20240018648. Purge Ring for Reduced Substrate Backside Deposition simplified abstract (APPLIED MATERIALS, INC.)
Contents
Purge Ring for Reduced Substrate Backside Deposition
Organization Name
Inventor(s)
Geraldine Vasquez of San Jose CA (US)
Dien-yeh Wu of San Jose CA (US)
Aixi Zhang of Sunnyvale CA (US)
Jallepally Ravi of San Ramon CA (US)
Purge Ring for Reduced Substrate Backside Deposition - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240018648 titled 'Purge Ring for Reduced Substrate Backside Deposition
Simplified Explanation
The abstract of this patent application describes embodiments of a purge ring for use in a process chamber. The purge ring has an annular body with an inner portion and an outer portion. The inner portion includes an inner surface with three inner sidewalls. The upper inner notch defines the first inner sidewall, the lower inner notch defines the second inner sidewall, and the third inner sidewall is disposed between them. The first and second inner sidewalls are positioned radially outward of the third inner sidewall.
- The purge ring is designed for use in a process chamber.
- It has an annular body with an inner portion and an outer portion.
- The inner portion includes an inner surface with three inner sidewalls.
- The first and second inner sidewalls are defined by upper and lower inner notches.
- The third inner sidewall is positioned between the first and second inner sidewalls.
- The first and second inner sidewalls are located radially outward of the third inner sidewall.
Potential applications of this technology:
- Semiconductor manufacturing processes
- Thin film deposition processes
- Plasma etching processes
Problems solved by this technology:
- Contamination control in process chambers
- Enhanced process uniformity
- Improved process efficiency
Benefits of this technology:
- Reduced particle generation
- Enhanced process control
- Increased yield and productivity
Original Abstract Submitted
embodiments of a purge ring for use in a process chamber are provided herein. in some embodiments, a purge ring includes: an annular body having an inner portion and an outer portion, wherein the inner portion includes an inner surface of the annular body, the inner surface comprising a first inner sidewall, a second inner sidewall, and a third inner sidewall, wherein the inner portion has an upper inner notch that defines the first inner sidewall and a lower inner notch that defines the second inner sidewall, wherein a third inner sidewall is disposed between the first inner sidewall and the second inner sidewall, and wherein the first inner sidewall and the second inner sidewall are disposed radially outward of the third inner sidewall.
