18237673. ELECTROSTATIC CHUCK ASSEMBLY FOR CRYOGENIC APPLICATIONS simplified abstract (Applied Materials, Inc.)

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ELECTROSTATIC CHUCK ASSEMBLY FOR CRYOGENIC APPLICATIONS

Organization Name

Applied Materials, Inc.

Inventor(s)

Vijay D. Parkhe of San Jose CA (US)

ELECTROSTATIC CHUCK ASSEMBLY FOR CRYOGENIC APPLICATIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18237673 titled 'ELECTROSTATIC CHUCK ASSEMBLY FOR CRYOGENIC APPLICATIONS

Simplified Explanation

The abstract describes an electrostatic chuck assembly designed for use in cryogenic applications. The assembly includes an electrostatic chuck with a substrate supporting surface and a bottom surface, a cooling plate made of an aluminum alloy with a low coefficient of thermal expansion, and a bonding layer made of silicone material that secures the electrostatic chuck to the cooling plate.

  • The electrostatic chuck assembly is suitable for use in cryogenic applications.
  • The assembly includes an electrostatic chuck with a substrate supporting surface and a bottom surface.
  • A cooling plate made of an aluminum alloy with a low coefficient of thermal expansion is included in the assembly.
  • The bottom surface of the electrostatic chuck is secured to the top surface of the cooling plate using a bonding layer made of silicone material.

Potential applications of this technology:

  • Semiconductor manufacturing: The electrostatic chuck assembly can be used in cryogenic environments during the manufacturing of semiconductors.
  • Research and development: The assembly can be utilized in cryogenic research and development applications where precise temperature control is required.

Problems solved by this technology:

  • Thermal expansion mismatch: The use of an aluminum alloy cooling plate with a low coefficient of thermal expansion helps to minimize thermal expansion mismatch between the electrostatic chuck and the cooling plate, reducing the risk of damage or failure.
  • Temperature control: The electrostatic chuck assembly allows for precise temperature control in cryogenic applications, ensuring the stability and reliability of the process.

Benefits of this technology:

  • Improved performance: The use of a cooling plate with a low coefficient of thermal expansion and a silicone bonding layer enhances the performance and reliability of the electrostatic chuck assembly in cryogenic environments.
  • Cost-effective: The assembly provides a cost-effective solution for cryogenic applications, as it utilizes readily available materials and simple manufacturing processes.


Original Abstract Submitted

Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.

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