Kioxia corporation (20240096607). SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
Contents
- 1 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Organization Name
Inventor(s)
Shohei Arakawa of Mie Mie (JP)
Yuta Osada of Yokkaichi Mie (JP)
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096607 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Simplified Explanation
The semiconductor manufacturing apparatus described in the abstract includes a chamber with a top plate, a holder for the substrate, a high-frequency power source, gas supply and discharge pipes, and lift pins to move the substrate away from the holder towards the top plate.
- Chamber with top plate
- Holder for substrate
- High-frequency power source
- Gas supply and discharge pipes
- Lift pins to move substrate away from holder towards top plate
Potential Applications
The technology described in this patent application could be used in the manufacturing of semiconductors, specifically in processes that require precise control over the positioning of substrates within a chamber.
Problems Solved
This technology solves the problem of accurately moving substrates within a semiconductor manufacturing chamber, allowing for more efficient and precise processing of the substrates.
Benefits
The benefits of this technology include improved control over substrate positioning, which can lead to higher quality semiconductor products and increased manufacturing efficiency.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced electronic devices such as microchips and sensors, where precise semiconductor manufacturing processes are crucial.
Possible Prior Art
One possible prior art for this technology could be similar semiconductor manufacturing apparatus with lift pins for substrate movement, but with different configurations or functionalities.
Unanswered Questions
How does this technology compare to existing semiconductor manufacturing apparatus in terms of efficiency and precision?
This article does not provide a direct comparison between this technology and existing semiconductor manufacturing apparatus in terms of efficiency and precision.
What are the potential limitations or drawbacks of using this technology in semiconductor manufacturing processes?
This article does not address any potential limitations or drawbacks of using this technology in semiconductor manufacturing processes.
Original Abstract Submitted
a semiconductor manufacturing apparatus includes: a chamber including a top plate; a holder provided in the chamber and configured to place a substrate; a high-frequency power source configured to apply high-frequency power to the holder; a gas supply pipe configured to supply a gas to the chamber; a gas discharge pipe configured to discharge a gas from the chamber; and a plurality of lift pins configured to move the substrate in a direction away from the holder to the top plate, which allows tip ends of the lift pins to move from an upper surface of the holder to a position with a first distance, wherein the first distance is equal to or greater than about 70% of a second distance between the upper surface of the holder and the top plate.
