18357725. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18357725 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
The patent application describes a method for processing substrates using different focus rings based on the type of treatment process involved. The method involves classifying focus rings, selecting a suitable focus ring for a specific treatment process, and using the selected focus ring for the treatment process.
- Classifying focus rings into different grades
- Selecting a specific focus ring based on the type of treatment process
- Using the selected focus ring for the substrate treatment process
Potential Applications
This technology could be applied in semiconductor manufacturing processes where different substrates require different treatment processes.
Problems Solved
This technology solves the problem of selecting the most suitable focus ring for a specific substrate treatment process, leading to improved efficiency and quality in the processing.
Benefits
- Enhanced substrate processing efficiency - Improved quality of processed substrates - Cost savings through optimized focus ring selection
Potential Commercial Applications
"Optimizing Substrate Processing with Classified Focus Rings"
Possible Prior Art
There may be prior art related to substrate processing methods using different types of equipment or tools based on the specific treatment process.
Unanswered Questions
How does the method classify focus rings into different grades?
The method does not provide specific details on the criteria used for classifying focus rings into different grades.
What are the specific types of substrate treatment processes that can benefit from this method?
The patent application does not specify the exact types of substrate treatment processes that can benefit from the use of classified focus rings.
Original Abstract Submitted
A substrate processing method includes classifying a kind of substrate treatment process in which a focus ring is used, classifying a plurality of focus rings, selecting from the classified plurality of focus rings a specific focus ring suitable for a certain substrate treatment process corresponding to the classified kind of substrate treatment process, and performing the certain substrate treatment process using the selected specific focus ring. The operation of classifying the plurality of focus rings includes classifying the plurality of focus rings into two or more grades.
