18372995. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this technology compare to existing substrate processing apparatus designs in terms of particle blocking efficiency and exhaust gas flow control?
- 1.9.3 What are the potential limitations or challenges in implementing this technology in different substrate processing environments or industries?
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18372995 titled 'SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The substrate processing apparatus described in the patent application includes a chamber with an exhaust port, a substrate support, a partition member, and plate-shaped members to block particles and allow exhaust gas to pass through.
- The chamber has an exhaust port in the bottom portion.
- A substrate support is located inside the chamber.
- A partition member separates the substrate processing region from the exhaust region.
- Plate-shaped members are positioned upstream of the partition member to block particles.
- At least one plate-shaped member has a through-hole for exhaust gas to pass through, directed towards the substrate support or chamber inner surface.
Potential Applications
The technology described in this patent application could be applied in semiconductor manufacturing, thin film deposition, and other industries requiring precise substrate processing in a controlled environment.
Problems Solved
This technology helps prevent contamination of substrates during processing by blocking particles from reaching the substrate surface. It also ensures efficient exhaust of gases from the processing chamber.
Benefits
The benefits of this technology include improved substrate quality, reduced contamination risks, enhanced process control, and increased overall efficiency in substrate processing operations.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, research institutions, and companies involved in thin film coating processes.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus designs with exhaust ports and partition members, but without the specific configuration of plate-shaped members with through-holes to block particles and allow exhaust gas flow.
Unanswered Questions
How does this technology compare to existing substrate processing apparatus designs in terms of particle blocking efficiency and exhaust gas flow control?
The technology described in the patent application offers a unique approach to blocking particles and allowing exhaust gas flow in substrate processing chambers. However, a direct comparison with existing designs in terms of efficiency and control is not provided in the abstract.
What are the potential limitations or challenges in implementing this technology in different substrate processing environments or industries?
While the benefits of the technology are highlighted, the abstract does not address any potential limitations or challenges that may arise when implementing this technology in various substrate processing environments or industries.
Original Abstract Submitted
A substrate processing apparatus includes a chamber comprising an exhaust port in a bottom portion of the chamber, a substrate support disposed within the chamber, a partition member that partitions a substrate processing region from an exhaust region connected to the exhaust port, one or more plate-shaped members provided upstream of the partition member with respect to a flow of exhaust gas to the exhaust port and configured to block particles from the partition member. At least one of the one or more plate-shaped members comprises a through-hole configured to allow the exhaust gas to the exhaust port to pass therethrough, the through-hole opened to be directed to a side surface of the substrate support or to an inner surface of the chamber.
