20240055289. VACUUM SEAL FOR ELECTROSTATIC CHUCK simplified abstract (Applied Materials, Inc.)
Contents
VACUUM SEAL FOR ELECTROSTATIC CHUCK
Organization Name
Inventor(s)
Vijay D. Parkhe of San Jose CA (US)
VACUUM SEAL FOR ELECTROSTATIC CHUCK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240055289 titled 'VACUUM SEAL FOR ELECTROSTATIC CHUCK
Simplified Explanation
- Electrostatic chuck body with support plate for substrate support - Base plate with annular recess for cooling - Cooling plate coupled with base plate for heat dissipation - Support stem for stability - Embedded heater and electrodes for temperature control - Annular plate with low thermal conductivity for insulation - Vacuum sealing element for maintaining vacuum pressure - Thermal gasket for additional sealing
Potential Applications
- Semiconductor manufacturing - Thin film deposition processes - Plasma etching processes
Problems Solved
- Maintaining stable temperature for substrate support - Ensuring proper heat dissipation - Maintaining vacuum pressure for process integrity
Benefits
- Improved substrate support stability - Enhanced temperature control - Increased process efficiency - Extended equipment lifespan
Original Abstract Submitted
exemplary substrate support assemblies may include an electrostatic chuck body. the body may include a support plate defining a substrate support surface. the body may include a base plate coupled with the support plate. a bottom surface of the base plate may define an annular recess. the body may include a cooling plate coupled with the base plate. the assemblies may include a support stem coupled with the body. the assemblies may include a heater embedded within the body. the assemblies may include one or more electrodes embedded within the body. the assemblies may include an annular plate disposed within the annular recess. the annular plate may have a thermal conductivity of less than about 20 w/mk. the assemblies may include a vacuum sealing element disposed between the annular plate and the cooling plate. the assemblies may include a thermal gasket disposed radially inward of the vacuum sealing element.
