17713433. SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Yunhwan Kim of Hwaseong-si (KR)

Dougyong Sung of Seoul (KR)

Byeongsang Kim of Hwaseong-si (KR)

Youngjin Noh of Ansan-si (KR)

Namkyun Kim of Pyeongtaek-si (KR)

SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17713433 titled 'SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES

Simplified Explanation

The patent application describes a substrate processing apparatus that includes a base plate, an upper plate, a DC power supply, and a controller. The upper plate has two electrodes, a first electrode, and a second electrode, which are connected to the DC power supply through the controller. The DC power supply applies different voltages to the two electrodes.

  • The substrate processing apparatus has a base plate and an upper plate with two electrodes.
  • The DC power supply supplies power to the upper plate.
  • The controller connects the upper plate and the DC power supply.
  • The first electrode and the second electrode on the upper plate are spaced apart.
  • The first controller connects the first electrode to the DC power supply.
  • The second controller connects the second electrode to the DC power supply.
  • The DC power supply applies a different voltage to each electrode.

Potential applications of this technology:

  • Semiconductor manufacturing: The substrate processing apparatus can be used in the fabrication of semiconductor devices.
  • Thin film deposition: The different voltages applied to the electrodes can control the deposition of thin films on substrates.
  • Surface treatment: The apparatus can be used for surface modification or treatment of various materials.

Problems solved by this technology:

  • Precise control: The ability to apply different voltages to the electrodes allows for precise control over the substrate processing.
  • Uniformity: The apparatus ensures uniform processing across the substrate surface.
  • Efficiency: The use of separate controllers for each electrode improves the efficiency of the processing.

Benefits of this technology:

  • Improved performance: The precise control over the substrate processing leads to improved performance of the processed materials.
  • Enhanced productivity: The uniform processing and efficient control contribute to increased productivity.
  • Versatility: The apparatus can be used for various substrate processing applications in different industries.


Original Abstract Submitted

A substrate processing apparatus includes a base plate, an upper plate on the base plate, a DC power supply configured to supply power to the upper plate, and a controller interconnecting the upper plate and the DC power supply. The upper plate includes a first electrode, and a second electrode spaced apart from the first electrode. The controller includes a first controller interconnecting the first electrode and the DC power supply, and a second controller interconnecting the second electrode and the DC power supply. The DC power supply is configured to apply a first voltage to the first electrode via the first controller, and configured to apply a second voltage to the second electrode via the second controller. The first voltage and the second voltage are different.

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