17981874. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Sangki Nam of Seongnam-si (KR)
Namkyun Kim of Pyeongtaek-si (KR)
Kuihyun Yoon of Yongin-si (KR)
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17981874 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The patent application describes a substrate processing apparatus and a method of manufacturing a semiconductor device using the apparatus. The apparatus includes a lower electrode assembly, an upper electrode assembly, and a plasma processing region between them. The lower electrode assembly consists of a substrate support, a coupling ring assembly, an edge ring, and at least one upper contact pad. The coupling ring assembly includes a coupling ring and a conductive side contact pad.
- The substrate processing apparatus is designed to process substrates in the manufacturing of semiconductor devices.
- The lower electrode assembly supports the substrate during processing.
- The upper electrode assembly is positioned above the lower electrode assembly.
- The plasma processing region is the space between the lower and upper electrode assemblies where plasma is generated for processing the substrate.
- The coupling ring assembly surrounds the substrate support and provides structural support.
- The edge ring is located on the coupling ring assembly and helps to confine the plasma processing region.
- The upper contact pad is conductive and makes contact with the lower surface of the edge ring, as well as either the substrate support or the coupling ring assembly.
- The conductive side contact pad is in contact with the side surface of the substrate support and the inner surface of the coupling ring.
Potential Applications
- Semiconductor device manufacturing
- Substrate processing in the electronics industry
Problems Solved
- Provides a simplified and efficient substrate processing apparatus for manufacturing semiconductor devices.
- Ensures proper contact and support of the substrate during processing.
- Helps to confine the plasma processing region for more accurate and controlled processing.
Benefits
- Improved substrate processing efficiency and accuracy.
- Enhanced structural support for the substrate during processing.
- More controlled and precise plasma processing.
Original Abstract Submitted
Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device using the same. The substrate processing apparatus includes a lower electrode assembly, an upper electrode assembly disposed on the lower electrode assembly, and a plasma processing region between the lower electrode assembly and the upper electrode assembly. The lower electrode assembly includes a substrate support supporting a substrate, a coupling ring assembly surrounding the substrate support, an edge ring on the coupling ring assembly, and at least one upper contact pad contacting a lower surface of the edge ring and contacting at least one of the substrate support and the coupling ring assembly, the at least one upper contact pad being conductive. The coupling ring assembly includes a coupling ring and a conductive side contact pad in contact with a side surface of the substrate support and an inner surface of the coupling ring.
