information corresponding to the first voice input from a server, and outputs the first response information on a display, and based on a second voice input being received, controls the communicator to receive data including second response information corresponding to the second voice input from the server, and outputs the second response information on the display. based on whether the second voice input is received within a predetermined time from a time corresponding to the output of the first response information, whether a use of utterance history information is identified, and the second response information is displayed differently based on whether the second voice input is received within the predetermined time.
Inventor(s): Tongsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Junghwan KWAK of Suwon-si (KR) for samsung electronics co., ltd., Seungjun BAE of Suwon-si (KR) for samsung electronics co., ltd., Chiweon YOON of Suwon-si (KR) for samsung electronics co., ltd., Byungkwan CHUN of Suwon-si (KR) for samsung electronics co., ltd., Youngmin JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10, G06F13/16
Abstract: a zq calibration circuit includes: a zq controller configured to detect an end of one interface mode, among a plurality of interface modes in which zq calibration is supported, and to instruct a switch to another interface mode in response to the one interface mode coming to an end; a zq engine configured to generate a first reference voltage corresponding to the one interface mode through a multi-reference voltage generator, to generate a second reference voltage corresponding to the another interface mode in response to the switch to the another interface mode being instructed, to perform the zq calibration based on the first reference voltage or the second reference voltage, and to output a calibration code; and a zq driver configured to output an output signal through an input/output pad based on the calibration code.
Inventor(s): Wangsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Minkyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Wonmuk Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/20, G11C7/02, G11C7/14
Abstract: a preamble detection circuit, an operating method thereof, and a memory device are provided. the preamble detection circuit includes a comparison circuit configured to compare a level of a data strobe signal with a level of a reference voltage and to output a comparison signal, and a reset signal generation circuit configured to output a reset signal having a pulse width corresponding to a preamble period of the data strobe signal based on the comparison signal.
Inventor(s): Sunghye Cho of Suwon-si (KR) for samsung electronics co., ltd., Kijun Lee of Suwon-si (KR) for samsung electronics co., ltd., Eunae Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyomin Sohn of Suwon-si (KR) for samsung electronics co., ltd., Yeonggeol Song of Suwon-si (KR) for samsung electronics co., ltd., Myungkyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406
Abstract: a memory device includes a memory cell array having a plurality of rows of memory cells therein, and a row hammer managing circuit, which is configured to detect a row hammer address based on a pre row hammer address, and each of a plurality of input row addresses associated with a plurality of accesses during a monitoring period for monitoring the plurality of accesses to a plurality of the rows of memory cells. a refresh control circuit is provided and is configured to perform a refresh operation on a memory cell row physically adjacent to a memory cell row corresponding to the row hammer address.
Inventor(s): Sunghye Cho of Suwon-si (KR) for samsung electronics co., ltd., Eunae Lee of Suwon-si (KR) for samsung electronics co., ltd., Jungmin You of Suwon-si (KR) for samsung electronics co., ltd., Yeonggeol Song of Suwon-si (KR) for samsung electronics co., ltd., Kyomin Sohn of Suwon-si (KR) for samsung electronics co., ltd., Kijun Lee of Suwon-si (KR) for samsung electronics co., ltd., Myungkyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406, G11C11/4078
Abstract: a device, an operating method of a memory controller, a memory device, and a compute express link (cxl) memory expansion device all for managing a row hammer are provided. the device includes a volatile memory and a memory controller that is configured to detect, based on input row addresses, a pattern size of a row hammer attack pattern and a row distribution of row hammer addresses, to determine, according to a type of the row distribution, whether to perform refresh management, and for every l access corresponding to the pattern size, to provide, to the volatile memory, a refresh management command and a target row address, where l is an integer greater than or equal to 1.
Inventor(s): SEUNGKI HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4074, G11C11/406, G11C11/408
Abstract: a memory device and a method of precharging a decoded address are provided. the memory device includes a memory cell array including a plurality of rows; a row decoder configured to select a row to be activated from among the plurality of rows based on a decoded row address; and an interface circuit configured to: generate the decoded row address based on decoding a plurality of bits of a row address, transfer the decoded row address to the row decoder, and in an idle non-power-down mode of the memory device, precharge the decoded row address that is transferred to the row decoder in response to a predetermined condition being satisfied.
Inventor(s): SEUNGKI HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/408, G11C11/406, G11C11/4093
Abstract: a memory device and a method of precharging a decoded address are provided. the memory device includes a memory cell array comprising a plurality of rows; a row decoder configured to select a row to be activated from among the plurality of rows based on a decoded row address; and an interface circuit configured to: generate the decoded row address based on decoding a plurality of bits of a row address, transfer the decoded row address to the row decoder, in a first mode of the memory device, precharge the decoded row address that is transferred to the row decoder, and in a second mode of the memory device, determine whether a precharge signal is received in the second mode, and precharge the decoded row address based on the precharge signal.
Inventor(s): Sun Young KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang-Yun KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghun SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/408, H10B12/00
Abstract: a semiconductor memory device is provided which is capable of adaptively controlling bias and a method of operating the same. the semiconductor memory device includes: a memory cell area including a plurality of first transistors to which a first bias voltage is applied; and a peripheral circuit area which overlaps the memory cell area in a first direction and includes a plurality of second transistors to which a second bias voltage controlled differently from the first bias voltage is applied.
Inventor(s): Changyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyuchang Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/4094
Abstract: a sense amplifier includes a first isolation transistor connected to a first memory cell through a first bit line, a second isolation transistor connected to a second memory cell through a second bit line, and sense amplifying circuitry connected to the first memory cell through the first isolation transistor, connected to the second memory cell through the second isolation transistor, and latch, to a pair of sense bit lines, data corresponding to a cell voltage stored in the first memory cell or the second memory cell, wherein the sense amplifying circuitry is configured to perform an offset cancellation operation while a charge sharing operation is performed between the first memory cell and the first bit line or between the second memory cell and the second bit line.
Inventor(s): Hoseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Younghun Seo of Suwon-si (KR) for samsung electronics co., ltd., Kangsub Jeong of Suwon-si (KR) for samsung electronics co., ltd., Sangyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongil Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/408
Abstract: a memory core circuit includes: (i) a memory cell array having sub cell arrays therein, and (ii) a core control circuit having sub peripheral circuits therein, such that each sub peripheral circuit extends underneath a corresponding sub cell array. each sub cell array includes memory cells respectively connected to wordlines and bitlines. each sub peripheral circuit includes sub wordline drivers configured to drive the wordlines, bitline sense amplifiers configured to sense voltages of the bitlines, a row decoding circuit configured to control the sub wordline drivers to select one of the wordlines, a power circuit configured to supply power to each sub peripheral circuit, and a control circuit configured to control operation of each sub peripheral circuit. by using a cop structure that efficiently provides the core control circuit, the size of the memory core circuit may be reduced and a design margin may be enhanced.
Inventor(s): GUNHEE CHO of SUWON-SI (KR) for samsung electronics co., ltd., WONYOUNG CHOI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4093, G11C11/4076, G11C11/408, G11C11/4096, G11C29/50
Abstract: a semiconductor memory device includes a receiving circuit, a multiplexing circuit, a decoding circuit and a memory cell array. the receiving circuit receives a plurality of input command/address (ca) signals, and generates a plurality of ca signal groups based on the input ca signals and a clock signal. the multiplexing circuit operates in one of a first operation mode and a second operation mode based on a mode selection signal, outputs the plurality of ca signal groups as a plurality of selected ca signal groups in the first operation mode, and generates the plurality of selected ca signal groups by multiplexing the plurality of sub-ca signals included in the plurality of ca signal groups in the second operation mode. the decoding circuit generates a plurality of output ca signals based on the plurality of selected ca signal groups.
Inventor(s): Changseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Minhyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunggeol NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/04, H01L29/10, H01L29/18, H01L29/20, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35
Abstract: a nonvolatile memory device may include a channel layer extending in a first direction; a plurality of gate electrodes and a plurality of spacers alternately arranged with each other in the first direction, and a gate insulating layer extending in the first direction. each of the plurality of gate electrodes and each of the plurality of spacers may extend in a second direction crossing the first direction. the gate insulating layer may extend in the first direction. the gate insulating layer may be between the channel layer and the plurality of gate electrodes. the channel layer may include a two-dimensional semiconductor material having an electrically p-type property.
Inventor(s): SUNG-MIN JOE of SEOUL (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C16/04, G11C16/10, G11C16/26, G11C16/34, H01L23/00, H01L25/065, H01L25/18, H10B41/27, H10B43/27
Abstract: according to an exemplary embodiment of the inventive concept, there is provided a nonvolatile memory device comprising: a memory cell region including a first metal pad, a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad, a memory cell array, in the memory cell region, comprising a plurality of memory cells, a plurality of word lines and a bit line connected to the memory cells, wherein each memory cell is connected to one of the word lines, a voltage generator, in the peripheral circuit region, supplying a plurality of supply voltages to the memory cell array, a control logic circuit, in the peripheral circuit region, programming a selected one of the memory cells connected to a selected one of the word lines into a first program state by controlling the voltage generator, and a verify circuit, in the peripheral circuit region, controlling a verify operation on the memory cell array by controlling the voltage generator, wherein the verify circuit controls a word line voltage applied to at least one unselected word line not to be programmed among the plurality of word lines in the verify operation and a bit line voltage applied to the bit line connected differently from a voltage level of a voltage applied in a read operation of the nonvolatile memory device.
Inventor(s): Chunghyun RYU of Suwon-si (KR) for samsung electronics co., ltd., Jaewoong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/30, G11C5/14, H02J7/00, H02J7/34
Abstract: a method of providing an auxiliary power by an auxiliary power supply. the method may include converting an external power to a plurality of charging voltages; charging a charging circuit with a first charging voltage of the plurality of charging voltages; monitoring a voltage of the charging circuit; when capacitance of the charging circuit is less than a first reference capacitance, charging the charging circuit with a second charging voltage of the plurality of charging voltages, the second charging voltage being higher than the first charging voltage by a first voltage amount; and providing an auxiliary power to outside the auxiliary power supply. the auxiliary power may be generated based on the voltage of the charging circuit.
Inventor(s): HYUNGSIK KO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
Abstract: provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.
Inventor(s): HYUNGSIK KO of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/3065, H01J37/32, H01L21/67, H01L21/683, H01L21/687
Abstract: a substrate processing method includes classifying a kind of substrate treatment process in which a focus ring is used, classifying a plurality of focus rings, selecting from the classified plurality of focus rings a specific focus ring suitable for a certain substrate treatment process corresponding to the classified kind of substrate treatment process, and performing the certain substrate treatment process using the selected specific focus ring. the operation of classifying the plurality of focus rings includes classifying the plurality of focus rings into two or more grades.
Inventor(s): Wonsu LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungdae PARK of Suwon-si (KR) for samsung electronics co., ltd., Kimoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jong-San CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H05H1/24, H05H1/26
Abstract: a gas treatment method, including: treating an exhaust gas discharged from a semiconductor process chamber using a gas treatment system; and discharging the treated exhaust gas, wherein the treating of the exhaust gas includes: operating a first thermal oxidizer to treat the exhaust gas discharged from the semiconductor process chamber, the first thermal oxidizer being connected to the semiconductor process chamber and allowing the treated exhaust gas to pass through a plasma processing apparatus connected to the first thermal oxidizer; stopping the operation of the first thermal oxidizer to perform maintenance on the first thermal oxidizer; and wherein the stopping the operation of the first thermal oxidizer comprises: performing maintenance on the first thermal oxidizer; and operating the plasma processing apparatus to treat the exhaust gas discharged from the semiconductor process chamber
Inventor(s): Youngchul Kwon of Suwon-si (KR) for samsung electronics co., ltd., Deoksuk Jang of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/78, B23K26/06, B23K26/0622, B23K26/53
Abstract: a wafer dicing method includes preparing a wafer that includes a plurality of device forming regions and a scribe lane region that separates the plurality of device forming regions, forming a plurality of semiconductor devices in the plurality of device forming regions of the wafer, respectively, forming a plurality of inner cracks in the scribe lane region of the wafer by repeatedly irradiating a multiple pulse laser beam that includes a plurality of sub-laser beams along the scribe lane region, wherein the plurality of sub-laser beams have decreasing peak powers, and separating the plurality of semiconductor devices from each other along the plurality of inner cracks.
Inventor(s): Kyungsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Junho HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L21/56, H01L23/528, H10B20/25
Abstract: provided are a semiconductor chip and a method of manufacturing a semiconductor package including the semiconductor chip. the semiconductor chip includes a front end of line (feol) including an active layer, a back end of line (beol) including a plurality of metal layers including a wire, an optional dicing line along which dicing is optionally performed, and an isolation block configured to process a signal for a discontinuous wire when the wire is discontinuous by being diced along the optional dicing line, and a chip die on which the active layer is not formed around a cross section cut by the optional dicing line. thus, the production yield of the semiconductor chip may be improved, and the production costs thereof may be reduced.
20240096717.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): AE-NEE JANG of Suwon-si (KR) for samsung electronics co., ltd., SEUNGDUK BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00, H01L23/31, H01L23/498, H01L25/065
Abstract: a semiconductor package includes a first semiconductor chip on a substrate and including a first semiconductor substrate and a first test pattern on a first surface of the first semiconductor substrate, and a second semiconductor chip on the first semiconductor chip and including a second semiconductor substrate and a second test pattern on a second surface of the second semiconductor substrate. the first and second semiconductor chips bonded to allow the first test pattern to face the second test pattern. the first test pattern includes a first in-pad, first connection pads, and a first out-pad. the second test pattern includes a second in-pad bonded to the first in-pad, a second out-pad bonded to the first out-pad, and second connection pads bonded to the first connection pads. the first and second connection pads are connected in series to alternately connect with each other and form a series wiring pattern, so that each first connection pad connects to another first connection pad in one direction along the series wiring pattern and to a second connection pad in an opposite direction along the series wiring pattern.
20240096728.SEMICONDUCTOR PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin Kyeong Seol of Suwon-si (KR) for samsung electronics co., ltd., Hyuek Jae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/00, H01L23/31, H01L25/065, H10B80/00
Abstract: a semiconductor package is provided. the semiconductor package comprises a first semiconductor die including a memory, a second semiconductor die including a memory and on the first semiconductor die, a dummy die on the semiconductor device and not including a memory, a heat sink on the dummy die and including a metal material and a mold film on side surfaces of each of the first semiconductor die, the second semiconductor die, the dummy die, and the heat sink. a width of the heat sink may decrease away from a top surface of the dummy die, and side surfaces of the heat sink may be curved.
20240096748.CHIP PROTECTION DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taejun JEON of Suwon-si (KR) for samsung electronics co., ltd., Yongkwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Gyuhyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Junwoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/473, H01L23/00
Abstract: a chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. the protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. a plurality of apertures are formed through the side walls and through which a fluid enters and exits. the protection frame defines an inner space in which the fluid can flow via the plurality of apertures. heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.
20240096755.INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Heewon KANG of Suwon-si (KR) for samsung electronics co., ltd., Byungsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunhee PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangjoon CHEON of Suwon-si (KR) for samsung electronics co., ltd., Jaeseung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, G06F30/392, G06F30/394
Abstract: an integrated circuit device includes a first chip and a second chip. the first chip includes a first substrate including a through-via region, a prohibition region, and a device region, the prohibition region surrounding the through-via region in a plan view. the first chip further includes a through-via penetrating the first substrate in the through-via region, and a power gating cell disposed in the prohibition region. the second chip includes a second substrate, and a plurality of circuit blocks configured to receive power and/or signals through the through-via.
20240096773.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyounglim Suk of Suwon-si (KR) for samsung electronics co., ltd., Yeonho Jang of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/538
Abstract: a semiconductor package includes a redistribution structure in which at least one redistribution layer and at least one insulating layer are alternately stacked; a semiconductor chip electrically connected to the at least one redistribution layer; and bumps on the redistribution structure, wherein the redistribution structure includes vias extending from the at least one redistribution layer in a vertical stacking direction of the redistribution structure; and under bump metallurgy (ubm) structures electrically connected between the vias and the bumps and configured to face the bumps in the vertical stacking direction of the redistribution structure, wherein each of the ubm structures includes a first ubm layer including a first metal material or an alloy of the first metal material; and a second ubm layer between one of the bumps and the first ubm layer and including a second metal material.
20240096777.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaesun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeonho JANG of Suwon-si (KR) for samsung electronics co., ltd., Yunseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/66, H01L23/00, H01L25/065
Abstract: a semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. a semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure. the redistribution layers include pads arranged to face the bumps, and each of the pads includes a first pad portion offset from a center of each of the pads in a first direction, a second pad portion offset from the center of each of the pads in a second direction, and a connection portion connecting the first and second pad portions. the connection portion includes a protruding portion that defines a first recessed region recessed adjacent to the first pad portion and a second recessed region recessed adjacent to the second pad portion.
20240096796.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L23/522, H01L23/532
Abstract: an integrated circuit device includes a plurality of wiring structures on a substrate and extending in a first direction parallel to an upper surface of the substrate and each including a wiring layer on the substrate and extending in a direction perpendicular to the upper surface of the substrate; an insulating pattern surrounding a sidewall of the wiring layer and including a first insulating material; and a capping layer on an upper surface of the wiring layer and including a conductive material; a via layer on the wiring structures, the via layer being electrically connected to one wiring structure; and an interlayer insulating layer covering a sidewall of the insulating pattern between each wiring structure of the plurality of wiring structures, the interlayer insulating layer having an upper surface higher than an upper surface of each wiring layer and an upper surface of each insulating pattern.
Inventor(s): MINJAE KANG of Suwon-si (KR) for samsung electronics co., ltd., YEONGGIL KIM of Suwon-si (KR) for samsung electronics co., ltd., WOOKYUNG YOU of Suwon-si (KR) for samsung electronics co., ltd., WOOJIN LEE of Suwon-si (KR) for samsung electronics co., ltd., JAYEONG HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L23/522, H01L23/532
Abstract: disclosed is a semiconductor device including a substrate, conductive structures on the substrate and extending in parallel to each other in a first direction, and a first interlayer dielectric layer in first and second trenches between the conductive structures. a width in a second direction of the first trench may be less than a width in the second direction of the second trench. the first interlayer dielectric layer may include a lower interlayer dielectric layer and an upper interlayer dielectric layer on the lower interlayer dielectric layer, sequentially stacked. a mechanical strength of the upper interlayer dielectric layer may be greater than a mechanical strength of the lower interlayer dielectric layer.
20240096815.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaegwon JANG of Suwon-si (KR) for samsung electronics co., ltd., Inhyung SONG of Suwon-si (KR) for samsung electronics co., ltd., Yeonho JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/498, H01L25/10, H01L25/16
Abstract: a semiconductor package includes: a first package substrate including a first redistribution structure; a second package substrate including a second redistribution structure; a semiconductor chip provided between the first package substrate and the second package substrate, and attached to the first package substrate; and a fiducial mark provided on the second package substrate and separated from the second redistribution structure in a plan view.
20240096819.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bong Ken YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L25/18, H10B80/00
Abstract: there is provided a semiconductor package in which warpage of an interposer is prevented to improve product reliability. the semiconductor package comprising a first substrate including a first insulating layer, and a first conductive pattern disposed in the first insulating layer, a semiconductor chip disposed on the first substrate, an interposer disposed on the semiconductor chip, wherein the interposer includes a second insulating layer, and a second conductive pattern disposed in the second insulating layer, a support member disposed on a bottom surface of the second insulating layer and is in contact with an upper surface of the semiconductor chip, wherein the support member includes a first lower pad and a bump disposed under the first lower pad and a first connection member disposed between the first substrate and the interposer so as to connect the first conductive pattern and the second conductive pattern to each other.
Inventor(s): Young Lyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Soo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., In Hyo HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/56, H01L23/16, H01L23/31, H01L23/498, H01L23/538, H01L25/00, H01L25/065, H10B80/00
Abstract: a method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.
20240096831.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Enbin Jo of Suwon-si (KR) for samsung electronics co., ltd., Hyungchul Shin of Suwon-si (KR) for samsung electronics co., ltd., Wonil Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyuekjae Lee of Suwon-si (KR) for samsung electronics co., ltd., Gwangjae Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
Abstract: a semiconductor package includes: a first semiconductor chip including a first pad on a first substrate, and a first insulating layer at least partially surrounding the first pad; and a second semiconductor chip including a second pad below a second substrate and contacting the first pad, and a second insulating layer at least partially surrounding the second pad and contacting the first insulating layer. the first pad includes a first surface contacting the second pad and a second surface opposite the first surface, and an inclined side surface between the first surface and the second surface. the inclined side surface includes a first side surface and a second side surface, facing each other and inclined at a first obtuse angle and a second obtuse angle with respect to the second surface, respectively. each of the first and second obtuse angles is about 100� to about 130�.
Inventor(s): Eunsu Lee of Suwon-si (KR) for samsung electronics co., ltd., Jongbo Shim of Suwon-si (KR) for samsung electronics co., ltd., Sungeun Pyo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
Abstract: a semiconductor device includes a first semiconductor chip. the first semiconductor chip includes a first semiconductor substrate having a first surface and a second surface opposite to the first surface, and having a first active layer adjacent to the first surface, the first semiconductor substrate having a quadrangle shape from a plan view; a first through electrode penetrating at least a portion of the first semiconductor substrate and connected to the first active layer; a second chip connection pad on the second surface of the first semiconductor substrate and connected to the first through electrode; a first dummy pattern positioned outside the second chip connection pad on the second surface of the first semiconductor substrate from the plan view, the first dummy pattern comprising a line pattern extending horizontally along the second surface of the first semiconductor substrate; and a first chip connection pad on the first surface of the first semiconductor substrate and connected to the first through electrode. the first dummy pattern is disposed adjacent to at least one side of four sides of the quadrangle shape of the first semiconductor substrate from the plan view.
Inventor(s): Ohguk KWON of Suwon-si (KR) for samsung electronics co., ltd., Sunjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon YEON of Suwon-si (KR) for samsung electronics co., ltd., Seungryong OH of Suwon-si (KR) for samsung electronics co., ltd., Huiyeong JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/66, H01L25/065
Abstract: a semiconductor package includes a first semiconductor chip including a first substrate, a plurality of through electrodes penetrating the first substrate, and first bonding pads provided on one surface of the first substrate and electrically connected to the plurality of through electrodes, a second semiconductor chip including a second substrate, a second wiring layer provided on one surface of the second substrate and having redistribution pads and test pads, and second bonding pads on the redistribution pads, the second semiconductor chip being stacked on the first semiconductor chip via conductive bumps that are disposed between first and second bonding pads, an adhesive layer filling a space between the conductive bumps, and flow prevention structures in the adhesive layer on a test pad region where the test pads are disposed.
Inventor(s): Unbyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Jeonggi Jin of Suwon-si (KR) for samsung electronics co., ltd., Gilman Kang of Suwon-si (KR) for samsung electronics co., ltd., Juil Choi of Suwon-si (KR) for samsung electronics co., ltd., Dongchul Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/48, H01L23/538
Abstract: a semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure and including a first through-electrode, a second semiconductor chip on the first semiconductor chip and including a central portion vertically overlapping the first semiconductor chip and an outer portion horizontally offset from a sidewall of the first semiconductor chip, a molding layer in contact with the first redistribution structure, the first semiconductor chip, and the second semiconductor chip, a second redistribution structure on the second semiconductor chip and the molding layer, a first vertical connection wire extending through the molding layer and extending from the first redistribution structure to the second redistribution structure, and a second vertical connection wire extending through the molding layer and extending from the first redistribution structure to the outer portion of the second semiconductor chip.
20240096879.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyu Man HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sung Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin Chan YUN of Suwon-si (KR) for samsung electronics co., ltd., Dong Kyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/822, H01L21/8234, H01L29/06, H01L29/423, H01L29/49, H01L29/66, H01L29/775
Abstract: a semiconductor device is provided. the semiconductor device includes an active pattern extending in a first horizontal direction, a plurality of lower nanosheets stacked on the active pattern and spaced apart from one another in a vertical direction, a separation layer on the plurality of lower nanosheets, a plurality of upper nanosheets stacked on the separation layer and spaced apart from one another in the vertical direction, a gate electrode extending on the active pattern in a second horizontal direction, the gate electrode surrounding each of the plurality of lower nanosheets, the separation layer and the plurality of upper nano sheets, and a first conductive layer between the gate electrode and each of a top surface and a bottom surface of the plurality of upper nanosheets. the first conductive layer is not between the gate electrode and sidewalls of the plurality of upper nanosheets.
Inventor(s): Seung Min Song of Halfmoon NY (US) for samsung electronics co., ltd., Seungchan Yun of Waterford NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L29/06, H01L29/423, H01L29/66, H01L29/775
Abstract: integrated circuit devices may include a first upper channel region on a substrate, a first lower channel region between the substrate and the first upper channel region, a first intergate insulator that is between the first lower channel region and the first upper channel region and includes a lower portion and an upper portion, an upper gate electrode, and a lower gate electrode between the substrate and the upper gate electrode. the first upper channel region and the upper portion of the first intergate insulator may be in the upper gate electrode. the first lower channel region and the lower portion of the first intergate insulator are in the lower gate electrode.
Inventor(s): Woo Cheol SHIN of Suwon-si (KR) for samsung electronics co., ltd., Myung Gil KANG of () for samsung electronics co., ltd., Sadaaki MASUOKA of () for samsung electronics co., ltd., Sang Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sung Man WHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/02, H01L21/8238, H01L29/04, H01L29/06, H01L29/16, H01L29/66, H01L29/78
Abstract: a semiconductor device includes a first semiconductor layer having first and second regions, a plurality of first channel layers spaced apart from each other in a vertical direction on the first region of the first semiconductor layer, a first gate electrode surrounding the plurality of first channel layers, a plurality of second channel layers spaced apart from one another in the vertical direction on the second region of the first semiconductor layer, and a second gate electrode surrounding the plurality of second channel layers, wherein each of the plurality of first channel layers has a first crystallographic orientation, and each of the plurality of second channel layers has a second crystallographic orientation different from the first crystallographic orientation, and wherein a thickness of each of the plurality of first channel layers is different from a thickness of each of the plurality of second channel layers.
Inventor(s): Jae-Min JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seung Hyun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/12
Abstract: a chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.
Inventor(s): Seunghyun Cho of Suwon-si (KR) for samsung electronics co., ltd., Jaemin Jung of Suwon-si (KR) for samsung electronics co., ltd., Jeongkyu Ha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/12, H05K7/20
Abstract: a chip on film (cof) package includes a film substrate including a base film having a mounting region, a main line pattern extending on the base film, and a branch line pattern extending on the base film and electrically connected to the main line pattern, a semiconductor chip vertically overlapping the mounting region, a first bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the main line pattern, and a second bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the branch line pattern, the branch line pattern extends so as not to overlap a first edge of the first bump structure facing a first edge of the mounting region and a first edge of the second bump structure facing the first edge of the mounting region.
Inventor(s): Jungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a capacitor structure includes a lower electrode structure disposed on a substrate, including an oxide of a first metal having 4 valence electrons, and being doped with a second metal having 3, 5, 6, or 7 valence electrons, a dielectric pattern disposed on a sidewall of the lower electrode structure, and an upper electrode disposed on a sidewall of the dielectric pattern.
Inventor(s): Joonyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunkyu HWANG of Suwon-si (KR) for samsung electronics co., ltd., Boram KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongseob KIM of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaejoon OH of Suwon-si (KR) for samsung electronics co., ltd., Injun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L21/3065, H01L23/473, H01L29/66, H10N39/00
Abstract: provided are a power device and a manufacturing method thereof. a power device includes a compound semiconductor layer epitaxially grown on a substrate, a gate formed on the compound semiconductor layer, a source and a drain provided on either side of the gate, a passivation layer provided to cover the source, drain, and gate, and a cooling space region provided to form a cooling path inside the substrate. the cooling space region may be formed to a predetermined depth from the surface of the substrate and include an enlargement region having a width increasing according to a depth from the surface of the substrate. the width of an inlet of the cooling space region is less than a maximum width of the enlargement region, and the passivation layer and the compound semiconductor layer are provided to open the cooling space region.
20240096945.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minhee Choi of Suwon-si (KR) for samsung electronics co., ltd., Seojin Jeong of Suwon-si (KR) for samsung electronics co., ltd., Seokhoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungtaek Kim of Suwon-si (KR) for samsung electronics co., ltd., Pankwi Park of Suwon-si (KR) for samsung electronics co., ltd., Moonseung Yang of Suwon-si (KR) for samsung electronics co., ltd., Ryong Ha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/66, H01L29/786
Abstract: an integrated circuit device includes a fin-type active region on a substrate; at least one nanosheet having a bottom surface facing the fin top; a gate line on the fin-type active region; and a source/drain region on the fin-type active region, adjacent to the gate line, and in contact with the at least one nanosheet, wherein the source/drain region includes a lower main body layer and an upper main body layer, a top surface of the lower main body layer includes a lower facet declining toward the substrate as it extends in a direction from the at least one nanosheet to a center of the source/drain region, and the upper main body layer includes a bottom surface contacting the lower facet and a top surface having an upper facet. with respect to a vertical cross section, the lower facet extends along a corresponding first line and the upper facet extends along a second line that intersects the first line.
20240096953.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juri LEE of Suwon-si (KR) for samsung electronics co., ltd., Taegon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sun-Ryung OH of Suwon-si (KR) for samsung electronics co., ltd., Sihyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/092, H01L29/423, H01L29/775, H01L29/786
Abstract: an integrated circuit (ic) device is provided. the ic device includes: a channel region on a substrate; a gate on the channel region; a first gate dielectric film including a first portion and a second portion, the first portion being in contact with the channel region between the channel region and the gate, and the second portion being apart from the channel region; and a second gate dielectric film including a third portion, the third portion being in contact with the second portion of the first gate dielectric film at a vertical level farther from the substrate than a top surface of the gate.
Inventor(s): Il Gyou SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyun Ho NOH of Suwon-si (KR) for samsung electronics co., ltd., Sang Yong KIM of Suwon-si (KR) for samsung electronics co., ltd., You Bin KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/786
Abstract: a semiconductor device includes an active pattern including: a lower pattern extending in a first direction, and a plurality of sheet patterns spaced apart from the lower pattern in a second direction; a gate structure on the lower pattern and including a gate electrode and a gate insulating film including an interfacial insulating film including a first vertical portion and a horizontal portion. a dimension in a third direction of the first vertical portion is greater than a dimension in the second direction of the horizontal portion. the first vertical portion includes: a first area contacting a source/drain pattern; and a second area provided between the first area and the gate electrode. the interfacial insulating film includes a first element other than silicon, wherein a concentration of the first element in the first area is greater than a concentration of the first element in the second area.
Inventor(s): Myunggil KANG of Suwon-si (KR) for samsung electronics co., ltd., Beomjin Park of Suwon-si (KR) for samsung electronics co., ltd., Dongwon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/092, H01L29/423, H01L29/66, H01L29/775, H01L29/786
Abstract: in some embodiments, an integrated circuit device includes a substrate, a fin-type active region on the substrate that extends in a first direction, a plurality of semiconductor patterns spaced apart from an upper surface of the fin-type active region and include a channel region, a gate electrode, and a gate cut insulating pattern. the gate electrode extends in a second direction on the fin-type active region and is disposed between the plurality of semiconductor patterns. the gate electrode includes a first sidewall extending in the second direction and a second sidewall extending in the first direction. the gate cut insulating pattern is on a second sidewall of the gate electrode. an upper portion of the gate cut insulating pattern is wider in the second direction than a lower portion of the gate cut insulating pattern. a portion of a sidewall of the gate cut insulating pattern is curved.
Inventor(s): Hyungjoo Na of Suwon-si (KR) for samsung electronics co., ltd., Woobin Song of Suwon-si (KR) for samsung electronics co., ltd., Jinwook Yang of Suwon-si (KR) for samsung electronics co., ltd., Cheoljin Yun of Suwon-si (KR) for samsung electronics co., ltd., Dongkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Yoshinao Harada of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/08, H01L29/10, H01L29/49, H01L29/66
Abstract: an integrated circuit semiconductor device includes a nanosheet extending above a substrate in a first horizontal direction, a gate electrode extending in a second horizontal direction while surrounding the nanosheet with a gate insulating layer therebetween, a first source/drain region on a side of the nanosheet, and a second source/drain region on another side of the nanosheet, wherein the first source/drain region includes first silicide layers provided inward from surfaces of the nanosheet, first metal layers surrounding the nanosheet from upper and lower sides of the first silicide layers, and a first nanosheet region provided between the first silicide layers, wherein the second source/drain region includes second silicide layers formed inward from the surfaces of the nanosheet, second metal layers surrounding the nanosheet from upper and lower sides of the second silicide layers, and a second nanosheet region provided between the second silicide layers.
20240096960.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seunghyun SONG of Suwon-si (KR) for samsung electronics co., ltd., Minsuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Pilkwang Kim of Suwon-si (KR) for samsung electronics co., ltd., Takeshi Okagaki of Suwon-si (KR) for samsung electronics co., ltd., Geunmyeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Ahyoung kim of Suwon-si (KR) for samsung electronics co., ltd., Yoonsuk Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L23/528, H01L27/092, H01L29/06, H01L29/423, H01L29/775, H01L29/786
Abstract: an integrated circuit device includes a back side interconnection structure extending in a first horizontal direction. an active substrate includes a fin-type active area extending in the first horizontal direction on the back side interconnection structure. a metal silicide film is between the back side interconnection structure and the active substrate. a plurality of gate structures extends in a second horizontal direction perpendicular to the first horizontal direction on the active substrate. a first source/drain area and a second source/drain area are spaced apart from each other in the first horizontal direction with the plurality of gate structures therebetween on the active substrate. the first source/drain area directly contacts the active substrate. the second source/drain area is spaced apart from the active substrate and insulated from the active substrate.
20240096980.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inyeal LEE of Suwon-si (KR) for samsung electronics co., ltd., Deokhan BAE of Suwon-si (KR) for samsung electronics co., ltd., Juyoun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/775, H01L29/786
Abstract: a semiconductor device includes an active pattern on a substrate with first and second regions; first and second source/drain regions on the first and second regions; first and second source/drain contacts on the first and second source/drain regions; and a separation structure intersecting the active pattern between the first and second source/drain contacts, and extending into the active pattern between the first and second source/drain regions, wherein an upper surface of the second source/drain contact is higher than an upper surface of the first source/drain contact, and wherein the separation structure has an asymmetrical structure having an upper surface of a first portion adjacent to the first source/drain contact higher than an upper surface of a second portion adjacent to the second source/drain contact.
Inventor(s): Jongjin Lee of Clifton Park NY (US) for samsung electronics co., ltd., Tae Sun Kim of Ballston Spa NY (US) for samsung electronics co., ltd., Wonhyuk Hong of Clifton Park NY (US) for samsung electronics co., ltd., Seungchan Yun of Waterford NY (US) for samsung electronics co., ltd., Kang-Ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/528, H01L29/06, H01L29/40, H01L29/423, H01L29/775
Abstract: integrated circuit devices and methods of forming the same are provided. the methods may include providing a substrate structure including a substrate, a bottom insulator and a semiconductor region between the substrate and the bottom insulator, the semiconductor region extending in a first direction; forming first and second preliminary transistor structures on the bottom insulator, wherein and the bottom insulator may include first and second portions that the first and second preliminary transistor structures respectively overlap, and a third portion between the first and second portions; replacing the third portion of the bottom insulator with a bottom semiconductor layer; forming a source/drain region between the first and second preliminary transistor structures; replacing the substrate and the semiconductor region with a backside insulator; forming a power contact in the backside insulator, wherein the source/drain region may overlap the power contact; and forming a power rail.
20240096991.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Subin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwon OH of Suwon-si (KR) for samsung electronics co., ltd., Jinho PARK of Suwon-si (KR) for samsung electronics co., ltd., Joongwon JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/088, H01L29/06, H01L29/775
Abstract: a semiconductor device includes a substrate including first and second regions; a first active fin extending in a first direction on the first region; a second active fin extending in the first direction on the second region; an isolation pattern on the substrate between the first and second regions; a first gate structure on the first active fin, extending in a second direction perpendicular to the first direction, and onto an upper surface of the isolation pattern; and a second gate structure on the second active fin, extending in the second direction, and onto the upper surface of the isolation pattern, wherein the first gate structure includes a first portion having a first width and a second portion having a second width that is less than the first width, and the second gate structure includes a third portion having the first width and a fourth portion having the second width.
20240096995.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Beomjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Myunggil KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Younggwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyumin YOO of Suwon-si (KR) for samsung electronics co., ltd., Soojin JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/06, H01L29/08, H01L29/66, H01L29/775, H01L29/786
Abstract: a semiconductor device, may include an active region extending in a first direction; a plurality of channel layers on the active region to be spaced apart from each other; a gate structure, surrounding the plurality of channel layers, respectively; and source/drain regions on the active region on at least one side of the gate structure, and contacting the plurality of channel layers, wherein the gate structure may include an upper portion on an uppermost channel layer among the plurality of channel layers and lower portions between each of the plurality of channel layers in a region vertically overlapping the plurality of channel layers, wherein a width of each of the plurality of channel layers in the first direction may be less than a width of lower portions of the gate structure, adjacent to the respective channel layers among the lower portions of the gate structure in the first direction.
Inventor(s): Daehee LEE of Suwon-si (KR) for samsung electronics co., ltd., Yuho WON of Suwon-si (KR) for samsung electronics co., ltd., Wonsik YOON of Suwon-si (KR) for samsung electronics co., ltd., Taehyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/06, H01L33/28, H01L33/30
Abstract: a quantum dot of a light emitting device, includes: a core; and a shell around the core and including halogen elements of at least one type, wherein a first number per unit volume of halogen elements in a first area of the shell, that includes an outer surface of the shell, is larger than a second number per unit volume of halogen elements in a second area of the shell other than the outer surface of the shell.
Inventor(s): Sukgi Hong of Seongnam-si (KR) for samsung electronics co., ltd., Byongyong Yu of Suwon-si (KR) for samsung electronics co., ltd., Donghee Yeon of Seoul (KR) for samsung electronics co., ltd., Byungjin Choi of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01M4/36, C01G53/00, C01G53/04, H01M4/525, H01M4/62
Abstract: a composite cathode active material includes: a core including a plurality of primary particles; and a shell on the core, wherein the primary particles include a first lithium transition metal oxide comprising nickel, the shell includes a first layer and a second layer on the first layer, the first layer includes a first composition containing a first metal, the second layer includes a second composition containing phosphorus, and the first metal includes at least one or more metal, other than nickel, belonging to any of groups 2 to 5 and groups 7 to 15 of the periodic table of the elements. also a cathode, and a lithium battery each including the composite cathode active material, and a method of preparing the composite cathode active material.
Inventor(s): Samuel CROSS of Cambridge MA (US) for samsung electronics co., ltd., Yan WANG of Brookline MA (US) for samsung electronics co., ltd., Mahdi AMACHRAA of Cambridge MA (US) for samsung electronics co., ltd.
IPC Code(s): H01M10/0562, H01M10/052
Abstract: a lithium garnet material has the formula lilazm1m2m3o, where m1 is one or a combination of (y, in, mg, ca, ba, sc, sr, ru) with oxidation number (valence) lower than 4+, m2 is one or a combination of (bi, ta, nb, mo, sb, te) with oxidation number (valence) higher than 4+, and m3 is one or a combination of (hf, ti, sn, si) with oxidation number (valence) equal to 4+, subject to 0<x≤1, 0≤y≤1, 0≤z≤2, 0<x+y+z≤2, and −0.2<�<0.2. also provided is a lithium garnet material which is the same as the aforementioned lithium garnet material except that m1 is one or a combination of (y, in, mg, ca, ba, sr, ru) and m2 is one or a combination of (bi, ta, nb, mo, sb, te, w). lithium oxide solid-state electrolyte materials have the same formula as the aforementioned lithium garnet materials but also include ge for m3.
Inventor(s): Youngjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Myeongjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00, H01M10/42, H01M10/48
Abstract: a method including determining a first internal short circuit resistance value of a first battery based on the sensor data, determining a first internal short circuit state of the first battery using the first internal short circuit resistance value, and performing a first control process of reducing a current of the first battery, for alleviating a current burden of the first battery, in response to the determined first internal short circuit state being a first state other than a predetermined normal state.
Inventor(s): Yusu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/12, H01F38/14, H02J50/40, H02M7/219, H04B5/00
Abstract: a wireless power receiver configured to receive wireless power from a wireless power transmitter comprises: a first coil configured to receive wireless power transmitted inductively; a second coil and a third coil configured to receive wireless power transmitted resonantly; a receiver integrated circuit (rxic) comprising a full bridge structure, and including a first rectifier circuit including a first fet, a second fet, a third fet, and a fourth fet; and a second rectifier circuit, wherein an output terminal of the second rectifier circuit is connected to an output terminal of the first rectifier circuit, sources of the first fet and the second fet are connected to a ground, and, based on the first fet and the second fet being switched to an on-state and the third fet and the fourth fet being switched to an off-state, based on the wireless power transmitter inductively transmitting the wireless power, the wireless power receiver is configured to receive the wireless power through the first coil, and convert the received wireless power to dc power by body diodes of the third fet and the fourth fet to receive power for booting the rxic, and, based on the wireless power transmitter resonantly transmitting the wireless power, the wireless power receiver is configured to receive the wireless power by inducing current in the third coil based on a magnetic field generated in the second coil, and rectify the received wireless power by the second rectifier circuit to receive power for booting the rxic.
Inventor(s): Yousung LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongil YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Yohan MOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoseok NA of Gyeonggi-do (KR) for samsung electronics co., ltd., Taeyoung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/52, H03F1/30, H03F3/24
Abstract: according to an embodiment, a radio frequency (rf) circuit comprises: a power amplifier; a switching circuit configured to electrically connect the power amplifier to a first switch in case that an output voltage of the power amplifier does not exceed a threshold voltage and to electrically connect the power amplifier to a terminating resistor in case that the output voltage of the power amplifier exceeds the threshold voltage; a first electrical path formed between the power amplifier and the switching circuit; and a first diode connected to a second electrical path formed from a first point of the first electrical path to the switching circuit, the first diode connected between the first point and the switching circuit.
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456
Abstract: a method for a channel state information (csi) feedback comprises receiving csi feedback configuration information for the csi feedback including a spatial channel information indicator based on a linear combination (lc) codebook, wherein the spatial channel information comprises at least one of a downlink channel matrix, a covariance matrix of the downlink channel matrix, or at least one eigenvector of the covariance matrix of the downlink channel matrix; deriving the spatial channel information indicator using the lc codebook that indicates a weighted linear combination of a plurality of basis vectors or a plurality of basis matrices as a representation of at least one of a downlink channel matrix, a covariance matrix of the downlink channel matrix, or at least one eigenvector of the covariance matrix of the downlink channel matrix; and transmitting over an uplink channel, the csi feedback including the spatial channel information indicator.
20240097764.CSI FEEDBACK IN CELLULAR SYSTEMS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B17/391, H04W24/02
Abstract: method and apparatuses for channel state information (csi) feedback in cellular systems. a method for operating a user equipment (ue) to report csi includes transmitting first information related to a capability of the ue to support machine learning (ml) based csi reporting and second information related to a selection of a ml model for csi reporting. the method further includes receiving third information related to configuring a first ml model for determining the csi, fourth information related to processing a ml model output, fifth information related to reception of csi reference signals (csi-rs s) on a cell, and the csi-rss based on the fifth information. the method further includes determining, based on the third and fourth information and the reception of the csi-rss, a csi report using the first ml model and transmitting a channel with the csi report.
Inventor(s): Suho JIN of Suwon-si (KR) for samsung electronics co., ltd., Jaebum BAE of Suwon-si (KR) for samsung electronics co., ltd., Dongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeontae CHO of Suwon-si (KR) for samsung electronics co., ltd., Yonggil HAN of Suwon-si (KR) for samsung electronics co., ltd., Bongsub KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon WOO of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/08, H04B7/0426, H04W72/0453
Abstract: the disclosure relates to a method for processing a communication path in a portable communication device, which includes: identifying whether at least some of a plurality of active elements included in a communication circuit disposed between an antenna and a communication processor are in an abnormal state and, based on an abnormal state of a first active element supporting delivery of a signal of a first frequency band among the plurality of active elements being detected, controlling the portable communication device to deliver the signal of the first frequency band based on a second active element different form the first active element among the plurality of active element, and a portable communication device supporting the same.
Inventor(s): Hyunjoong LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiyoung CHA of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungsoo JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Byounghoon JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/1812, H04L1/08, H04L1/1867, H04W72/21
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte).
Inventor(s): Hong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunmin HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0453, H04W72/1263
Abstract: an electronic device is provided. the electronic device includes at least one first communication device supporting at least one short-range communication, at least one second communication device supporting cellular communication, and at least one processor. the at least one processor may be configured to transmit a first message for requesting first information to an external electronic device supporting the short-range communication through the at least one first communication device, based on the execution command of the first application, receive a second message including the first information, compare the first information and the second information, transmit and/or receive data corresponding to the first application to and/or from the server through a part of the at least one second communication device, based on the electronic device being determined as the primary device, based on a comparison result of the first information and the second information.
Inventor(s): Kwonjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyojin LEE of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/14, H04W56/00
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate beyond a 4g communication system such as lte. the present disclosure relates to a method by a transmitting/receiving device, the method enabling: acquiring a time axis digital transmission signal; receiving a reception signal including a self-interference signal; extracting a time axis nonlinear signal sample from the time axis digital transmission signal; converting the time axis digital transmission signal and the time axis nonlinear signal sample into a frequency axis digital transmission signal and a frequency axis nonlinear signal sample; converting the reception signal into a frequency axis digital reception signal; estimating channel information of a self-interference channel, and a nonlinear signal coefficient of the self-interference signal, on the basis of the frequency axis digital transmission signal, the frequency axis nonlinear signal sample and the frequency axis digital reception signal; estimating the self-interference signal on the basis of the channel information and the nonlinear signal coefficient; and carrying out digital self-interference cancellation for the frequency axis digital reception signal by using the self-interference signal.
Inventor(s): Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Taehyoung KIM of Seoul (KR) for samsung electronics co., ltd., Jinyoung OH of Seoul (KR) for samsung electronics co., ltd., Youngwoo KWAK of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon CHOI of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04L5/00
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method by a terminal in a wireless communication system is provided. the method includes identifying a slot type of a terminal from a first slot type and a second slot type, determining a position of a demodulation reference signal (dmrs) based on the slot type, and receiving the dmrs based on the position from a base station.
Inventor(s): Mehrdad SHARIAT of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L67/51, H04L41/50
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). a method, by a network data analytics function (nwdaf) entity, for supporting user equipment (ue) data collection from a ue, includes receiving, from a service consumer network function (nf) entity, a first request for the ue data collection for analytics, the first request including analytics filter information, discovering an application function (af) entity that provides the ue data collection based on af profiles of the af entity, determining a list of subscription permanent identifiers (supis) from at least one of an access and mobile management function (amf) entity and a session management function (smf) entity based on the analytics filter information, transmitting, to the af entity, a second request for a subscription to the af entity for the ue data collection, wherein the subscription is associated with a list of ues related to the determined list of the supis, and receiving, from the af entity, a notification on processed data collected according to the subscription.
Inventor(s): Baekeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Bohyeon KIM of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
Abstract: an electronic device may include a first housing, a second housing, a hinge device configured to connect the first housing and the second housing so that the electronic device is switched from a folded state into an unfolded state, a first alloy member, at least a part of which is fixed to the first housing, the second housing, and the hinge device and which is made of a shape memory alloy material, a second alloy device, at least a part of which is fixed to the first housing and the second housing at a position different from the first alloy member and which is made of a shape memory alloy material, and a driving circuit configured to apply power to at least one of the first alloy member and the second alloy member so that at least one of the first alloy member and the second alloy member is restored. various other embodiments may be possible.
Inventor(s): Yonghee YANG of Suwon-si (KR) for samsung electronics co., ltd., Changhee Park of Suwon-si (KR) for samsung electronics co., ltd., Doil Ku of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
Abstract: an electronic device includes: a frame including a coupling surface; a circuit board assembly coupled to the coupling surface of the frame, the circuit board assembly including a circuit board and a fixing hole provided in a surface of the circuit board and penetrating the circuit board in a thickness direction; a connecting member electrically connected to the circuit board assembly; and a circuit board fixing member provided on the coupling surface of the frame and passing through the fixing hole in the circuit board to fix the circuit board assembly to the frame, wherein the circuit board fixing member includes: a snap-fitting portion configured to be elastically deformed when passing through the fixing hole to couple the circuit board assembly to the coupling surface, and configured to prevent the circuit board assembly coupled to the coupling surface from moving; a guide groove in which the connecting member is accommodated; and a body portion fixed on the coupling surface and configured to support the snap-fitting portion and the guide groove.
Inventor(s): Chang-Ryong HEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyun-Seok SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Ji-Hyun PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Sung-Hyuk SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Myung-Gon HONG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72412, H04B5/00, H04W4/80, H04W12/06, H04W76/14
Abstract: a method and electronic device for executing application concurrently with other devices are provided. an address of an external electronic device and a location of an application is obtained. a connection is established with a device using a short-range communication protocol. the application is obtained and executed in conjunction with the device.
Inventor(s): Dongcheol KIM of Suwon-Si (KR) for samsung electronics co., ltd., Geonjung Ko of Seoul (KR) for samsung electronics co., ltd., Jaehong Jung of Seoul (KR) for samsung electronics co., ltd., Juhyung Son of Uiwang-Si (KR) for samsung electronics co., ltd., Jinsam Kwak of Anyang-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/132, H04N19/105, H04N19/176, H04N19/186
Abstract: the video signal processing method comprises the steps of: downsampling luma components of reconstructed blocks adjacent to a current block; acquiring a maximum luma value from among the downsampled luma components based on a first index; acquiring a next-highest maximum luma value from among the downsampled luma components based on a second index; acquiring a maximum average luma value based on an average value of the maximum luma value and the next-highest maximum luma value; acquiring a next-lowest minimum luma value from among the downsampled luma components based on a third index; acquiring a minimum luma value from among the downsampled luma components based on a fourth index; and acquiring a minimum average luma value based on the next-lowest minimum luma value and the minimum luma value.
Inventor(s): Dongcheol Kim of Suwon-si (KR) for samsung electronics co., ltd., Geonjung Ko of Seoul (KR) for samsung electronics co., ltd., Jaehong Jung of Seoul (KR) for samsung electronics co., ltd., Juhyung Son of Jiwang-si (KR) for samsung electronics co., ltd., Jinsam Kwak of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/159, H04N19/105, H04N19/11, H04N19/176, H04N19/593
Abstract: disclosed is a video signal processing method and device for encoding or decoding a video signal. more specifically, disclosed are a video signal processing method and a video signal processing device for performing the method, the method comprising: obtaining reference line information indicating a reference line for intra prediction of a current block among a plurality of reference lines comprising neighboring samples of the current block; determining, on the basis of the reference line information, an intra prediction mode for the current block among a plurality of intra prediction modes constituting an intra prediction mode set; and decoding the current block on the basis of a plurality of reference samples on the reference line according to the reference line information and the determined intra prediction mode.
Inventor(s): Jongwoon JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinhyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungoh KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/45, H04N5/14, H04N5/915
Abstract: an electronic device includes an image sensor; a dynamic vision sensor (dvs); and at least one processor electrically connected to the image sensor and the dvs. the at least one processor shoots video by using the image sensor, determines the moving speed of a subject by using the dvs during the video shooting, determines the frame rate of the image sensor on the basis of the moving speed, controls that the image sensor outputs, on the basis of the frame rate, a plurality of image frames including the subject, and acquires a hyperlapse video on the basis of the plurality of image frames.
Inventor(s): Yongjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae NAM of Suwon-si (KR) for samsung electronics co., ltd., Valeriy PRUSHINSKIY of Suwon-si (KR) for samsung electronics co., ltd., Bonggyo SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/55, G01S17/89, H04N23/13, H04N23/45, H04N23/56, H04N23/57
Abstract: a lens assembly is provided. the lens assembly includes an image sensor, at least four lenses successively arranged along an optical axis from an object side toward the image sensor side, and at least one band pass filter having a transmittance of 90% to 90% with regard to at least some of light in the wavelength area of 800�1000 nm. at least one of the lenses is disposed between the band pass filter and the image sensor. with regard to light in the wavelength area of 400�700 nm, at least one of the lenses has a transmittance of 0% to 10%, and all of the lenses have an average transmittance of 0% to 5%.
Inventor(s): Yongchul LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeseong YU of Suwon-si (KR) for samsung electronics co., ltd., Jisu HAN of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/741, H04N23/73
Abstract: an operating method of an image sensor may include generating first result image data based on performing first image capturing. the first result image data may include a plurality of first standard dynamic range (sdr) image data and first high dynamic range (hdr) image data. the operating method may include generating first parameters based on the first result image data. the first parameters may be associated with the first image capturing and may include a plurality of first exposure times and a plurality of first sensor gains. the operating method may include generating an adjustment factor based on the first parameters and generating second parameters based on adjusting the first parameters based on the adjustment factor. the second parameters may include a plurality of second exposure times and a plurality of second sensor gains. the operating method may include generating performing second image capturing based on the second parameters.
Inventor(s): KYUNGMIN KIM of SUWON-SI (KR) for samsung electronics co., ltd., DONGKYUN JUNG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/627, H04N25/78
Abstract: an image sensor includes a pixel array including a plurality of pixels operating in a plurality of modes, a readout circuit configured to receive a pixel signal corresponding to each of the plurality of modes from each of the pixels and generate a pixel value that is a digital signal from the pixel signal, and a signal processor configured to determine whether a target pixel value is a black spot generation value for each of the pixels based on at least one of comparison pixel values of each comparison mode among a plurality of comparison modes having a smaller output gain than a target mode corresponding to the target pixel value, and correct the target pixel value when the target pixel value is the black spot generation value.
Inventor(s): Jungwook LIM of Hwaseong-si (KR) for samsung electronics co., ltd., Jihun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/704
Abstract: an image sensor including: a pixel array including first and second pixel groups, each of the first and second pixel groups includes of pixels arranged in rows and columns; and a row driver configured to provide transmission control signals to the pixel array, the first pixel group includes a first auto-focus (af) pixel including photodiodes arranged in a first direction, the pixels of the first pixel group output a pixel signal through a first column line, and the second pixel group includes a second af pixel including photodiodes arranged in a second direction perpendicular to the first direction, the pixels of the second pixel group output a pixel signal through a second column line, and the first af pixel of the first pixel group and the second af pixel of the second pixel group receive same transmission control signals.
Inventor(s): Semin Chang of Suwon-si (KR) for samsung electronics co., ltd., Seongwook Song of Suwon-si (KR) for samsung electronics co., ltd., Curie Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Park of Suwon-si (KR) for samsung electronics co., ltd., Chunghwan Park of Suwon-si (KR) for samsung electronics co., ltd., Myunghyun Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/76, H04N19/42, H04N23/57, H04N25/771, H04N25/78
Abstract: an image sensor, a mobile device, and an image sensor operation method for reducing a data transmission latency are disclosed. the image sensor includes an interface circuit configured to receive compressed data from an external processor, at least one memory configured to store the compressed data, and a control logic circuit configured to decompress the compressed data based on an initialized first clock rate, wherein, after the control logic circuit decompresses the compressed data, the first clock rate is reset to a second clock rate.
Inventor(s): Taewoo NOH of Suwon-si (KR) for samsung electronics co., ltd., Yongyoun Kim of Suwon-si (KR) for samsung electronics co., ltd., Taeeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Joon Heo of Suwon-si (KR) for samsung electronics co., ltd., Sangyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Isaac Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02, H04M1/02
Abstract: an electronic device according to an embodiment of the disclosure may include a housing, a camera module disposed in the housing, a sound output module disposed in the housing to be spaced apart from the camera module, a first sound hole positioned on the front surface of the electronic device, a second sound hole which is positioned on a side surface of the electronic device and includes a dummy hole disposed to be adjacent to the sound output module and at least partially closed, and a connection hole spaced farther apart from the sound output module than the dummy hole, a sound outlet formed through the housing to allow sound generated in the sound output module to be output therethrough, and connected to the first sound hole and the second sound hole, and a sound guide part formed in the housing along a direction in which the first sound hole and the second sound hole extend, and configured to connect the sound outlet, the first sound hole, and the second sound hole.
Inventor(s): Rohan RAJ of Bengaluru (IN) for samsung electronics co., ltd., Ashish Kumar GUPTA of Bengaluru (IN) for samsung electronics co., ltd., Sanjeevi Reddy GONDESI VENKATA MALIKARJUNA of Bengaluru (IN) for samsung electronics co., ltd., Mohanraja BALASUBRAMANIAM of Bengaluru (IN) for samsung electronics co., ltd., Prashant ASHOKCHITARE of Bengaluru (IN) for samsung electronics co., ltd., Ramkumar THIRUMALLI SURESHSAH of Bengaluru (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W8/20, H04B17/318, H04W36/36, H04W76/20
Abstract: a method performed by a multi-subscriber identity module (musim) user equipment (ue) for continuing operation of the musim ue in a first mode, the musim ue including a first sim and a second sim, and the method including transmitting, by the musim ue, an uplink signalling message in response to determining a trigger condition has been satisfied, the uplink signalling message including one of compatible band information for the first sim and the sim, or one or more other stacks serving band information associated with the second sim, receiving, by the musim ue from a network, a radio resource control (rrc) reconfiguration signalling message for performing at least one activity at the first sim in response to the transmitting the uplink signalling message, and performing, by the musim ue, the at least one activity based on the rrc reconfiguration signalling message.
Inventor(s): Jungshin PARK of Suwon-si (KR) for samsung electronics co., ltd., Yoonseon HAN of Suwon-si (KR) for samsung electronics co., ltd., Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/55, H04W12/06, H04W12/08, H04W12/71, H04W76/11
Abstract: the present disclosure relates to a pre-5th-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th-generation (4g) communication system such as long term evolution (lte). the disclosure relates to a method and an apparatus for authenticating an unmanned aerial service (uas) terminal using a mobile communication system and authorizing a uas in consideration of information about pairing between uas terminals. according to a provided method, a uas operator can authenticate a uas terminal using a mobile communication system without any additional process and can control a uas to be provided between an unmanned aerial vehicle (uav) and a uav controller (uac) which are allowed by the operator.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Caleb K. Lo of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L41/16, H04W24/02
Abstract: an ai/ml monitoring operation is based on a received monitoring configuration forming part of a configuration for using an ai/ml model for a communications system operation. based on the monitoring configuration, ai/ml model assistance information is reported, including ai/ml model monitoring results from the ai/ml monitoring operation. ai/ml model management and adaptation information based on those ai/ml model monitoring results is received, an ai/ml model management and adaptation operation is performed. the ai/ml model management and adaptation information may include parameters that characterize an action of ai/ml model management and adaptation or an indication of an action of ai/ml model management and adaptation. the action of ai/ml model management and adaptation may comprise one of model switch, model refinement or update, or model transfer.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W36/08, H04W52/02, H04W76/27
Abstract: a method, performed by a user equipment (ue), of performing measurement includes receiving measurement configuration information for measurement in an idle mode or an inactive mode from a base station, starting a timer based on the measurement configuration information, and performing measurement in the idle mode or the inactive mode while the timer running, wherein, when the timer expires in the idle mode or the inactive mode, the measurement configuration information is deleted.
Inventor(s): Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Songyean CHO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04L12/14, H04M15/00, H04W4/24, H04W8/02, H04W76/10, H04W76/11, H04W76/12, H04W88/16
Abstract: a method for transmitting and receiving a signal in a packet data network gateway (pgw) of a mobile communication system according to an embodiment of the present specification comprises the steps of: receiving a first request message which includes an identifier of a terminal and is associated with a packet data network connection; sending a second request message to a policy and charging rules function (pcrf) server on the basis of the received first request message; and if quality of service (qos) related information is included in a response message received in response to the second request message from the pcrf, performing a control associated with the packet data network connection on the basis of the qos related information. in a wireless communication system using a pmip according to the present invention, it is possible to generate a pdn connection in accordance with the default qos.
Inventor(s): Sangbum KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W76/20
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data rates. the disclosure discloses a method and an apparatus capable of optimizing early eps fallback. a method performed by a terminal in a wireless communication system includes receiving, from a base station of a first rat, a message to command an inter-rat ho, the message including information indicating that the inter-rat ho is triggered by eps fallback for ims voice; performing the inter-rat ho based on the message; based on a failure of the inter-rat ho, identifying whether there is a suitable cell of a second rat for selection; in case that there is no suitable cell of the second rat, selecting an acceptable cell of the second rat based on the ims voice being for an emergency service; and logging a time until the terminal accesses the acceptable cell of the second rat.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user (ue) in a wireless communication system according to an embodiment of the disclosure may include receiving a radio resource control (rrc) message including information related to a target cell for a handover, valid condition information of the target cell, and information indicating a handover type from a base station, receiving information related to turnoff of a serving cell from the base station, and performing the handover, based on configuration information regarding the target cell and valid condition information of the target cell.
Inventor(s): Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/14, H04B17/318, H04W36/30
Abstract: a method of a user equipment in a wireless communication system, includes: receiving, from a base station, configuration information including at least one of a pre-condition, a trigger condition, and a cancel condition for a handover from the base station to a satellite; receiving a first reference signal from the base station and a second reference signal from the satellite, respectively; measuring reference signal received power (rsrp) of each of the first reference signal and the second reference signal; and transmitting a first measurement report to the base station, based on a determination that the trigger condition related to the first reference signal and the pre-condition related to the second reference signal are satisfied.
Inventor(s): Seongsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeonu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Hongchan PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaeho YOON of Suwon-si (KR) for samsung electronics co., ltd., Sunkee LEE of Suwon-si (KR) for samsung electronics co., ltd., Junhak LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04M1/02, H04W36/00, H04W48/16
Abstract: electronic devices and methods according to various embodiments of the disclosure may comprise or utilize a display of which at least a portion is flexible and a display area exposed to the outside, which is changeable, an antenna module, a communication module for performing wireless local area network (lan) communication with an access point by using the antenna module, and a processor. various other embodiments are possible.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W36/00, H04W74/08
Abstract: an operating method performed by a user equipment (ue) in a wireless communication system according to some embodiments of the present disclosure may include: generating a source link for transmitting and receiving data to and from a source base station; receiving, from the source base station, a radio resource control (rrc) message including configuration information for handover to a target base station; starting a timer, in response to the reception of the rrc message; transmitting, to the target base station, a message for handover to the target base station while the timer is running; and determining, in a case where the handover to the target base station fails up until the timer expires, whether to trigger rrc re-establishment, based on a state of the source link.
Inventor(s): Bokkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyeongsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Jin KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongjun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W60/00, H04W64/00
Abstract: in various embodiments, a method performed by a mobility management device, includes obtaining mobility information of a user equipment (ue). the method includes generating a predicted tracking area list for the ue based on the mobility information. the method includes transmitting, to the ue, a message including the predicted tracking area list to initiate a registration procedure based on the ue being out of a range of a plurality of tracking areas of the predicted tracking area list. the method includes based on identifying downlink data for the ue, performing a paging procedure in each of cells in the predicted tracking area list.
Inventor(s): Juyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Heedon GHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W72/232
Abstract: the present disclosure relates to a communication technique that merges iot technology with a 5g communication system for supporting higher data transmission rates than 4g systems, and a system for same. the present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail business, security and safety-related services, etc.) on the basis of 5g communication technology and iot-related technology. in addition, the present disclosure relates to a method and device for transmitting a signal through a plurality of slots in a wireless communication system.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/00, H04W56/00, H04W74/08
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides method and apparatus of determining preamble and rach occasions for 2-step random access.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W74/04
Abstract: methods and apparatuses for facilitating broadcast target wake time (twt) negotiation on one link between multi-link devices (mlds) in a wireless local area network to establish broadcast twt schedules on other links between the same mlds. a non-access point (ap) mld comprises a processor and stations (stas), each comprising a transceiver configured to form a link with a corresponding ap of an ap mld. the processor is operably coupled to the stas and configured to generate or receive a first message for a broadcast twt negotiation, wherein the first message indicates that the broadcast twt negotiation is for a broadcast twt schedule on at least one first link of the links. the transceiver of a first of the stas is further configured to transmit or receive the first message to or from the ap mld over a second of the links.
Inventor(s): Guotao SHI of Suzhou Industrial Park (CN) for samsung electronics co., ltd.
IPC Code(s): H04W74/08
Abstract: a method and device for rts/cts adaptive enablement/disablement are provided. the method for rts/cts adaptive enablement includes changing a first state to a second state in response to determining that a first packet error rate satisfies a condition, the first packet error rate being measured in the first state, and each of the first state and the second state corresponding to a different one of an rts/cts enabled state and an rts/cts disabled state, and determining whether to change from the second state to the first state based on a second packet error rate and a threshold, the second packet error rate being measured in the second state.
Inventor(s): Youngkwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungjoon YU of Suwon-si (KR) for samsung electronics co., ltd., Myungjin KANG of Suwon-si (KR) for samsung electronics co., ltd., Jongho PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongphil LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W52/34, H04W72/0453
Abstract: an example electronic device includes at least one sensor including a grip sensor, at least one antenna, a radio frequency (rf) circuit including at least one antenna tuning circuit connected to the at least one antenna, and at least one communication processor operatively connected to the rf circuit. the at least one communication processor is configured to, control the rf circuit to transmit a random access preamble signal based on first transmission power and a first tuning value, identify whether a random access response (rar) signal is received via the rf circuit in response to the random access preamble signal, identify whether a set condition is satisfied, based on the rar signal not being received, change a tuning value of the at least one antenna tuning circuit which corresponds to the grip sensor from the first tuning value to a second tuning value, based on the set condition being satisfied, and control the rf circuit to transmit the random access preamble signal based on the first transmission power or second transmission power and the second tuning value.
Inventor(s): Michal WÓDCZAK of Warszawa (PL) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04W48/16, H04W48/20
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. an example method performed by an access and mobility management function (amf) node in a wireless communication system may include receiving extended access point (eap) capability related information from an eap, performing control plane expansion to include the eap, based on the received eap capability related information, creating an x2 interface with the amf node and the eap based on a number of relevant base stations, instructing the base station to establish an x2 interface with the eap based on the created x2 interface, and instructing the eap to establish a connection with a terminal.
Inventor(s): Jinhwan JEON of Suwon-si (KR) for samsung electronics co., ltd., Kwangho Jung of Suwon-si (KR) for samsung electronics co., ltd., Chihyun Cho of Suwon-si (KR) for samsung electronics co., ltd., Sangwon Ha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00, H05K1/11, H05K1/18, H05K3/00, H05K3/28, H05K3/34
Abstract: an electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. in the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.
Inventor(s): Haein CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Junghan KANG of Suwon-si (KR) for samsung electronics co., ltd., Bongjae RHEE of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20, H04M1/02, H05K1/02, H05K9/00
Abstract: a printed circuit board (pcb) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure configured to apply a pre-load to the thermal module in a direction toward the electronic component, where the pressurizing structure is separated from the second circuit board and is supported by the first circuit board or an external structure.
20240098964.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jihee JUN of Suwon-si (KR) for samsung electronics co., ltd., Injae BAE of Suwon-si (KR) for samsung electronics co., ltd., Jihoon CHANG of Suwon-si (KR) for samsung electronics co., ltd., Dongsik PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a s/a circuit, bit lines, a gate electrode, a gate insulation pattern, a channel, an upper contact plug and a capacitor on a substrate. the bit lines includes first, second, third and fourth bit lines sequentially arranged in the second direction. a first lower contact plug, a first lower wiring and a second lower contact plug are sequentially stacked in a third direction between the s/a circuit and the first bit line, and are electrically connected to the s/a circuit and the first bit line. a third lower contact plug, a second lower wiring and a fourth lower contact plug are sequentially stacked in the third direction between the s/a circuit and the third bit line, and are electrically connected to the s/a circuit and the third bit line. the first and second lower wirings are at different levels from each other.
Inventor(s): Jeonil LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjun KIM of Gwangju (KR) for samsung electronics co., ltd., Jinbum KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device including an active pattern; a gate structure connected to the active pattern; a bit line structure connected to the active pattern; a buried contact connected to the active pattern; a contact pattern covering the buried contact; a landing pad connected to the contact pattern; and a capacitor structure connected to the landing pad, wherein the buried contact includes a first growth portion and a second growth portion spaced apart from each other, and the landing pad includes an interposition portion between the first growth portion and the second growth portion.
20240098984.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyungeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seokho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Joongchan SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokhan PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/78
Abstract: a semiconductor device may include a substrate, a bitline extending in a first direction on the substrate, and an active pattern on the bitline. the semiconductor device may include a back gate electrode extending beside one side of the active pattern in a second direction perpendicular to the first direction across the bitline, and a wordline extending in the second direction beside the other side of the active pattern. a length of the active pattern in the second direction may be greater than a length of the bitline in the second direction.
20240098985.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate having at least one active region, the at least one active region being defined by an isolation layer, at least one word line extending in a first horizontal direction inside the substrate, the at least one word line crossing the at least one active region, at least one bit line extending in a second horizontal direction orthogonal to the first horizontal direction, the at least one bit line being at a higher vertical level than the at least one word line, and at least one direct contact electrically connecting the at least one bit line to the at least one active region, the at least one direct contact having a maximum width in a third horizontal direction, the third horizontal direction intersecting each of the first horizontal direction and the second horizontal direction at an acute angle.
Inventor(s): Suncheul KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Donghyun LEE of Gwacheon-si (KR) for samsung electronics co., ltd., Uihyoung LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a contact forming method may include providing a semiconductor substrate including a silicon oxide film to an interior of a chamber, subjecting a surface of the silicon oxide film to plasma nitrification treatment, supplying a source gas including ticland honto the silicon oxide film subjected to the plasma nitrification treatment, and forming a barrier layer by igniting a plasma using the source gas.
Inventor(s): Junhyeok AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate having a cell array area and a peripheral circuit area, a plurality of first active areas defined in the cell array area and at least one second active area defined in the peripheral circuit area, a plurality of bit lines disposed in the substrate, a plurality of cell pad structures including a first conductive layer, a first intermediate layer, and a first metal layer having a first height from an upper surface of the first intermediate layer, and a peripheral circuit gate electrode disposed on the peripheral circuit area of the substrate and including a second conductive layer, a second intermediate layer, and a second metal layer having a second height from an upper surface of the second intermediate layer sequentially disposed on the at least one second active area, the second height being less than the first height.
Inventor(s): Siyeong Yang of Suwon-si (KR) for samsung electronics co., ltd., Sunggil Kim of Suwon-si (KR) for samsung electronics co., ltd., Yuyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jumi Bak of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H01L23/522, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/35, H10B43/40, H10B80/00
Abstract: a three-dimensional semiconductor memory device may include a substrate, a peripheral circuit structure on the substrate, and a cell array structure on the peripheral circuit structure. the cell array structure may include a stack that includes interlayer insulating layers and conductive patterns alternately stacked with one another, a source structure on the stack, and a vertical structure that extends in the stack and is electrically connected to a bottom surface of the source structure. the vertical structure may include a channel layer that includes first portions respectively in vertical channel holes extending in the stack, and a second portion that extends in a region between the stack and the source structure and is electrically connected to the first portions.
Inventor(s): Joonyoung Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/27, H10B41/41, H10B43/27, H10B80/00
Abstract: a semiconductor device includes a peripheral circuit structure including a plurality of circuit areas, a cell array structure including a pair of memory cell blocks overlapping the peripheral circuit structure in a first direction and spaced apart in a second direction, perpendicular to the first direction, with a peripheral circuit connection area therebetween, a first circuit area of the plurality of circuit areas that overlaps the peripheral circuit connection area in the first direction, and at least one contact plug extending in the first direction from the peripheral circuit connection area, and including a first end portion configured to connect to at least one circuit included in the first circuit area and facing the first circuit area and a second end portion configured to connect to an external connection terminal.
20240099015.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeonil LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20
Abstract: a semiconductor device includes a substrate. a plurality of horizontal structures is stacked on the substrate and spaced apart from each other. a plurality of vertical structures penetrates through the plurality of horizontal structures. each of the plurality of vertical structures includes a vertical source line, a vertical bit line, a channel layer, and a dielectric layer. the channel layer is in direct contact with the vertical source line and the vertical bit line. the dielectric layer is disposed between the plurality of horizontal structures and the channel layer. each of the plurality of horizontal structures includes a first conductive layer, a ferroelectric layer surrounding at least a portion of the first conductive layer, and a second conductive layer disposed between the ferroelectric layer and the dielectric layer.
20240099017.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/30
Abstract: a semiconductor device includes a plurality of memory cells each including a cell transistor and a memcitor connected to the cell transistor, and the memcitor includes an information storage layer including a ferroelectric material, a first electrode and a second electrode connected to both ends of the information storage layer, a fixed layer stacked on the information storage layer and including a paraelectric material or an antiferroelectric material, and a third electrode connected to the fixed layer without contacting the information storage layer.
Inventor(s): Heejae LEE of Suwon-si (KR) for samsung electronics co., ltd., Tae Ho KIM of Suwon-si (KR) for samsung electronics co., ltd., Jun-Mo YOO of Suwon-si (KR) for samsung electronics co., ltd., Ilyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Shin Ae JUN of Suwon-si (KR) for samsung electronics co., ltd., Dae Young CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Moon Gyu HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/115, H10K50/828, H10K71/12
Abstract: provided are an electroluminescent device, a method of manufacturing the same, and a display device including the same, the electroluminescent device including a first electron auxiliary layer, a first light emitting layer, and a first electrode disposed on a first surface of a transparent electrode; and a second electron auxiliary layer, a second light emitting layer, and a second electrode disposed on a second surface of the transparent electrode, wherein the first electron auxiliary layer and the second electron auxiliary layer each include a plurality of zinc oxide nanoparticles, a ratio (t/t) of a thickness (t) of the first electron auxiliary layer to a thickness (t) of the transparent electrode and a ratio (t/t) of a thickness (t) of the second electron auxiliary layer to the thickness (t) of the transparent electrode are each in the range of about 0.1 to about 4.0.
Inventor(s): Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/125, H10K50/12, H10K50/805, H10K85/30
Abstract: a composition, including m1 dopants; and m2 hosts, wherein m1 and m2 are each an integer of 1 or greater, when m1 is 2 or greater, two or more of the m1 dopants are different from each other, when m2 is 2 or greater, two or more of the m2 hosts are different from each other, and the composition has an image-modifying coordinate represented by:
Inventor(s): Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/125, H10K50/12, H10K50/805, H10K85/30
Abstract:
(x,y)
Inventor(s): Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Kyuyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/125, H10K50/12, H10K50/805, H10K85/30
Abstract: as defined herein.
Inventor(s): Tae-Gon KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung-Yeon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Ji Whan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Shin Ae JUN of Suwon-si (KR) for samsung electronics co., ltd., Deuk Seok CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K59/38, H10K59/32
Abstract: a display panel includes a color conversion panel and a light emitting panel, the light emitting panel includes a light emitting device that includes a first electrode, a second electrode, and a blue light emitting unit that includes an organic light emitting layer and is disposed between the first electrode and the second electrode and is configured to emit blue light. the color conversion panel includes a color conversion layer including at least two color conversion regions, and optionally, a partition wall defining that at least two regions, wherein the color conversion region includes a first region corresponding to a green pixel, a second region corresponding to a red pixel, and optionally a third region corresponding to a blue pixel. the first region includes a first composite including a matrix and a plurality of first semiconductor nanoparticles dispersed in the matrix, the first semiconductor nanoparticles includes a group i-iii-vi compound including silver, indium, gallium, and sulfur, and is configured to emit green light.
Inventor(s): Jaehyeong Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinhyoun Kang of Suwon-si (KR) for samsung electronics co., ltd., Jaeho Shin of Suwon-si (KR) for samsung electronics co., ltd., Daeseok Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N60/80, H10N60/01, H10N60/12
Abstract: a josephson junction device and a method of manufacturing the josephson junction device are disclosed. the josephson junction device includes a substrate having a top surface and a trench recessed below the first surface, wherein sidewalls of the substrate define sidewalls of the trench; a first superconducting electrode formed on the top surface of the substrate with sidewalls further defining the sidewalls of the trench; a tunneling thin film formed over the sidewalls of the substrate and over the sidewalls of the first superconducting electrode; and a second superconducting electrode formed in the trench in contact with the tunneling thin film and with top surface above the top surface of the substrate, wherein a superconducting tunnel junction is formed between the first superconducting electrode and the second superconducting electrode through the tunneling thin film.
Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Samsung Electronics Co., Ltd.
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- Samsung electronics co., ltd.
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- H10B53/30
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