18477047. PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
- 1 PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Yusuke Kikuchi of Yamanashi (JP)
PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18477047 titled 'PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The abstract describes a patent application for a placing table with an electrostatic chuck, a freezing device, and a power controller. The electrostatic chuck attracts and holds a substrate while being rotatable, the freezing device cools the chuck, and the power controller superimposes a radio frequency bias voltage on the chuck electrode.
- Electrostatic chuck attracts and holds substrate on a placing surface
- Chuck is rotatable
- Freezing device cools the chuck
- Power controller superimposes RF bias voltage on chuck electrode
Potential Applications
The technology described in this patent application could be used in semiconductor manufacturing, flat panel display production, and other industries where precise positioning and cooling of substrates are required.
Problems Solved
This technology solves the problem of securely holding substrates in place while also providing a cooling mechanism to prevent overheating during processing.
Benefits
The benefits of this technology include improved substrate positioning accuracy, enhanced cooling efficiency, and potentially increased productivity in manufacturing processes.
Potential Commercial Applications
- Semiconductor manufacturing equipment
- Flat panel display production machinery
- Precision engineering tools
Possible Prior Art
One possible prior art for this technology could be the use of electrostatic chucks in semiconductor manufacturing processes. However, the addition of a freezing device and power controller to superimpose an RF bias voltage may be a novel combination.
=== What are the specific industries that could benefit from this technology? Industries such as semiconductor manufacturing, flat panel display production, and precision engineering could benefit from this technology.
=== How does this technology compare to traditional substrate holding and cooling methods? This technology offers a more precise and efficient way of holding substrates in place while providing cooling, which can lead to improved manufacturing processes and product quality.
Original Abstract Submitted
There is a placing table comprising: an electrostatic chuck having a chuck electrode, wherein the electrostatic chuck is configured to attract and hold a substrate on a placing surface and to be rotatable; a freezing device having a contact surface in contact with or separated from a surface of the electrostatic chuck opposite to the placing surface and configured to cool the electrostatic chuck; and a power controller configured to superimpose a radio frequency (RF) bias voltage applied to the electrostatic chuck on a chuck voltage applied to the chuck electrode.
