Taiwan semiconductor manufacturing co., ltd. (20240096609). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
Contents
- 1 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yen-Liang Lin of Yilan County (TW)
Yu-Chuan Tai of Tainan City (TW)
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096609 titled 'SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
Simplified Explanation
The physical vapor deposition tool described in the patent application includes a magnet component, a single cathode, and a power circuit for biasing a pedestal that supports a semiconductor substrate. During the deposition operation, the tool can modulate an electromagnetic field emanating from the magnet component, which has spiral-shaped bands with different ranges of magnetic strength. This setup allows for increased throughput and the deposition of inert metal material with a larger grain size compared to traditional physical vapor deposition tools.
- Magnet component, single cathode, and power circuit for biasing pedestal
- Modulation of electromagnetic field for increased throughput
- Deposition of inert metal material with larger grain size
Potential Applications
The technology described in the patent application could be applied in various industries where physical vapor deposition is used, such as semiconductor manufacturing, solar panel production, and optical coatings.
Problems Solved
1. Increased throughput in physical vapor deposition processes 2. Ability to deposit inert metal material with larger grain size
Benefits
1. Improved efficiency in deposition operations 2. Enhanced quality of deposited materials 3. Potential cost savings due to increased throughput
Potential Commercial Applications
"Enhanced Physical Vapor Deposition Tool for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to physical vapor deposition tools with magnet components, but specific examples are not provided in the patent application.
Unanswered Questions
How does the modulation of the electromagnetic field impact the deposition process?
The patent application mentions that the tool can modulate the electromagnetic field, but it does not provide detailed information on how this modulation affects the deposition process.
Are there any limitations to the increased throughput and larger grain size deposition?
While the patent application highlights the benefits of the technology, it does not address any potential limitations or challenges that may arise when using the enhanced physical vapor deposition tool.
Original Abstract Submitted
the physical vapor deposition tool includes a magnet component, a single cathode, and a power circuit for biasing a pedestal that supports a semiconductor substrate. during a deposition operation that deposits an inert metal material, the physical vapor deposition tool may modulate an electromagnetic field emanating from the magnet component that includes spiral-shaped bands having different ranges of magnetic strength. the physical vapor deposition tool may have an increased throughput relative to a physical vapor deposition tool without the magnet component, the single cathode, and the power circuit. additionally, or alternatively, the inert metal material may have a grain size that is greater relative to a grain size of an inert metal material deposited using the physical vapor deposition tool without the magnet component, the single cathode, and the power circuit.
