18166196. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Che Wei Yang of New Taipei City (TW)

Chih Cheng Shih of Kaohsiung City (TW)

Kuo Liang Lu of Hsinchu City (TW)

Yu Jiang of Taipei Ciity (TW)

Sheng-Chan Li of Tainan City (TW)

Kuo-Ming Wu of Zhubei City (TW)

Sheng-Chau Chen of Tainan City (TW)

Chung-Yi Yu of Hsin-Chu (TW)

Cheng-Yuan Tsai of Chu-Pei City (TW)

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18166196 titled 'SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

Simplified Explanation

The patent application describes systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers in a stacked-wafer assembly.

• Deposition tool with an electrode protrusion enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation.
• The enhanced electromagnetic field improves the deposition operation, allowing for sufficient deposition of supporting fill material.

Potential Applications

• Semiconductor manufacturing
• Microelectronics production
• Wafer bonding processes

Problems Solved

• Ensuring proper deposition of supporting fill material in wafer-on-wafer products
• Enhancing electromagnetic fields for more efficient fabrication processes

Benefits

• Improved deposition operation
• Enhanced wafer-on-wafer product quality
• Increased efficiency in stacked-wafer assembly fabrication

Original Abstract Submitted

Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.