18469755. APPARATUS FOR TREATING SUBSTRATE simplified abstract (SEMES CO., LTD.)

APPARATUS FOR TREATING SUBSTRATE

Organization Name

SEMES CO., LTD.

Inventor(s)

Dong-Hun Kim of Gunpo-si (KR)

Wan Jae Park of Hwaseong-si (KR)

Dong Sub Oh of Busan (KR)

Myoung Sub Noh of Hwaseong-si (KR)

Ji Hoon Park of Hwaseong-si (KR)

APPARATUS FOR TREATING SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18469755 titled 'APPARATUS FOR TREATING SUBSTRATE

Simplified Explanation

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes an electrode plate applied with a power; an ion blocker positioned at a bottom side of the electrode plate, which has a plurality of top holes formed thereon, and which is grounded; a shower head positioned at a bottom side of the ion blocker and which has a plurality of bottom holes formed thereon; and a turbulence generating unit configured to have a turbulence space therein, and which is positioned at a space between the ion blocker and the shower head, and wherein the top hole is positioned to overlap the turbulence space when seen from above, and the bottom hole is positioned at an outer side of the turbulence space, and which faces at least one of a bottom surface of the ion blocker and an outer wall of the turbulence generating unit when seen from below.

• Substrate treating apparatus with electrode plate, ion blocker, shower head, and turbulence generating unit.
• Ion blocker positioned at the bottom side of the electrode plate with top holes and grounded.
• Shower head positioned below the ion blocker with bottom holes.
• Turbulence generating unit between the ion blocker and shower head with a turbulence space.

Potential Applications

The technology can be applied in semiconductor manufacturing processes, specifically in substrate treatment and cleaning.

Problems Solved

1. Improved substrate treatment efficiency. 2. Enhanced cleaning processes in semiconductor manufacturing.

Benefits

1. Increased productivity in semiconductor manufacturing. 2. Enhanced quality control in substrate treatment. 3. Cost-effective solution for cleaning processes.

Potential Commercial Applications

Optimizing substrate treatment processes in semiconductor manufacturing for improved efficiency and quality control.

Possible Prior Art

There may be prior art related to substrate treating apparatus in semiconductor manufacturing, but specific examples are not provided in this abstract.

How does this technology compare to existing substrate treating apparatus in terms of efficiency and cost-effectiveness?

The article does not provide a direct comparison with existing technologies in the field.

What specific semiconductor manufacturing processes can benefit the most from this substrate treating apparatus?

The abstract does not specify which processes within semiconductor manufacturing can benefit the most from this technology.

Original Abstract Submitted

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes an electrode plate applied with a power; an ion blocker positioned at a bottom side of the electrode plate, which has a plurality of top holes formed thereon, and which is grounded; a shower head positioned at a bottom side of the ion blocker and which has a plurality of bottom holes formed thereon; and a turbulence generating unit configured to have a turbulence space therein, and which is positioned at a space between the ion blocker and the shower head, and wherein the top hole is positioned to overlap the turbulence space when seen from above, and the bottom hole is positioned at an outer side of the turbulence space, and which faces at least one of a bottom surface of the ion blocker and an outer wall of the turbulence generating unit when seen from below.