17946947. BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT simplified abstract (Applied Materials, Inc.)

BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT

Organization Name

Applied Materials, Inc.

Inventor(s)

Arun Kumar Kotrappa of Karnataka (IN)

CHANDRASHEKARA Baginagere of Bengaluru (IN)

RAMCHARAN Sundar of Tamil nadu (IN)

SEYYED Fazeli of Santa Clara CA (US)

ANANTHA Subramani of San Jose CA (US)

SIYU Zhu of Sunnyvale CA (US)

AKHIL Singhal of Portland OR (US)

PHILIP ALLAN Kraus of San Jose CA (US)

BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17946947 titled 'BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT

Simplified Explanation

The semiconductor processing tool described in the abstract is a tool used for processing semiconductors in a chamber. It includes a pedestal, a first gas feed system on one side of the pedestal, and a second gas feed system on the other side of the pedestal.

• The semiconductor processing tool includes a chamber, a pedestal, and two gas feed systems.
• The first gas feed system consists of a first exhaust line with a valve and a first source gas feed line with another valve.
• The second gas feed system includes a second exhaust line with a valve and a second source gas feed line with another valve.

Potential Applications

This technology can be used in the semiconductor industry for various processes such as etching, deposition, and cleaning of semiconductor materials.

Problems Solved

This technology helps in controlling the flow of gases in the chamber during semiconductor processing, ensuring precise and efficient processing of semiconductor materials.

Benefits

The semiconductor processing tool allows for better control and regulation of gas flow, leading to improved quality and consistency in semiconductor processing.

Potential Commercial Applications

One potential commercial application of this technology is in semiconductor manufacturing facilities for the production of electronic devices.

Possible Prior Art

One possible prior art for this technology could be similar semiconductor processing tools with gas feed systems, but with different configurations or functionalities.

Unanswered Questions

How does this technology compare to existing semiconductor processing tools in terms of efficiency and precision?

This article does not provide a direct comparison between this technology and existing semiconductor processing tools in terms of efficiency and precision.

What are the specific semiconductor processing techniques that can benefit the most from this technology?

This article does not specify the semiconductor processing techniques that can benefit the most from the use of this technology.

Original Abstract Submitted

Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, a pedestal in the chamber, and a first gas feed system on a first side of the pedestal. In an embodiment, the first gas feed system comprises a first exhaust line with a first valve to open and close the first exhaust line, and a first source gas feed line with a second valve to open and close the first source gas feed line. In an embodiment, the semiconductor processing tool further comprises a second gas feed system on a second side of the pedestal. In an embodiment, the second gas feed system comprises a second exhaust line with a third valve to open and close the second exhaust line, and a second source gas feed line with a fourth valve to open and close the second source gas feed line.