Kioxia corporation (20240096593). PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
Contents
- 1 PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Organization Name
Inventor(s)
Toshiyuki Sasaki of Yokkaichi Mie (JP)
PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096593 titled 'PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Simplified Explanation
The abstract describes a plasma processing device with multiple direct current power supplies that can operate independently under the control of a central controller.
- The device includes a chamber, direct current power supplies in the upper portion and on a side wall of the chamber, and a controller.
- The direct current power supplies can operate individually and apply different direct current voltages independently of each other under the control of the controller.
Potential Applications
This technology could be applied in industries such as semiconductor manufacturing, solar panel production, and surface treatment processes.
Problems Solved
This innovation allows for more precise control and customization of plasma processing parameters, leading to improved efficiency and quality in various manufacturing processes.
Benefits
The ability to independently control multiple direct current power supplies in a plasma processing device can result in enhanced process flexibility, increased productivity, and higher quality output.
Potential Commercial Applications
This technology could be utilized in the production of electronic components, thin film coatings, and other high-tech manufacturing processes.
Possible Prior Art
Prior art in the field of plasma processing devices may include similar systems with multiple power supplies, but the specific configuration and control mechanism described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing plasma processing devices in terms of efficiency and cost-effectiveness?
This article does not provide a direct comparison with other plasma processing devices on the market.
What are the potential limitations or drawbacks of implementing this technology in industrial settings?
The article does not address any potential challenges or limitations that may arise when integrating this technology into existing manufacturing processes.
Original Abstract Submitted
a plasma processing device includes a chamber, a plurality of direct current power supplies, and a controller. the direct current power supplies are provided in an upper portion and on a side wall of the chamber, wherein the direct current power supplies are configured to operate individually. the controller is configured to control the direct current power supplies such that the direct current power supplies apply respective direct current voltages independent of each other.
