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Category:H01J37/32
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Pages in category "H01J37/32"
The following 183 pages are in this category, out of 183 total.
1
- 17641538. PLASMA PROCESSING DEVICE simplified abstract (Hitachi High-Tech Corporation)
- 17662107. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17674977. Deposition Apparatus and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17695062. PLASMA ETCHING APPARATUS AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 17713433. SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17750653. PLASMA ETCHING APPARATUS AND METHOD FOR OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17835864. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 17836657. PLASMA PRECLEAN SYSTEM FOR CLUSTER TOOL simplified abstract (Applied Materials, Inc.)
- 17837958. METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR SUBSTRATE IN A PLASMA ETCH CHAMBER simplified abstract (Applied Materials, Inc.)
- 17849914. PHYSICAL VAPOR DEPOSITION APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17850257. APPARATUS FOR ARCING DIAGNOSIS, PLASMA PROCESS EQUIPMENT INCLUDING THE SAME, AND ARCING DIAGNOSIS METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17850478. FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17851385. GAS DISTRIBUTION RING FOR PROCESS CHAMBER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17859316. HYBRID MATCHER AND RADIO FREQUENCY MATCHING SYSTEM INCLUDING THE HYBRID MATCHER simplified abstract (Samsung Electronics Co., Ltd.)
- 17864541. PLASMA CONTROL APPARATUS AND PLASMA PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 17865773. PLASMA EDGE RING, PLASMA ETCHING APPARATUS INCLUDING THE SAME, AND PLASMA ETCHING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17869987. APPARATUS FOR GENERATING ETCHANTS FOR REMOTE PLASMA PROCESSES simplified abstract (Applied Materials, Inc.)
- 17874475. DEVICE FOR MEASURING DENSITY OF PLASMA, PLASMA PROCESSING SYSTEM, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17877439. PLASMA GENERATOR, PLASMA PROCESSING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE PLASMA PROCESSING DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17883778. DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17893783. PLASMA ETCHING APPARATUS, PLASMA ETCHING METHOD USING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17945408. Substrate Bombardment with Ions having Targeted Mass using Pulsed Bias Phase Control simplified abstract (TOKYO ELECTRON LIMITED)
- 17946947. BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT simplified abstract (Applied Materials, Inc.)
- 17947675. WIDEBAND VARIABLE IMPEDANCE LOAD FOR HIGH VOLUME MANUFACTURING QUALIFICATION AND ON-SITE DIAGNOSTICS simplified abstract (Applied Materials, Inc.)
- 17948407. Optical Emission Spectroscopy for Advanced Process Characterization simplified abstract (TOKYO ELECTRON LIMITED)
- 17948768. High Aspect Ratio Contact (HARC) Etch simplified abstract (TOKYO ELECTRON LIMITED)
- 17948943. PLASMA BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17949083. IN-SITU CARBON LINER FOR HIGH ASPECT RATIO FEATURES simplified abstract (Applied Materials, Inc.)
- 17950001. Method and Apparatus for In-Situ Dry Development simplified abstract (TOKYO ELECTRON LIMITED)
- 17951910. PLASMA PROCESSING APPARATUS INCLUDING GAS DISTRIBUTION PLATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17961335. System and Method for Plasma Process Uniformity Control simplified abstract (Tokyo Electron Limited)
- 17970242. RF GENERATING DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17981874. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17992421. APPARATUS AND METHOD OF MANUFACTURING DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17993055. GAS SUPPLY MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18085949. UPPER ELECTRODE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18089691. SUBSTRATE PROCESSING APPARATUS, SIGNAL SOURCE DEVICE, METHOD OF PROCESSING MATERIAL LAYER, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18105648. SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18120916. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18121103. SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18124954. SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS, AND SEMICONDUCTOR EQUIPMENT INCLUDING THE SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18133277. PLASMA ETCHING APPARATUS AND OPERATING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18136448. PLASMA PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18138192. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18141341. SHOCK ABSORBING PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18162182. SENSOR MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18162274. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18164053. TARGET PROCESSING DEVICE AND TARGET PROCESSING METHOD simplified abstract (Kioxia Corporation)
- 18166196. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171992. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (Kioxia Corporation)
- 18184418. SEMICONDUCTOR PROCESS DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18188540. PLASMA SENSOR MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18199982. PLASMA CONTROL APPARATUS AND METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18208046. PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18211887. FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18220020. WIRELESS DATA COMMUNICATION IN PLASMA PROCESS CHAMBER THROUGH VI SENSOR AND RF GENERATOR simplified abstract (Applied Materials, Inc.)
- 18232123. PLASMA CONTROL DEVICE AND PLASMA CONTROL METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18232992. APPARATUS FOR PROCESSING PLASMA AND METHOD OF PROCESSING PLASMA AND MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18236748. EDGE RING, DRY ETCHING APPARATUS HAVING THE SAME, AND OPERATION METHOD OF ETCHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18237673. ELECTROSTATIC CHUCK ASSEMBLY FOR CRYOGENIC APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18240008. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18263920. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18274808. PLASMA PROCESSING DEVICE, HIGH-FREQUENCY POWER SUPPLY CIRCUIT, AND IMPEDANCE MATCHING METHOD simplified abstract (Tokyo Electron Limited)
- 18295466. PLASMA PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18334063. BROADBAND SUPPLY CIRCUITRY FOR A PLASMA PROCESSING SYSTEM simplified abstract (Applied Materials, Inc.)
- 18354220. SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18357725. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18368052. VACUUM SEALING INTEGRITY OF CRYOGENIC ELECTROSTATIC CHUCKS USING NON-CONTACT SURFACE TEMPERATURE MEASURING PROBES simplified abstract (Applied Materials, Inc.)
- 18370268. SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18371641. FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18372792. Selective Deposition of Thin Films with Improved Stability simplified abstract (Applied Materials, Inc.)
- 18372811. LARGE DIAMETER POROUS PLUG FOR ARGON DELIVERY simplified abstract (Applied Materials, Inc.)
- 18372818. SOFT-CHUCKING SCHEME FOR IMPROVED BACKSIDE PARTICLE PERFORMANCE simplified abstract (Applied Materials, Inc.)
- 18372995. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18380144. SEMICONDUCTOR PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18389827. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18392294. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18447479. SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18450625. PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (Kioxia Corporation)
- 18467775. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18469208. METHODS OF PROCESSING SUBSTRATES AND APPARATUSES THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18469687. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18469755. APPARATUS FOR TREATING SUBSTRATE simplified abstract (SEMES CO., LTD.)
- 18471002. SUBSTRATE PROCESSING APPARATUS, PLASMA GENERATION APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18477047. PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18504415. DC Bias in Plasma Process simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511845. IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513448. SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515220. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE simplified abstract (TOKYO ELECTRON LIMITED)
- 18519750. Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device simplified abstract (Kokusai Electric Corporation)
- 18520369. IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM simplified abstract (Applied Materials, Inc.)
- 18524767. FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING simplified abstract (TOKYO ELECTRON LIMITED)
- 18526472. SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18544468. PLASMA PROCESSING APPARATUS AND CLEANING METHOD simplified abstract (Tokyo Electron Limited)
2
- 20240014011. SUBSTRATE PROCESSING APPARATUS simplified abstract (WONIK IPS CO., LTD.)
- 20240014013. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 20240018648. Purge Ring for Reduced Substrate Backside Deposition simplified abstract (APPLIED MATERIALS, INC.)
- 20240018660. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 20240021408. METHODS AND APPARATUS FOR CONTROLLING PLASMA IN A PLASMA PROCESSING SYSTEM simplified abstract (Lam Research Corporation)
- 20240021411. VACUUM DEPOSITION INTO TRENCHES AND VIAS AND ETCH OF TRENCHES AND VIA simplified abstract (Ascentool, Inc.)
- 20240021416. CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 20240021421. VACUUM DEPOSITION INTO TRENCHES AND VIAS simplified abstract (Ascentool, Inc.)
- 20240030043. NEUTRAL BEAM ANNEALING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 20240038504. REPLACEABLE AND/OR COLLAPSIBLE EDGE RING ASSEMBLIES FOR PLASMA SHEATH TUNING INCORPORATING EDGE RING POSITIONING AND CENTERING FEATURES simplified abstract (Lam Research Corporation)
- 20240047185. SHARED RPS CLEAN AND BYPASS DELIVERY ARCHITECTURE simplified abstract (Applied Materials, Inc.)
- 20240047223. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 20240047247. SEMICONDUCTOR PROCESS DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240055289. VACUUM SEAL FOR ELECTROSTATIC CHUCK simplified abstract (Applied Materials, Inc.)
- 20240087856.SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME simplified abstract (samsung electronics co., ltd.)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 7th, 2024
K
- Kioxia corporation (20240096593). PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Kioxia corporation (20240096601). TARGET PROCESSING DEVICE AND TARGET PROCESSING METHOD simplified abstract
- Kioxia corporation (20240096607). SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
R
S
- SAMSUNG DISPLAY CO., LTD. patent applications on January 25th, 2024
- Samsung electronics co., ltd. (20240096606). PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096637). SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240102160). METHOD OF DEPOSITING ATOMIC LAYER simplified abstract
- Samsung electronics co., ltd. (20240105425). SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105426). SHOWERHEAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120177). SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240120213). SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128054). PLASMA CONTROL APPARATUS AND METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128055). APPARATUS FOR PROCESSING PLASMA AND METHOD OF PROCESSING PLASMA AND MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128056). PLASMA ETCHING APPARATUS AND OPERATING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240136155). PLASMA CONTROL DEVICE AND PLASMA CONTROL METHOD simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- SK hynix Inc. patent applications on January 18th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096609). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
U
- US Patent Application 17804496. Systems and Methods for Plasma Process simplified abstract
- US Patent Application 17829288. SITU CLEAN FOR BEVEL AND EDGE RING simplified abstract
- US Patent Application 17871455. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract
- US Patent Application 17871505. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract
- US Patent Application 18032786. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract
- US Patent Application 18199401. SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER simplified abstract
- US Patent Application 18200910. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract
- US Patent Application 18231165. DEVICE FOR ADJUSTING POSITION OF CHAMBER AND PLASMA PROCESS CHAMBER INCLUDING THE SAME FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- US Patent Application 18231278. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract
- US Patent Application 18231740. SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING simplified abstract
- US Patent Application 18232834. PLASMA PROCESSING APPARATUS simplified abstract
- US Patent Application 18249552. PLASMA PROCESSING APPARATUS simplified abstract
- US Patent Application 18251077. PLASMA PROCESSING APPARATUS simplified abstract
- US Patent Application 18324192. MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE simplified abstract
- US Patent Application 18341506. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18361767. SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS simplified abstract
- US Patent Application 18361771. SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS simplified abstract
- US Patent Application 18447410. FOCUS RING FOR A PLASMA-BASED SEMICONDUCTOR PROCESSING TOOL simplified abstract
- US Patent Application 18447543. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract
- US Patent Application 18447943. Plasma-Assisted Etching Of Metal Oxides simplified abstract
- US Patent Application 18448026. REPELLENT ELECTRODE FOR ELECTRON REPELLING simplified abstract