17662107. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chin-Szu Lee of Taoyuan City (TW)
Hua-Sheng Chiu of Zhudong Town (TW)
SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 17662107 titled 'SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL
Simplified Explanation
The abstract describes a shutter disc for use in a deposition tool's processing chamber during a conditioning process. The shutter disc is designed to reduce heat transfer and thermal stresses, and it includes a wave-shaped section for this purpose. Additionally, the shutter disc has a thin-film material deposited on its backside, which creates a spacing between the inner edge of the thin-film material and the outer edge of a substrate support component. This spacing prevents material accumulation, reduces tilting due to placement errors, and minimizes heat transfer to the shutter disc.
- Shutter disc designed for use in a deposition tool's processing chamber during a conditioning process
- Wave-shaped section of the shutter disc reduces heat transfer and thermal stresses
- Thin-film material deposited on the backside of the shutter disc
- Diameter of the shutter disc creates a spacing between the thin-film material and the substrate support component
- Spacing prevents material accumulation, reduces tilting, and minimizes heat transfer to the shutter disc
Potential Applications
- Deposition tools used in various industries such as semiconductor manufacturing, optical coatings, and thin-film solar cells
Problems Solved
- Heat transfer and thermal stresses during the conditioning process
- Material accumulation between the shutter disc and the substrate support component
- Tilting of the shutter disc due to placement errors
Benefits
- Reduced heat transfer and thermal stresses on the shutter disc
- Prevention of material accumulation between the shutter disc and the substrate support component
- Minimized tilting of the shutter disc
- Improved performance and longevity of the deposition tool
Original Abstract Submitted
Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.
