18208046. PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18208046 titled 'PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
Simplified Explanation
The substrate processing apparatus described in the patent application includes a process chamber, a plasma shutter to close the process chamber, and an upper liner on the process chamber. The upper liner has an extension liner that faces a connection inner surface extending from the passage ceiling forming the insertion passage. When the plasma shutter closes the process space, its upper end is inserted between the connection inner surface and the extension liner.
- Explanation of the patent/innovation:
- Substrate processing apparatus with a process chamber, plasma shutter, and upper liner - Upper liner includes extension liner facing connection inner surface - Plasma shutter inserted between connection inner surface and extension liner when closing process space
Potential applications of this technology: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems solved by this technology: - Contamination prevention during substrate processing - Enhanced control of plasma environment - Improved efficiency in processing
Benefits of this technology: - Higher quality substrate processing - Increased productivity - Reduced maintenance requirements
Potential commercial applications of this technology: - Semiconductor industry equipment - Thin film coating machines - Solar panel manufacturing tools
Possible prior art: - Previous substrate processing apparatus with similar components - Plasma shutters in other industrial applications
Unanswered questions: 1. How does the extension liner improve the performance of the substrate processing apparatus? 2. Are there any specific materials or manufacturing processes required for the construction of the extension liner and plasma shutter in this technology?
Original Abstract Submitted
Provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.
