17849914. PHYSICAL VAPOR DEPOSITION APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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PHYSICAL VAPOR DEPOSITION APPARATUS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jaesuk Kim of Hwaseong-si (KR)

Sangwook Park of Seongnam-si (KR)

Gukrok Yun of Seoul (KR)

Kyuhee Han of Seongnam-si (KR)

PHYSICAL VAPOR DEPOSITION APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17849914 titled 'PHYSICAL VAPOR DEPOSITION APPARATUS

Simplified Explanation

The abstract describes a physical vapor deposition (PVD) apparatus that is used for depositing a material onto a substrate in a vacuum chamber. The apparatus includes various components such as a pedestal, a target, a shield, a target power supply, a magnet, and a magnetic field formation line.

  • The pedestal is located inside the vacuum chamber and is used to support the substrate.
  • The target, also located inside the vacuum chamber, contains the material that will be deposited onto the substrate.
  • The shield is positioned on the inner sidewall of the vacuum chamber to protect it from the deposition material.
  • The target power supply applies a voltage to the target, creating plasma in the vacuum chamber.
  • The magnet is designed to induce the plasma towards the target.
  • The magnetic field formation line, connected to the target power supply, surrounds the shield symmetrically and generates a magnetic field in the vacuum chamber.

Potential applications of this technology:

  • Thin film deposition: The PVD apparatus can be used for depositing thin films of various materials onto substrates, which is useful in industries such as electronics, optics, and coatings.
  • Semiconductor manufacturing: The apparatus can be utilized in the production of semiconductors, where precise deposition of materials is crucial.
  • Solar cell production: The PVD apparatus can be employed in the manufacturing of solar cells, where thin films of materials like silicon or cadmium telluride are deposited onto substrates.

Problems solved by this technology:

  • Protection of the vacuum chamber: The shield prevents the deposition material from damaging or contaminating the vacuum chamber, ensuring its longevity and efficiency.
  • Plasma control: The magnet and the magnetic field formation line help control and direct the plasma towards the target, improving the deposition process and the quality of the deposited material.

Benefits of this technology:

  • Enhanced deposition control: The use of plasma and magnetic fields allows for better control over the deposition process, resulting in more precise and uniform deposition of materials.
  • Improved efficiency: The design of the PVD apparatus ensures the protection of the vacuum chamber, reducing maintenance and downtime.
  • Higher quality deposition: The controlled plasma and magnetic fields contribute to the production of high-quality thin films with improved properties and performance.


Original Abstract Submitted

A physical vapor deposition (PVD) apparatus includes: a vacuum chamber; a pedestal arranged in the vacuum chamber and configured to support a substrate; a target arranged on the vacuum chamber and including a deposition material; a shield arranged on an inner sidewall of the vacuum chamber toprotect the vacuum chamber from the deposition material; a target power supply applying a target voltage to the target to generate plasma in the vacuum chamber; and a magnet configured to induce the plasma to the target; and a magnetic field formation line connected with the target power supply, wherein the magnetic field formation line surrounds the shield symmetrically with respect to a center of the shield to form a magnetic field in the vacuum chamber.

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