18469687. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
Organization Name
Inventor(s)
Katsuhiko Yamamoto of Toyama-shi (JP)
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18469687 titled 'SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
Simplified Explanation
The patent application describes a technique involving a process chamber, an electromagnetic wave generator, and a gas supplier to supply a cooling gas to a substrate being processed.
- Process chamber for substrate processing
- Electromagnetic wave generator for supplying waves into the chamber
- Gas supplier for supplying cooling gas to the substrate by adjusting the direction of supply
Potential Applications
This technology could be applied in semiconductor manufacturing, thin film deposition, and other industries where precise control of substrate temperature is crucial.
Problems Solved
This technology solves the problem of efficiently cooling substrates during processing, which can improve the quality and consistency of the final product.
Benefits
The benefits of this technology include improved process control, enhanced product quality, and potentially increased production efficiency.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication, solar cell production, and advanced coatings for various industries.
Possible Prior Art
One possible prior art could be systems that use gas flow control for substrate cooling during processing, but the specific combination of electromagnetic wave generation and gas supply direction adjustment may be novel.
Unanswered Questions
How does the adjustment of the cooling gas direction impact the overall processing efficiency?
The article does not delve into the specific effects of adjusting the cooling gas direction on the processing efficiency of the substrate.
Are there any limitations to the types of substrates that can be processed using this technique?
The article does not mention any limitations regarding the types of substrates that can be effectively processed using this technology.
Original Abstract Submitted
There is provided a technique that includes: a process chamber in which a substrate is processed; an electromagnetic wave generator configured to supply an electromagnetic wave into the process chamber; and a gas supplier through which a cooling gas is supplied to the substrate by adjusting a direction of supplying the cooling gas.
