18504901. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES simplified abstract (Micron Technology, Inc.)

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METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES

Organization Name

Micron Technology, Inc.

Inventor(s)

Harsh Narendrakumar Jain of Boise ID (US)

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18504901 titled 'METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES

Simplified Explanation

The patent application describes a microelectronic device with a unique deck structure and staircase design.

  • The device includes alternating conductive and insulating structures arranged in tiers.
  • A second deck structure with additional tiers is positioned above the first deck structure.
  • A staircase structure within the first deck has steps made of the edges of the tiers.
  • A dielectric material covers the steps of the staircase structure and extends through the first deck.
  • A liner material is placed between the steps of the staircase structure, terminating at an interdeck region.
      1. Potential Applications
  • Microprocessors
  • Memory devices
  • Integrated circuits
      1. Problems Solved
  • Improved signal transmission
  • Enhanced thermal management
  • Increased device performance
      1. Benefits
  • Higher efficiency
  • Better reliability
  • Enhanced functionality


Original Abstract Submitted

A microelectronic device comprises a first deck structure comprising alternating conductive structures and insulating structures arranged in tiers, each of the tiers individually comprising one of the conductive structures and one of the insulating structures, a second deck structure vertically overlying the first deck structure and comprising additional tiers of the conductive structures and insulative structures, a staircase structure within the first deck structure and having steps comprising edges of the tiers, a dielectric material covering the steps of the staircase structure and extending through the first deck structure, and a liner material interposed between the steps of the staircase structure and terminating at an interdeck region between the first deck structure and the second deck structure. Related microelectronic devices, electronic systems, and methods are also described.

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