18105648. SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
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SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME
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SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18105648 titled 'SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME
Simplified Explanation
The substrate process apparatus described in the patent application includes a chamber body and a chamber lid. The chamber lid has a focus adapter that creates a diffusion space, which widens as it approaches the bottom of the focus adapter. The lid body surrounds the focus adapter, and a coupling adapter supports the focus adapter. The lid body has a coupling through hole that is recessed downwardly from its upper surface, and the coupling adapter has a coupling recess that is also recessed downwardly from its upper surface. The coupling recess is located below the coupling through hole and is spaced apart outwardly from the diffusion space.
- The substrate process apparatus includes a chamber body and a chamber lid with a focus adapter that creates a diffusion space.
- The diffusion space widens as it approaches the bottom of the focus adapter.
- The lid body surrounds the focus adapter, and the coupling adapter supports the focus adapter.
- The lid body has a coupling through hole recessed downwardly from its upper surface.
- The coupling adapter has a coupling recess recessed downwardly from its upper surface.
- The coupling recess is located below the coupling through hole and is spaced apart outwardly from the diffusion space.
Potential Applications:
- Semiconductor manufacturing: The substrate process apparatus can be used in the manufacturing of semiconductors, where precise control of diffusion and coupling is crucial.
- Thin film deposition: The apparatus can also be utilized in thin film deposition processes, ensuring uniformity and accuracy in the deposition process.
Problems Solved:
- Improved diffusion control: The focus adapter and diffusion space design allow for better control of diffusion processes within the chamber, leading to more precise and efficient substrate processing.
- Enhanced coupling support: The coupling adapter and coupling through hole provide stable and reliable support for the focus adapter, preventing misalignment or instability during the substrate process.
Benefits:
- Increased process efficiency: The improved diffusion control and stable coupling support result in more efficient substrate processing, reducing process time and improving overall productivity.
- Enhanced process accuracy: The precise control of diffusion and stable coupling support contribute to higher accuracy in substrate processing, ensuring consistent and reliable results.
- Versatile application: The substrate process apparatus can be applied to various industries and processes that require controlled diffusion and stable coupling, making it a versatile and adaptable technology.
Original Abstract Submitted
A substrate process apparatus includes a chamber body providing a process space and a chamber lid coupled to the chamber body, the chamber lid includes a focus adapter providing a diffusion space of which width increases in a direction approaching a bottom of the focus adapter, a lid body surrounding the focus adapter, and a coupling adapter supporting the focus adapter, the lid body provides a coupling through hole recessed downwardly from an upper surface of the lid body, the coupling adapter provides a coupling recess recessed downwardly from an upper surface of the coupling adapter, and the coupling recess is spaced apart outwardly from the diffusion space and is located below the coupling through hole.
