18371641. FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS simplified abstract (Applied Materials, Inc.)
Contents
- 1 FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS
Organization Name
Inventor(s)
Sankaranarayanan Ravi of Santa Clara CA (US)
Alvaro Garcia of Mountain View CA (US)
Martin Perez Guzman of Santa Clara CA (US)
Stephen D. Prouty of San Jose CA (US)
Andreas Schmid of Meyriez (CH)
FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18371641 titled 'FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS
Simplified Explanation
The abstract describes a method and apparatus for cooling a semiconductor chamber using a fluid conduit made of ceramic material.
- The semiconductor chamber component includes a powered region, a grounded region, and a fluid conduit passing through both regions.
- The fluid conduit is made of ceramic material, which helps in efficient cooling of the semiconductor chamber.
- The ceramic material ensures durability and resistance to high temperatures, making it suitable for use in semiconductor chambers.
Potential Applications
The technology can be applied in various semiconductor manufacturing processes where precise temperature control is required.
Problems Solved
1. Efficient cooling of semiconductor chambers to maintain optimal operating temperatures. 2. Durability and resistance to high temperatures, ensuring longevity of the cooling system.
Benefits
1. Improved performance and reliability of semiconductor manufacturing processes. 2. Cost-effective cooling solution with long-lasting ceramic material.
Potential Commercial Applications
"Advanced Cooling Technology for Semiconductor Chambers" can be used in semiconductor fabrication facilities to enhance productivity and reduce maintenance costs.
Possible Prior Art
There may be prior art related to cooling systems for semiconductor chambers using different materials or methods. However, the use of a fluid conduit made of ceramic material may be a novel approach in this field.
Unanswered Questions
How does the ceramic material compare to traditional cooling materials in terms of efficiency and longevity?
The article does not provide a direct comparison between ceramic material and traditional cooling materials in terms of efficiency and longevity. Further research or testing may be needed to determine the advantages of using ceramic material in semiconductor chamber cooling systems.
Are there any limitations or drawbacks to using ceramic material for cooling semiconductor chambers?
The article does not mention any limitations or drawbacks of using ceramic material for cooling semiconductor chambers. It would be beneficial to explore any potential challenges or constraints associated with this technology to have a comprehensive understanding of its applicability.
Original Abstract Submitted
A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.
