18520369. IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM simplified abstract (Applied Materials, Inc.)
Contents
- 1 IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM
Organization Name
Inventor(s)
Keith Berding of San Jose CA (US)
Blake Erickson of Gilroy CA (US)
Soumendra Barman of San Jose CA (US)
Zhaozhao Zhu of Milpitas CA (US)
IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520369 titled 'IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM
Simplified Explanation
The patent application describes a device with multiple layers deposited on its surface, including sense materials and etch materials. During an etch process, the sense materials can be detected at the surface of the device.
- The device includes a first layer with sense materials and a second layer with etch materials.
- The sense materials are deposited on different portions of the surface of the device.
- The etch materials are deposited on top of the sense materials.
- During an etch process, the sense materials can be detected at the surface of the device.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, sensors, and semiconductor components.
Problems Solved
This technology helps in detecting sense materials during the etch process, which can improve the accuracy and efficiency of manufacturing processes.
Benefits
The ability to detect sense materials at the surface of the device can lead to better quality control and yield in manufacturing processes.
Potential Commercial Applications
One potential commercial application of this technology could be in the semiconductor industry for the production of high-performance electronic devices.
Possible Prior Art
Prior art in the field of semiconductor manufacturing may include similar methods for detecting materials during processing, but the specific combination of sense and etch materials as described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing methods for detecting materials during processing?
This article does not provide a direct comparison to existing methods for detecting materials during processing. It would be interesting to see a side-by-side comparison of the effectiveness, efficiency, and cost of this technology compared to other methods.
What are the potential limitations or challenges of implementing this technology in industrial-scale manufacturing processes?
The article does not address any potential limitations or challenges of implementing this technology in industrial-scale manufacturing processes. It would be important to consider factors such as scalability, compatibility with existing equipment, and cost-effectiveness when applying this technology on a larger scale.
Original Abstract Submitted
An article includes a device, a first layer deposited on a surface of the device, and a second layer deposited on the first layer. The first layer includes a first sense material deposited on a first portion of the surface and a second sense material deposited on a second portion of the surface. The second layer includes a first etch material deposited on the first sense material and a second etch material deposited on the second sense material. Responsive to the second layer being etched during an etch process performed at a processing chamber of an electronics processing system, at least one of the first sense material or the second sense material can be detected at the surface of the device.
