17850478. FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
KYUNG-SUN Kim of Suwon-si (KR)
Nam Kyun Kim of Pyeongtaek-si (KR)
SANG KI Nam of Seongnam-si (KR)
KUIHYUN Yoon of Yongin-si (KR)
KANGMIN Jeon of Hwaseong-si (KR)
FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17850478 titled 'FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
The patent application describes a focus ring used in substrate processing apparatuses and methods. The focus ring consists of two separate rings, one formed around an axis and the other in contact with the first ring. The angles between the outer and inner lateral surfaces of the rings and the axis are different when viewed from a cross-sectional view.
- The focus ring is designed to improve substrate processing in apparatuses.
- The first and second rings are formed separately and have different angles with respect to the axis.
- The contact between the inner and outer lateral surfaces of the rings enhances the functionality of the focus ring.
Potential Applications
- Semiconductor manufacturing processes
- Thin film deposition
- Plasma etching
Problems Solved
- Improved focus and precision in substrate processing
- Enhanced uniformity of processing across the substrate surface
Benefits
- Increased efficiency and accuracy in substrate processing
- Improved control over deposition and etching processes
- Enhanced uniformity of film thickness and quality on substrates
Original Abstract Submitted
Disclosed are focus rings, substrate processing apparatuses including the same, and substrate processing methods using the same. The focus ring comprises a first ring formed around an axis that extends in a first direction and a second ring separate from the first ring and formed around the axis. A portion of an inner lateral surface of the second ring is in contact with a portion of an outer lateral surface of the first ring. When viewed from a cross-sectional view from a direction perpendicular to the axis, a first angle between the outer lateral surface and the first direction is different from a second angle between the inner lateral surface and the first direction.
