20240047247. SEMICONDUCTOR PROCESS DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PROCESS DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Chansoo Kang of Suwon-si (KR)

Daewon Kang of Suwon-si (KR)

Sangki Nam of Suwon-si (KR)

Jungmo Yang of Suwon-si (KR)

Changsoon Lim of Suwon-si (KR)

Sungho Jang of Suwon-si (KR)

Jonghun Pi of Suwon-si (KR)

Youngil Kang of Suwon-si (KR)

Yoonjae Kim of Suwon-si (KR)

Ilwoo Kim of Suwon-si (KR)

Jongmu Kim of Suwon-si (KR)

Yongbeom Park of Suwon-si (KR)

SEMICONDUCTOR PROCESS DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047247 titled 'SEMICONDUCTOR PROCESS DEVICE

Simplified Explanation

The abstract describes a semiconductor process device that includes a chamber housing with an internal region and multiple electrostatic chucks. The chamber housing has a window, and a light collection unit with two optical systems located at different positions on the window. There are multiple optical pickup units connected to each optical system. A sensor with multiple photodetectors converts the optical signals transmitted by the optical pickup units into electrical signals. A processor generates a spatial image of the internal region using the electrical signals and determines the location of an arc occurrence based on the spatial image.

  • The semiconductor process device includes a chamber housing with electrostatic chucks and a light collection unit with multiple optical systems.
  • Optical pickup units are connected to the optical systems to transmit optical signals.
  • A sensor with photodetectors converts the optical signals into electrical signals.
  • A processor uses the electrical signals to generate a spatial image of the internal region and locate arc occurrences.

Potential applications of this technology:

  • Semiconductor manufacturing processes
  • Quality control and monitoring in semiconductor production

Problems solved by this technology:

  • Detection and localization of arc occurrences in the internal region of the chamber housing
  • Improved monitoring and control of semiconductor manufacturing processes

Benefits of this technology:

  • Enhanced safety by identifying and addressing arc occurrences promptly
  • Improved efficiency and productivity in semiconductor manufacturing
  • Enhanced quality control and yield optimization


Original Abstract Submitted

a semiconductor process device includes a chamber housing defining an internal region and a plurality of electrostatic chucks within the internal region. the chamber housing includes a window, and a light collection unit including a first optical system and a second optical system located at different positions on the window. a plurality of first optical pickup units are connected to the first optical system, and a plurality of second optical pickup units are connected to the second optical system. a sensor includes a plurality of photodetectors that are configured to convert a first optical signal transmitted by the plurality of first optical pickup units and a second optical signal transmitted by the plurality of second optical pickup units into electrical signals. a processor is configured to generate a spatial image of the internal region of the chamber housing using the electrical signals output by the plurality of photodetectors, and determine a location at which an arc occurs in the internal region of the chamber housing based on the spatial image.