US Patent Application 18199401. SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER simplified abstract

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SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER

Organization Name

Tokyo Electron Limited

Inventor(s)

Mohd Fairuz Bin Budiman of Miyagi (JP)

Shinya Morikita of Miyagi (JP)

Masafumi Urakawa of Boise ID (US)

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18199401 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER

Simplified Explanation

The patent application describes a substrate processing apparatus used in plasma processing.

  • The apparatus includes a plasma processing chamber and a support inside the chamber.
  • There is an inner edge ring provided around the substrate and an outer edge ring around the inner edge ring.
  • The outer edge ring overlaps with the inner edge ring and has a first alignment portion.
  • An outer edge ring electrostatic chuck is positioned facing the outer edge ring on the support.
  • A lifter is included to move the inner edge ring and/or the outer edge ring up and down.
  • The first alignment portion helps align the inner edge ring with the outer edge ring when the outer edge ring electrostatic chuck is activated and attracts the outer edge ring.


Original Abstract Submitted

There is provided a substrate processing apparatus comprising: a plasma processing chamber; a support accommodated in the plasma processing chamber; an inner edge ring provided around a substrate; an outer edge ring provided around the inner edge ring, the outer edge ring having an inner peripheral portion overlapping an outer peripheral portion of the inner edge ring when viewed from above and having a first alignment portion; an outer edge ring electrostatic chuck disposed at a position of the support, the position facing the outer edge ring; and a lifter configured to move the inner edge ring and/or the outer edge ring up and down. The inner edge ring is configured to be aligned with the outer edge ring by the first alignment portion in a state in which the outer edge ring electrostatic chuck is driven and the outer edge ring is attracted.

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