18372792. Selective Deposition of Thin Films with Improved Stability simplified abstract (Applied Materials, Inc.)

Selective Deposition of Thin Films with Improved Stability

Organization Name

Applied Materials, Inc.

Inventor(s)

Lulu Xiong of Singapore (SG)

Kevin Hsiao of Hsinchu (TW)

Chris Liu of Hsinchu (TW)

Chieh-Wen Lo of Hsinchu (TW)

Sean M. Seutter of San Jose CA (US)

Deenesh Padhi of Santa Clara CA (US)

Prayudi Lianto of Singapore (SG)

Peng Suo of Singapore (SG)

Guan Huei See of Singapore (SG)

Zongbin Wang of Singapore (SG)

Shengwei Zeng of Singapore (SG)

Balamurugan Ramasamy of Bangalore (IN)

Selective Deposition of Thin Films with Improved Stability - A simplified explanation of the abstract

This abstract first appeared for US patent application 18372792 titled 'Selective Deposition of Thin Films with Improved Stability

Simplified Explanation

The patent application describes a method of processing a substrate by depositing a layer in a processing chamber on different regions of a feature on the substrate, with varying hardness levels in each region.

• The method involves depositing a layer on a field region, a sidewall region, and a fill region of a feature on the substrate.
• The hardness of the layer deposited on the sidewall region is lower than the hardness of the layer deposited on the field region and the fill region.

Potential Applications

This technology could be applied in the semiconductor industry for the fabrication of advanced integrated circuits.

Problems Solved

This technology helps to control the hardness of deposited layers on different regions of a substrate, which can improve the performance and reliability of electronic devices.

Benefits

- Enhanced control over material properties - Improved device performance - Increased reliability of electronic components

Potential Commercial Applications

"Advanced Semiconductor Processing Technology for Improved Device Performance"

Possible Prior Art

There may be prior art related to methods of depositing layers on substrates with varying material properties, but specific examples are not provided in this patent application.

Unanswered Questions

How does the method of depositing layers with varying hardness levels impact the overall performance of electronic devices?

The patent application does not delve into the specific effects of the varying hardness levels on device performance.

Are there any limitations or challenges associated with implementing this method in large-scale manufacturing processes?

The patent application does not address any potential obstacles or limitations that may arise when scaling up this technology for commercial production.

Original Abstract Submitted

A method of processing a substrate is disclosed which includes depositing a layer in a processing chamber on a field region, a sidewall region, and a fill region of a feature of the substrate, wherein a hardness of a portion of the layer deposited on the sidewall region is lower than a hardness of a portion of the layer deposited on the field region, and lower than a hardness of a portion of the layer deposited on the fill region.