18368052. VACUUM SEALING INTEGRITY OF CRYOGENIC ELECTROSTATIC CHUCKS USING NON-CONTACT SURFACE TEMPERATURE MEASURING PROBES simplified abstract (Applied Materials, Inc.)

VACUUM SEALING INTEGRITY OF CRYOGENIC ELECTROSTATIC CHUCKS USING NON-CONTACT SURFACE TEMPERATURE MEASURING PROBES

Organization Name

Applied Materials, Inc.

Inventor(s)

Sankaranarayanan Ravi of Santa Clara CA (US)

Alvaro Garcia of Mountain View CA (US)

Martin Perez Guzman of Santa Clara CA (US)

Stephen Donald Prouty of San Jose CA (US)

Andrew Antoine Noujaim of Morgan Hill CA (US)

VACUUM SEALING INTEGRITY OF CRYOGENIC ELECTROSTATIC CHUCKS USING NON-CONTACT SURFACE TEMPERATURE MEASURING PROBES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18368052 titled 'VACUUM SEALING INTEGRITY OF CRYOGENIC ELECTROSTATIC CHUCKS USING NON-CONTACT SURFACE TEMPERATURE MEASURING PROBES

Simplified Explanation

The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.

• Substrate temperature measurement apparatus with electrostatic chuck and probe assembly
• Probe assembly includes optical probe sensor and insulating sheath
• Probe target with phosphor coating for temperature measurement

Potential Applications

The technology can be used in semiconductor manufacturing processes where precise temperature control of substrates is crucial for the quality of the final product.

Problems Solved

This technology solves the problem of accurately measuring the temperature of a substrate during processing, ensuring optimal conditions for manufacturing.

Benefits

- Improved temperature measurement accuracy - Enhanced control over substrate temperature - Increased quality and yield in semiconductor manufacturing processes

Potential Commercial Applications

- Semiconductor manufacturing industry - Research and development labs for material processing

Possible Prior Art

Prior art may include similar temperature measurement devices used in semiconductor manufacturing processes, but the specific combination of features in this disclosure may be novel.

Unanswered Questions

How does the probe assembly communicate temperature data back to the control system?

The article does not specify the method of data transmission between the probe assembly and the control system.

What is the expected lifespan of the probe target with the phosphor coating?

The article does not mention the durability or longevity of the probe target with the phosphor coating.

Original Abstract Submitted

The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.