17859316. HYBRID MATCHER AND RADIO FREQUENCY MATCHING SYSTEM INCLUDING THE HYBRID MATCHER simplified abstract (Samsung Electronics Co., Ltd.)

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HYBRID MATCHER AND RADIO FREQUENCY MATCHING SYSTEM INCLUDING THE HYBRID MATCHER

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Hyosin Kim of Suncheon-si (KR)

Sungyong Lim of Seoul (KR)

Minsung Kim of Seoul (KR)

Dongyub Kim of Suwon-si (KR)

Sungyeol Kim of Yongin-si (KR)

Jongbeom Moon of Hwaseong-si (KR)

Seungbo Shim of Seoul (KR)

HYBRID MATCHER AND RADIO FREQUENCY MATCHING SYSTEM INCLUDING THE HYBRID MATCHER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17859316 titled 'HYBRID MATCHER AND RADIO FREQUENCY MATCHING SYSTEM INCLUDING THE HYBRID MATCHER

Simplified Explanation

The abstract describes a hybrid matcher and an RF matching system for precise impedance matching in RF plasma facilities. The hybrid matcher includes a matching circuit with multiple variable element-switch sets connected in parallel. It also includes a sensor to measure current and voltage of RF power, a variable element driver, a switch driver, and a controller to control the drivers.

  • The hybrid matcher is designed for high-speed and precise impedance matching in RF plasma facilities.
  • It includes a matching circuit with multiple variable element-switch sets connected in parallel.
  • Each variable element-switch set consists of a variable impedance element and a switch connected in series.
  • A sensor is placed at the front stage of the matching circuit to measure current and voltage of RF power.
  • The variable element driver drives the variable impedance element, and the switch driver drives the switch.
  • The controller controls the variable element driver and the switch driver.

Potential Applications

  • RF plasma facilities
  • Semiconductor manufacturing
  • Plasma etching processes
  • Thin film deposition

Problems Solved

  • Precise impedance matching in RF plasma facilities
  • High-speed impedance matching
  • Efficient RF power utilization

Benefits

  • Improved performance and efficiency in RF plasma processes
  • Faster processing times
  • Enhanced control over RF power
  • Reduced energy consumption


Original Abstract Submitted

Provided are a hybrid matcher capable of precisely performing impedance matching at a high speed when RF power is applied with a multi-level pulse in a facility using RF plasma, and an RF matching system including the hybrid matcher. The hybrid matcher includes a matching circuit in which a plurality of variable element-switch sets are connected to each other in parallel, the variable element-switch sets each including a variable impedance element and a switch connected to the variable impedance element in series and electrically operating therewith, a sensor disposed at a front stage of the matching circuit and configured to measure a current and a voltage of radio frequency (RF) power applied from an RF generator, a variable element driver configured to drive the variable impedance element, a switch driver configured to drive the switch, and a controller configured to control the variable element driver and the switch driver.