Samsung electronics co., ltd. (20240096606). PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract

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PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

HYUNGSIK Ko of Suwon-si (KR)

PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096606 titled 'PLASMA SHUTTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Simplified Explanation

The substrate processing apparatus described in the patent application includes a process chamber, a plasma shutter to close the process chamber, and an upper liner on the process chamber. The process chamber has a process space for substrate processing and an insertion passage connecting the process space to the outside. The upper liner includes an extension liner facing a connection inner surface that extends upwardly from the passage ceiling forming the insertion passage. When the plasma shutter closes the process space, the upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.

  • Process chamber with a process space for substrate processing
  • Plasma shutter to close the process chamber
  • Upper liner with an extension liner facing a connection inner surface
  • Insertion passage connecting the process space to the outside
  • Plasma shutter inserted between the connection inner surface and the extension liner when closed

Potential Applications

The technology described in this patent application could be applied in semiconductor manufacturing processes, such as etching, deposition, and cleaning.

Problems Solved

This technology helps in controlling the environment within the process chamber during substrate processing, ensuring the quality and consistency of the process.

Benefits

- Improved process control - Enhanced substrate processing quality - Increased efficiency and reliability in semiconductor manufacturing

Potential Commercial Applications

Optimizing Substrate Processing Environment in Semiconductor Manufacturing

Possible Prior Art

Prior art related to plasma shutters and liners in substrate processing chambers may exist, but specific examples are not provided in this patent application.

Unanswered Questions

How does this technology compare to existing substrate processing apparatus in terms of efficiency and reliability?

The efficiency and reliability of this technology compared to existing substrate processing apparatus are not explicitly discussed in the patent application.

What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?

The potential cost implications of implementing this technology in semiconductor manufacturing processes are not addressed in the patent application.


Original Abstract Submitted

provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.