Samsung electronics co., ltd. (20240096637). SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096637 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
The patent application describes a method for processing substrates using different focus rings based on the type of treatment process required. The method involves classifying focus rings, selecting the appropriate one for a specific treatment process, and using it for the treatment.
- Classifying focus rings into different grades based on their suitability for specific substrate treatment processes.
- Selecting a specific focus ring from the classified grades for a certain treatment process.
- Performing the substrate treatment process using the selected focus ring.
Potential Applications
The technology can be applied in semiconductor manufacturing processes where different substrates require specific treatment processes for optimal results.
Problems Solved
This technology solves the problem of using the wrong focus ring for a substrate treatment process, which can lead to inefficiencies and subpar results in manufacturing processes.
Benefits
The method ensures that the most suitable focus ring is used for each substrate treatment process, leading to improved efficiency, quality, and consistency in manufacturing operations.
Potential Commercial Applications
This technology can be utilized in the semiconductor industry for processing substrates in a more precise and efficient manner, ultimately improving overall production quality and yield.
Possible Prior Art
Prior art may include methods for selecting and using different components in manufacturing processes based on specific requirements, but not specifically focused on focus rings for substrate treatment processes.
What are the specific criteria used for classifying focus rings into different grades based on their suitability for substrate treatment processes?
The specific criteria for classifying focus rings into different grades based on their suitability for substrate treatment processes are not provided in the abstract. Further details on the classification process would be needed to understand the exact criteria used.
How does the method ensure the selected focus ring is the most suitable for a certain substrate treatment process?
The abstract does not elaborate on how the method ensures the selected focus ring is the most suitable for a certain substrate treatment process. Additional information on the selection process would be necessary to understand how the method determines the best focus ring for a specific treatment process.
Original Abstract Submitted
a substrate processing method includes classifying a kind of substrate treatment process in which a focus ring is used, classifying a plurality of focus rings, selecting from the classified plurality of focus rings a specific focus ring suitable for a certain substrate treatment process corresponding to the classified kind of substrate treatment process, and performing the certain substrate treatment process using the selected specific focus ring. the operation of classifying the plurality of focus rings includes classifying the plurality of focus rings into two or more grades.
