18211887. FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
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FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18211887 titled 'FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
Simplified Explanation
The abstract describes a substrate processing apparatus that includes a focus ring. The focus ring has a central axis, a top surface with a larger inner diameter, a bottom surface with a smaller inner diameter, and an inner lateral surface between the top and bottom surfaces. The inner lateral surface includes a first and second inner lateral surface, with the second inner lateral surface extending downward from the first inner lateral surface. The first angle between the first inner lateral surface and a line corresponding to the first direction is different from the second angle between the second inner lateral surface and the line corresponding to the first direction.
- The focus ring in the substrate processing apparatus has a unique design with a central axis, top and bottom surfaces, and an inner lateral surface.
- The inner lateral surface of the focus ring consists of a first and second inner lateral surface, with the second inner lateral surface extending downward from the first inner lateral surface.
- The first angle between the first inner lateral surface and a line corresponding to the first direction is different from the second angle between the second inner lateral surface and the line corresponding to the first direction.
Potential Applications:
- Semiconductor manufacturing: The substrate processing apparatus can be used in the production of semiconductor devices, where precise focus and alignment are crucial.
- Thin film deposition: The focus ring design can be beneficial in processes involving the deposition of thin films on substrates, ensuring uniformity and accuracy.
Problems Solved:
- Improved focus control: The unique design of the focus ring allows for better control and adjustment of the focus during substrate processing, leading to improved quality and yield.
- Enhanced substrate alignment: The different angles of the inner lateral surfaces help in aligning the substrate accurately, reducing misalignment issues and improving overall process efficiency.
Benefits:
- Higher process accuracy: The focus ring design enables more precise focus control, resulting in improved accuracy in substrate processing.
- Increased yield: By reducing misalignment issues and improving focus control, the substrate processing apparatus can enhance the yield of high-quality products.
- Cost savings: The improved process accuracy and yield can lead to cost savings by minimizing material waste and rework.
Original Abstract Submitted
A substrate processing apparatus includes a focus ring, the focus ring includes a central axis that extends in a first direction, a top surface having a first inner diameter, a bottom surface having a second inner diameter that is smaller than the first inner diameter, and an inner lateral surface between the top surface and the bottom surface, the inner lateral surface including a first inner lateral surface and a second inner lateral surface, where the second inner lateral surface extends downward from the first inner lateral surface and a first angle between the first inner lateral surface and a line corresponding to the first direction is different from a second angle between the second inner lateral surface and the line corresponding to the first direction.
