US Patent Application 18324192. MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE simplified abstract

From WikiPatents
Jump to navigation Jump to search

MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE

Organization Name

Japan Display Inc.

Inventor(s)

Noriyuki Hirata of Tokyo (JP)

Hiraaki Kokame of Tokyo (JP)

MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18324192 titled 'MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE

Simplified Explanation

- The patent application describes a manufacturing method for a display device. - The method involves forming a sealing layer using a deposition process and an etching process. - The deposition process includes introducing a material gas into a chamber and depositing silicon nitride on a processing substrate. - After the deposition process, the material gas is stopped and the residual gas inside the chamber is evacuated. - The etching process involves introducing a cleaning gas into the chamber through the same route as the material gas. - Anisotropic dry etching is performed to remove part of the silicon nitride deposited on the processing substrate. - The residual gas inside the chamber is then evacuated. - The combination of the deposition process and the etching process is performed at least twice.


Original Abstract Submitted

According to one embodiment, a manufacturing method of a display device includes forming a sealing layer. The forming the sealing layer includes a deposition process of introducing a material gas into a chamber, depositing silicon nitride on a processing substrate, stopping introduction of the material gas and evacuating a residual gas of inside of the chamber, and an etching process of introducing a cleaning gas into the chamber through a same route as the material gas, performing anisotropic dry etching for removing part of the silicon nitride deposited on the processing substrate, and evacuating a residual gas of the inside of the chamber. A combination of the deposition process and the etching process is performed at least twice.