18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18204241 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
Simplified Explanation
The method of manufacturing a semiconductor package involves separating the edge portion of a second metal layer from the main portion, applying a cover insulating layer, and placing a semiconductor chip on top.
- Applying a cutter to the boundary between the main portion and edge portion of the second metal layer.
- Peeling the edge portion of the second metal layer from the first metal layer.
- Forming a cover insulating layer on the main portion of the second metal layer.
- Placing a semiconductor chip on top of the cover insulating layer.
Potential Applications
This technology could be used in the manufacturing of various semiconductor devices, such as microprocessors, memory chips, and sensors.
Problems Solved
This method helps in improving the reliability and performance of semiconductor packages by providing better insulation and protection for the semiconductor chip.
Benefits
- Enhanced reliability of semiconductor packages - Improved performance of semiconductor devices - Simplified manufacturing process
Potential Commercial Applications
"Semiconductor Package Manufacturing Method for Improved Reliability and Performance"
Possible Prior Art
There may be prior art related to methods of insulating semiconductor chips and improving the reliability of semiconductor packages, but specific examples are not provided in this abstract.
Unanswered Questions
How does this method compare to traditional methods of semiconductor package manufacturing?
This article does not provide a direct comparison between this method and traditional manufacturing processes. It would be interesting to know if this method offers any significant advantages over existing techniques.
What are the specific materials used in the cover insulating layer, and how do they contribute to the performance of the semiconductor package?
The abstract does not detail the materials used in the cover insulating layer or their specific properties. Understanding the composition of this layer and its impact on the semiconductor package could provide valuable insights into the technology.
Original Abstract Submitted
A method of manufacturing a semiconductor package includes applying a cutter to a boundary between a main portion of a second metal layer and an edge portion of the second metal layer that surrounds the main portion, the second metal layer being on an upper surface of a first metal layer disposed on an upper surface of a carrier substrate, peeling the edge portion of the second metal layer from the first metal layer, forming a cover insulating layer on an upper surface of the main portion of the second metal layer, and disposing a semiconductor chip on an upper surface of the cover insulating layer.
